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Infineon Technologies CY7C1612KV18-250BZXC

Part No.:
CY7C1612KV18-250BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1612KV18-250BZXC.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,952

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Product details

Overview

CY7C1612KV18-250BZXC from Infineon Technologies (formerly Cypress) is an 8M × 18, 144-Mbit QDR® II synchronous SRAM with two-word burst architecture, 250 MHz maximum clock frequency (400 ps cycle time), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports, echo clocks (CQ/CQ), and PLL-based timing control for high-speed networking buffers and packet memory in telecom infrastructure.

For engineers reviewing the CY7C1612KV18-250BZXC datasheet, CY7C1612KV18-250BZXC pinout, CY7C1612KV18-250BZXC application, or CY7C1612KV18-250BZXC equivalent, key selection criteria include its 1.8 V core/1.4–1.8 V I/O dual-supply operation, 165-ball FBGA package (15 × 17 × 1.4 mm), 1-cycle vs. 1.5-cycle read latency selectability via DOFF, and JTAG 1149.1 compliance for boundary-scan testability.

Technical Context

This QDR II SRAM implements a true dual-port architecture with physically independent read and write data paths-no bus turnaround required-enabling concurrent read and write operations at full bandwidth. Its internal address latching uses alternating rising edges of K/K clocks, and output data is synchronized to C/C clocks with echo-clock support for precise source-synchronous capture.

The device integrates a Phase-Locked Loop (PLL) for accurate data placement and jitter reduction, supports byte-write masking via four BWS inputs (BWS[1:0] active for ×18 configuration), and provides programmable impedance calibration (ZQ pin) for signal integrity optimization across high-speed PCB interconnects.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 144 Mbit (8M × 18 organization)
Max Clock Frequency 250 MHz (400 ps cycle time); enables 720 MT/s effective data rate per port
Core Supply Voltage 1.8 V ± 0.1 V; defines minimum power rail stability requirement for internal logic and array
I/O Supply Range 1.4 V to 1.8 V; supports interoperability with 1.5 V or 1.8 V system I/O domains
Read Latency Selectable: 1 cycle (DOFF = low) or 1.5 cycles (DOFF = high); determines timing margin for first valid read data
Package 165-ball FBGA (15 × 17 × 1.4 mm); fine-pitch ball grid array with 0.8 mm pitch, RoHS-compliant
JTAG Support IEEE 1149.1 compliant TAP controller; enables boundary-scan testing and in-system programming verification

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data sampled on rising edge of K clock; used only when WPS is asserted
Q[17:0] Synchronous read data output 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS is deasserted
WPS Write port select (active low) Enables write transaction; deassertion ignores D[17:0] and pending writes
RPS Read port select (active low) Initiates read burst; deassertion allows completion then tristates Q[17:0] on next C edge
BWS[1:0] Byte write select (active low) BWS0 controls D[8:0], BWS1 controls D[17:9]; enables partial-word writes without read-modify-write
K / K Positive/negative input clocks Used for address and control sampling; K only used for rising-edge-triggered latching
C / C Positive/negative output clocks Source-synchronous read data strobes; deskew flight time mismatches across multi-device systems
CQ / CQ Echo clocks Replicated C/C outputs for receiver-side clock recovery; reduce setup/hold uncertainty in high-speed capture
DOFF Read latency mode select High = 1.5-cycle latency (QDR II mode); low = 1-cycle latency (QDR I compatibility mode)
ZQ Impedance calibration reference Connects to external 240 Ω resistor to ground for HSTL output driver calibration

Key Features

Feature Design Value
Separate read/write data ports Eliminates bus turnaround overhead; enables full-duplex memory access at peak bandwidth
Two-word burst architecture Each access transfers two consecutive words; reduces address overhead and improves throughput efficiency
DDR interfaces on both ports 720 MT/s effective data rate per port at 250 MHz clock; doubles bandwidth versus single-data-rate
Programmable read latency (DOFF) Supports migration between QDR I (1-cycle) and QDR II (1.5-cycle) timing models in same hardware
HSTL Class I output drivers Matched impedance, fast edge rates, and ZQ calibration ensure signal integrity up to 720 MHz data rates
JTAG 1149.1 boundary scan Enables automated PCB test coverage for interconnects and solder joint integrity in dense routing layouts

Applications

Network Packet Buffering Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 Ethernet switches operating at 10 Gbps+ line rates.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as non-blocking buffer memory with concurrent read (forwarding decision) and write (packet arrival) operations.

Use Value: 250 MHz clock + DDR interface delivers 3.6 GB/s aggregate bandwidth, meeting strict latency budgets for cut-through switching.

