Infineon Technologies CY7C1568V18-400BZXC
- Part No.:
- CY7C1568V18-400BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1568V18-400BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1568V18 from Cypress Semiconductor is a 72-Mbit synchronous pipelined SRAM with DDR-II+ architecture, configured as 4M × 18, operating at 400 MHz with 2.5-cycle read latency and HSTL I/O. It delivers 800 MT/s effective data rate via double-data-rate transfers synchronized to K/K clocks and uses echo clocks (CQ/CQ) for precise high-speed data capture in burst-2 memory subsystems. It is deployed in network packet buffers and FPGA co-processor caches requiring deterministic low-latency access.
For engineers reviewing the CY7C1568V18 datasheet, CY7C1568V18 pinout, CY7C1568V18 application, or CY7C1568V18 equivalent, key selection criteria include 4M × 18 organization, 1.8V core / 1.4–1.8V I/O supply range, JTAG 1149.1 test port support, DLL-enabled timing alignment, and 165-ball FBGA (15 × 17 mm) mechanical compatibility.
Technical Context
The CY7C1568V18 implements a synchronous pipelined architecture where all address, control, and data signals are registered on rising edges of complementary K and K clocks. Its internal 2M × 18 dual-array structure enables burst-2 sequential reads/writes per access, with each transaction delivering two 18-bit words aligned to alternating K/K edges.
It integrates a Delay Lock Loop (DLL) for sub-cycle output skew control, echo clocks CQ/CQ phase-aligned to K/K for receiver-friendly data capture, and QVLD to indicate valid output timing. Write operations use on-chip self-timed logic, while ZQ pin enables dynamic output impedance calibration to match system bus termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 organization) |
| Maximum Clock Frequency | 400 MHz - defines maximum sustained bandwidth of 14.4 GB/s (18-bit × 800 MT/s) |
| Read Latency | 2.5 clock cycles - determines minimum time from LD assertion to first valid Q[17:0] word |
| Core Supply Voltage | 1.8 V ± 0.1 V - powers SRAM array and internal logic; strict tolerance required for timing stability |
| I/O Supply Range | 1.4 V to VDD (1.8 V) - supports HSTL Class I/II signaling with variable drive strength |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count, high-speed memory placement |
| Interface Standard | DDR-II+ - extends DDR-I with echo clocks, QVLD, and DLL for >333 MHz operation |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free option available).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; inputs sampled on K/K rising edges during writes; outputs driven on K/K rising edges during reads with QVLD synchronization |
| K, K | Complementary input clocks | Primary timing references for all synchronous operations; K initiates transactions, both edge-trigger register transfers |
| CQ, CQ | Output echo clocks | Free-running, DLL-aligned clocks phase-matched to Q[17:0] output edges-eliminates board-level routing skew for capture ICs |
| QVLD | Valid data indicator | Active-HIGH signal edge-aligned to CQ/CQ; asserts precisely when Q[17:0] contains stable, valid read data |
| BWS[1:0] | Byte write select inputs | Active-LOW controls which 9-bit byte (BWS0 = D[8:0], BWS1 = D[17:9]) is written during each half-burst cycle |
| LD | Load strobe | Sampled on K rising edge; initiates address latching and defines start of burst-2 transaction sequence |
| ZQ | Impedance calibration reference | Connects to external 240 Ω resistor to GND; calibrates CQ/CQ/Q[17:0] output driver impedance to 0.2 × RQ = 48 Ω |
| DOFF | DLL disable control | Active-LOW; disables DLL to revert to DDR-I mode (max 167 MHz); used for compatibility or power-down |
Key Features
| Feature | Design Value |
|---|---|
| Burst-2 DDR-II+ interface | Reduces address bus toggling by 50% vs. single-word SRAM; doubles effective throughput without increasing clock frequency |
| Echo clock synchronization (CQ/CQ) | Removes need for board-level trace length matching between clock and data lines-simplifies PCB layout for >400 MHz operation |
| On-die Delay Lock Loop (DLL) | Compensates for process/voltage/temperature drift to maintain < ±75 ps output-to-clock skew across full operating range |
| QVLD timing indicator | Provides unambiguous, edge-aligned flag for valid data capture-enables reliable latch timing in FPGA or ASIC receivers |
| HSTL Class I/II compatible I/O | Supports 1.4–1.8 V VDDQ with programmable drive strength-interoperates with Stratix IV, Virtex-6, and ASIC memory controllers |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
|
Use Scenario: Line-rate buffering of 10G Ethernet frames in ingress/egress pipelines of telecom switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory between MAC and traffic manager ASICs using burst-2 DDR-II+ protocol. Use Value: 2.5-cycle latency and echo clocks enable deterministic 400 MHz read/write cycles-reducing buffer stall probability by >3× vs. asynchronous SRAM. |
Use Scenario: Real-time data staging between FPGA fabric and external DDR3 controller in radar signal processing systems. IC Role / Device Role / Timing Role: Synchronous scratchpad memory for FFT coefficient storage and intermediate result exchange with pipeline stages. Use Value: QVLD + CQ alignment allows FPGA logic to capture full 18-bit words with single-cycle setup/hold margin-eliminating metastability risk at 400 MHz. |
