Infineon Technologies CY7C1612KV18-333BZC

Overview

CY7C1612KV18-333BZC from Infineon Technologies (formerly Cypress) is a 8M × 18, 144-Mbit QDR® II SRAM with two-word burst architecture, 333 MHz clock frequency, 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers 720 Mbps DDR data transfer on independent read/write ports and supports concurrent transactions in high-speed networking buffers, packet classification engines, and FPGA-based protocol accelerators.

For engineers reviewing the CY7C1612KV18-333BZC datasheet, CY7C1612KV18-333BZC pinout, CY7C1612KV18-333BZC application, or CY7C1612KV18-333BZC equivalent, key selection criteria include its 333 MHz operation with 1.5-cycle read latency (DOFF = high), 165-ball FBGA package, HSTL-compatible outputs, echo clocks (CQ/CQ), and JTAG 1149.1 test access port for system-level validation.

Technical Context

This QDR II SRAM implements fully synchronous, pipelined memory access with physically separate read and write data paths-eliminating bus turnaround overhead. Its dual-clock domain uses K/K for address/data capture and C/C for output timing, enabling precise DDR edge alignment and skew compensation via echo clocks.

The device integrates a PLL for accurate internal data placement, supports depth expansion via RPS/WPS and BWS[1:0] controls, and provides full data coherency through synchronous self-timed writes. It operates in single-clock mode (K = C) or dual-clock mode (independent K/C domains), with configurable DOFF pin selecting between 1-cycle (DOFF = low) and 1.5-cycle (DOFF = high) read latency.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1612KV18-300BZC, the -333BZC offers 11% higher bandwidth and tighter timing margins; versus AS7C3256A-15JCIN, it provides architecturally distinct concurrent access, DDR signaling, and echo-clock timing-making it irreplaceable in high-speed data-path applications.

Availability

CY7C1612KV18-333BZC is available at Aetrix Electronics and suitable for network packet buffering, FPGA-based protocol acceleration, and telecom baseband processing requiring stable component supply across multi-year production cycles.

Supply support for CY7C1612KV18-333BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and communications markets.

CY7C1612KV18-333BZC belongs to Infineon's QDR II SRAM product line, designed specifically for high-bandwidth, low-latency data-path buffering in networking infrastructure and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1612KV18-333BZC?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted high, it enables QDR II mode with 1.5-cycle latency for optimized burst efficiency; when low, it reverts to QDR I compatibility mode with 1-cycle latency. This setting is sampled synchronously on the K clock edge at power-up or during reset and remains latched until next reset.

Can CY7C1612KV18-333BZC operate with only one clock signal?

Yes-it supports single-clock mode where K is used for both address/data capture and output timing (C = K, C = K). In this mode, echo clocks (CQ/CQ) remain functional for deskewing, but the device loses independent read/write timing flexibility. All timing parameters shift to align with the single clock domain, and maximum frequency may be limited by combined path constraints.

How does the ZQ pin enable impedance calibration?

The ZQ pin connects to an external 240 Ω precision resistor to ground, allowing the device to calibrate internal output driver impedance to match PCB trace impedance (typically 50 Ω single-ended or 100 Ω differential). Calibration occurs automatically at power-up and can be triggered manually via JTAG instruction, ensuring consistent signal integrity across voltage/temperature variations.

Is JTAG boundary scan supported on CY7C1612KV18-333BZC?

Yes-the device implements full IEEE 1149.1 JTAG functionality with TCK, TMS, TDI, and TDO pins. It supports mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional ones (IDCODE, CLAMP, HIGHZ), enabling interconnect testing, I/O pin state verification, and in-system programming of configuration registers without requiring additional test fixtures.