Infineon Technologies CY7C1570KV18-400BZXC

Overview

CY7C1570KV18-400BZXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous DDR II+ SRAM with 2.5-cycle read latency, 400 MHz clock operation, HSTL I/O interface, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers 1100 MT/s effective data rate via double-data-rate transfers on K/K clocks and integrates echo clocks (CQ/CQ) and QVLD for precise high-speed data capture in memory subsystems of network switches and baseband processors.

For engineers reviewing the CY7C1570KV18-400BZXC datasheet, CY7C1570KV18-400BZXC pinout, CY7C1570KV18-400BZXC application, or CY7C1570KV18-400BZXC equivalent, this page provides verified functional identity, validated pin roles, confirmed timing behavior under DOFF-controlled PLL modes, and real-world deployment context for burst-mode DDR SRAM selection.

Technical Context

The device implements a pipelined synchronous architecture where address and control inputs (A[19:0], R/W, LD, BWS[3:0]) are registered on the rising edge of K only, while write data (DQ[35:0]) is latched on both K and K rising edges. Read data is driven synchronously on both K and K edges with 2.5-cycle latency when DOFF = HIGH, enabling deterministic placement relative to echo clocks CQ/CQ.

Its internal organization comprises two 1M × 36 arrays, supporting two-word burst reads/writes per access. The integrated PLL ensures accurate data-eye alignment; disabling it via DOFF = LOW reverts operation to DDR I mode (1-cycle latency, ≤167 MHz), confirmed by functional truth tables and AC timing diagrams in Rev. *R datasheet.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Compared with AS7C362000B-400BIN and IS45S32800J-400BLI, CY7C1570KV18-400BZXC uniquely combines burst-aligned DDR II+ timing, integrated echo clocks, and QVLD for deterministic data capture-making it optimal for latency-critical, controller-light memory subsystems.

Availability

CY7C1570KV18-400BZXC is available at Aetrix Electronics and suitable for telecom line cards, high-speed packet buffers, baseband processing units, and test equipment memory subsystems requiring stable component supply, long-lifecycle assurance, and consistent FBGA packaging.

Supply support for CY7C1570KV18-400BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing predictability.

CY7C1570KV18 belongs to the QDR II+/DDR II+ SRAM product line, engineered specifically for deterministic, low-latency burst memory access in high-speed communications infrastructure where clock alignment and data validity timing are critical.

FAQ

What is the function of the DOFF pin on CY7C1570KV18-400BZXC?

The DOFF pin controls the internal PLL: when pulled HIGH, the device operates in DDR II+ mode with 2.5-cycle read latency and full 400 MHz capability; when pulled LOW, it reverts to DDR I mode with 1-cycle latency and maximum 167 MHz operation. This dual-mode flexibility allows backward compatibility with legacy controllers while enabling performance scaling in new designs.

How does the ZQ pin affect output drive strength?

The ZQ pin connects to an external resistor (RQ) tied to ground, enabling on-die impedance calibration. The device sets its HSTL output drivers to 0.2 × RQ, matching PCB trace impedance for optimal signal integrity. If ZQ is tied directly to VDDQ, minimum output impedance is enabled-useful for short-trace, low-noise environments but not recommended for long, lossy lines.

Can CY7C1570KV18-400BZXC be used in depth-expanded configurations?

Yes-the device supports seamless depth expansion via automatic tristate behavior: upon deselection, outputs are disabled after the next rising edge of K, eliminating bus contention between stacked devices. No external bus transceivers or arbitration logic are required, simplifying multi-chip memory banks in packet-processing engines.

What is the role of QVLD in system timing design?

QVLD is an edge-aligned valid-data strobe synchronized to CQ/CQ, indicating precisely when DQ[35:0] contains stable, readable data. Unlike clock-based assumptions, QVLD removes setup/hold uncertainty at the receiver-enabling reliable capture even with board-level skew, and eliminating need for manual timing margin allocation in FPGA-based controllers.