| Telecom Baseband Processing | Industrial Motion Control Buffer |
|
Use Scenario: Interleaved symbol storage in LTE eNodeB baseband units handling multi-carrier OFDMA scheduling. IC Role / Device Role / Timing Role: Burst-accessed memory for channel estimation and precoding matrix lookup tables accessed by DSP cores. Use Value: DLL-calibrated output timing ensures <100 ps jitter on Q[17:0]-meeting 3GPP TS 36.104 EVM requirements for 64-QAM transmission. |
Use Scenario: Deterministic position/velocity history buffer in servo drive controllers synchronizing to 10 kHz PWM cycles. IC Role / Device Role / Timing Role: Time-stamped motion profile storage accessible by real-time ARM Cortex-R5 core with guaranteed sub-20 ns access jitter. Use Value: 1.8 V core + HSTL I/O reduces switching noise coupling into analog feedback paths-improving encoder resolution stability by 12-bit ENOB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36256A-15JIN | 512K × 36 QDR SRAM, 15 ns access, 3.3 V only, no DLL or echo clocks | Lacks DDR-II+ features; requires external clock forwarding and manual skew compensation | Choose only if legacy 3.3 V system design prohibits voltage translation and bandwidth ≤ 600 MB/s suffices |
| IS61WV102418BLL-10BLI | 1M × 18 sync SRAM, 10 ns latency, 3.3 V/2.5 V, single-data-rate, no burst or echo clocks | Half the density, no DDR timing; suitable only for non-pipelined, low-throughput control buffers | Select only for cost-sensitive industrial PLCs where 400 MHz timing and burst efficiency are unnecessary |
Compared with AS7C36256A-15JIN and IS61WV102418BLL-10BLI, CY7C1568V18 uniquely delivers 72-Mbit density with DLL-aligned echo clocks and QVLD-enabling reliable 800 MT/s operation in FPGA-ASIC memory interconnects where timing closure is otherwise unattainable.
Availability
CY7C1568V18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, telecom baseband processing, and industrial motion control applications requiring stable component supply and long-term production continuity.
Supply support for CY7C1568V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems, with headquarters in San Jose, CA.
CY7C1568V18 belongs to Cypress's DDR-II+ SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in FPGA-ASIC co-processing architectures where traditional QDR or asynchronous SRAM fails to meet timing closure.
FAQ
What is the function of the DOFF pin on CY7C1568V18?
The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device reverts to DDR-I timing mode with maximum 167 MHz operation and relaxed setup/hold margins. For full DDR-II+ performance at 400 MHz, DOFF must be pulled HIGH via ≤10 kΩ resistor to VDDQ.
How does the ZQ pin affect output impedance calibration?
ZQ connects to a 240 Ω resistor to ground, enabling the device to calibrate its CQ, CQ, and Q[17:0] output drivers to 48 Ω (0.2 × 240 Ω). This matches standard HSTL-18 bus impedance, minimizing reflections and ensuring signal integrity at 800 MT/s. Leaving ZQ floating or tying to GND invalidates calibration.
Can CY7C1568V18 operate with only the K clock (not K)?
No. The CY7C1568V18 requires both K and K clocks for all synchronous operations. K initiates transactions and latches addresses/control; K captures second-half write data and drives second-word read output. Omitting K violates timing specifications and causes functional failure.
What is the purpose of the QVLD signal in system-level timing?
QVLD is a dedicated, edge-aligned indicator that asserts precisely when Q[17:0] data is valid and stable-synchronized to CQ/CQ rising edges. It eliminates reliance on fixed delay assumptions, allowing receivers (e.g., FPGA IDELAYCTRL) to dynamically gate data capture with zero timing margin uncertainty.
CY7C1568V18-400BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1568V18-400BZXC FAQ
1.How can I place an order for CY7C1568V18-400BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1568V18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1568V18-400BZXC reliable?
The price and inventory of CY7C1568V18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1568V18-400BZXC is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1568V18-400BZXC transactions.
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CY7C1568V18-400BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1568V18-400BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1568V18-400BZXC?
For technical support, including CY7C1568V18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1568V18-400BZXC requirements.
6.How does Aetrix verify that CY7C1568V18-400BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1568V18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1568V18-400BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1568V18-400BZXC?
All CY7C1568V18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1568V18-400BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1568V18-400BZXC part is unused and in its original packaging.
Return procedure for CY7C1568V18-400BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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