Infineon Technologies CY7C1612KV18-300BZXC

Overview

CY7C1612KV18-300BZXC from Infineon Technologies (formerly Cypress) is a 8M × 18, 144-Mbit QDR® II synchronous SRAM with two-word burst architecture, 300 MHz clock frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports (600 Mbps effective data rate), echo clocks (CQ/CQ), and PLL-based timing control - deployed in high-speed networking line cards for packet buffering.

For engineers reviewing the CY7C1612KV18-300BZXC datasheet, CY7C1612KV18-300BZXC pinout, CY7C1612KV18-300BZXC application, or CY7C1612KV18-300BZXC equivalent, key selection criteria include dual-port concurrency, 1.5-cycle read latency (DOFF = high), HSTL-18 I/O compatibility, 165-ball FBGA (15 × 17 mm) package, and JTAG 1149.1 test support.

Technical Context

This QDR II SRAM implements fully independent read and write ports sharing a multiplexed address bus, with address latching on alternate rising edges of K/K clocks. Read and write operations are pipelined and self-timed, enabling concurrent access without bus turnaround.

The device uses dual output clocks (C/C) and echo clocks (CQ/CQ) to compensate for board-level skew, while its internal PLL ensures precise data placement relative to clock edges. DOFF pin selects between 1-cycle (low) and 1.5-cycle (high) read latency modes, directly affecting system timing margin and pipeline depth.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXC suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with CY7C1612KV18-250BZXC, the -300BZXC delivers +20% bandwidth and tighter timing control but requires stricter power delivery and layout; versus AS7C3256A-15JCIN, it enables true concurrent data-path buffering but demands full DDR timing closure and JTAG-aware test infrastructure.

Availability

CY7C1612KV18-300BZXC is available at Aetrix Electronics and suitable for network packet buffering, switch fabric interface, and telecom line card memory requiring stable component supply, long-term lifecycle assurance, and qualified industrial temperature grade (-40°C to +85°C).

Supply support for CY7C1612KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the QDR II SRAM portfolio under its High Performance Memory product line, delivering reliability-focused solutions for infrastructure and industrial applications.

CY7C1612KV18 belongs to Infineon's QDR® II family - engineered specifically for deterministic, low-latency, high-throughput buffering in packet-switched networks, telecom equipment, and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1612KV18-300BZXC?

The DOFF (Data Output OFFset) pin selects read latency mode: when high, it enables 1.5-cycle latency (QDR II mode), aligning output data with the second rising edge of C/C after address assertion; when low, it configures 1-cycle latency (QDR I compatibility). This setting directly affects controller pipeline depth and must be fixed at power-up.

Can CY7C1612KV18-300BZXC operate with only a single clock (K) instead of differential K/K?

Yes - the device supports single-clock mode where K serves as both read and write address clock, and C/C are used for output timing. In this mode, K replaces K for write address latching, and all synchronous inputs reference K only. However, differential K/K is required to achieve full 300 MHz performance and minimize jitter-induced timing violations.

How does the ZQ pin function in CY7C1612KV18-300BZXC?

ZQ is a dedicated pin for external reference resistor connection (typically 240 Ω to VSSQ) enabling on-die impedance calibration of HSTL output drivers. This calibration compensates for process/voltage/temperature variations, ensuring consistent 25 Ω or 50 Ω driver impedance and maintaining signal integrity across voltage rails and temperature ranges.

Is CY7C1612KV18-300BZXC pin-compatible with other QDR II devices in the same package?

Yes - CY7C1612KV18-300BZXC shares identical 165-ball FBGA pinout with CY7C1625KV18 and CY7C1614KV18 variants. Address, data, clock, and control pins occupy identical ball positions; only memory depth and width differ (8M×18 vs. 16M×9 vs. 4M×36), allowing drop-in replacement in board designs with appropriate firmware configuration.