Use Scenario: Interfacing with SerDes-based switch fabric controllers requiring low-latency, high-throughput memory for cell/packet reordering.

IC Role / Device Role / Timing Role: High-speed shared memory resource accessed simultaneously by multiple fabric ingress/egress engines.

Use Value: Separate RPS/WPS controls and BWS[1:0] enable independent port arbitration and byte-granular writes without contention.

Telecom Line Card Memory Baseband Processing Buffer

Use Scenario: Buffering time-division multiplexed (TDM) voice/data streams in carrier-grade DSLAMs and OLTs.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access timing for real-time traffic shaping and jitter buffering.

Use Value: 1-cycle read latency mode (DOFF = low) ensures sub-4 ns read response, critical for TDM frame alignment.

Use Scenario: Temporary storage of FFT/IFFT coefficients and channel estimation results in LTE/5G baseband processors.

IC Role / Device Role / Timing Role: Low-jitter, high-bandwidth memory interfacing directly with DSP or FPGA fabric via source-synchronous C/C clocks.

Use Value: Echo clocks (CQ/CQ) and PLL synchronization minimize timing skew, enabling reliable capture at 720 MT/s in FPGA-based receivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1612KV18-300BZXC Higher max clock (300 MHz); 10% higher bandwidth; increased I/O supply current (910 mA vs. 800 mA @ 250 MHz) Requires tighter power delivery and thermal management; suitable for bandwidth-constrained designs where 250 MHz is insufficient Select if system clock domain operates ≥275 MHz and board layout supports higher current density
AS7C33256PFS-250BIN Asynchronous SRAM; no DDR/QDR architecture; 25 ns access time; single-port; 3.3 V only Lacks concurrent read/write capability and echo clock support; incompatible with QDR protocol stack and timing constraints Only viable for legacy redesigns where QDR functionality is not required and latency tolerance >25 ns exists

Compared with CY7C1612KV18-250BZXC, the -300BZXC variant offers higher bandwidth at the cost of greater power and layout complexity, while the AS7C33256PFS-250BIN is functionally incompatible due to its asynchronous, single-port architecture and absence of QDR-specific timing controls.

Availability

CY7C1612KV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, and telecom line card memory requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for industrial and communications equipment.

Supply support for CY7C1612KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, memory solutions, and security ICs with over 40 years of industrial reliability focus.

This device belongs to Infineon's QDR II SRAM product line-designed specifically for high-bandwidth, low-latency memory subsystems in networking, telecommunications, and high-performance computing where deterministic dual-port access is mandatory.

FAQ

What is the function of the DOFF pin on CY7C1612KV18-250BZXC?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted high, it configures the device for QDR II operation with 1.5-cycle latency; when low, it enables QDR I compatibility mode with 1-cycle latency. This setting is sampled synchronously on the rising edge of the K clock during initialization and remains latched until reset or power cycle.

Can CY7C1612KV18-250BZXC operate with only a single clock domain (K only)?

Yes-it supports single-clock mode where both read and write operations use the K clock exclusively. In this mode, C and C clocks are unused, and output data is clocked by K and K instead. However, echo clocks (CQ/CQ) and C/C deskew benefits are forfeited, limiting maximum reliable data rate in high-speed PCB layouts.

How many byte write select (BWS) signals are active in the ×18 configuration?

In the CY7C1612KV18-250BZXC (×18), two BWS inputs are active: BWS0 controls D[8:0] and BWS1 controls D[17:9]. Both are sampled on the rising edge of K/K during write operations. Asserting either low disables its corresponding 9-bit byte; deasserting both enables full 18-bit writes.

Is the ZQ pin required for normal operation?

Yes-the ZQ pin must be connected to a 240 Ω resistor to ground for HSTL output driver impedance calibration. Without this connection, output drive strength and termination matching degrade, increasing signal reflection and timing uncertainty-especially above 400 MT/s. Calibration occurs automatically at power-up and can be retriggered via JTAG.

CY7C1612KV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
144Mbit
Memory Organization:
8M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1612KV18-250BZXC FAQ

1.How can I place an order for CY7C1612KV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1612KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1612KV18-250BZXC reliable?

The price and inventory of CY7C1612KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1612KV18-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1612KV18-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1612KV18-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1612KV18-250BZXC?

CY7C1612KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1612KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1612KV18-250BZXC?

For technical support, including CY7C1612KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1612KV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1612KV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1612KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1612KV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1612KV18-250BZXC?

All CY7C1612KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1612KV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1612KV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1612KV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1612KV18-250BZXC Tags

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