Infineon Technologies CY7C1612KV18-360BZXC
- Part No.:
- CY7C1612KV18-360BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1612KV18-360BZXC.pdf
- Description:
- IC SRAM 144MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,330
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Product details
Overview
CY7C1612KV18-360BZXC from Infineon Technologies (formerly Cypress) is a 144-Mbit QDR® II SRAM with 8M × 18 organization, 360 MHz clock frequency, 1.8 V core supply, 1.4–1.8 V I/O supply, and 165-ball FBGA (15 × 17 × 1.4 mm) package. It delivers 720 MT/s DDR throughput on independent read/write ports for high-speed packet buffering in network switches and routers.
For engineers reviewing the CY7C1612KV18-360BZXC datasheet, CY7C1612KV18-360BZXC pinout, CY7C1612KV18-360BZXC application, or CY7C1612KV18-360BZXC equivalent, key selection criteria include QDR II two-word burst timing, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, echo clock (CQ/CQ) support for source-synchronous capture, and HSTL-18-compatible output drive strength.
Technical Context
This QDR II SRAM implements fully independent synchronous read and write ports sharing a multiplexed address bus, with separate K/K clocks for write address/data latching and C/C clocks for read data output timing. Its PLL ensures precise data placement relative to echo clocks, enabling reliable 720 MHz data transfer at 360 MHz clock frequency.
The device supports depth expansion via RPS/WPS and byte-write control through BWS[1:0], maintains full data coherency across concurrent transactions, and operates with 1.5-cycle read latency when DOFF = HIGH or 1-cycle latency when DOFF = LOW-matching legacy QDR I timing when required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 144 Mbit (8M × 18) |
| Max Clock Frequency | 360 MHz - enables 720 MT/s DDR bandwidth per port |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - configurable for system timing alignment |
| Core Supply Voltage | 1.8 V ± 0.1 V - defines minimum power rail stability requirement |
| I/O Supply Range | 1.4 V to 1.8 V - supports HSTL-18 and compatible 1.5 V interfaces |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-density routing |
| Burst Length | Two-word burst - fixed per access, eliminating variable-length latency uncertainty |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; supports byte-write via BWS[1:0] |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS inactive |
| RPS | Read port select | Active-low signal enabling read operations; sampled on rising edge of K clock |
| WPS | Write port select | Active-low signal enabling write operations; sampled on rising edge of K clock |
| BWS[1:0] | Byte write select | Two active-low signals controlling D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word writes |
| C, C | Read data output clocks | Differential pair used to clock Q[17:0]; minimizes skew between devices in multi-chip systems |
| CQ, CQ | Echo clocks | Output-referenced clocks synchronized to Q[17:0] edges; simplify receiver capture timing |
| K, K | Write address/data clocks | Differential pair latching A[21:0] and D[17:0]; only rising edges used for synchronization |
| DOFF | Read latency mode control | High = 1.5-cycle latency (QDR II mode); Low = 1-cycle latency (QDR I compatibility mode) |
| VDD, VDDQ, VSS | Power and ground terminals | VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; dedicated VSS balls per bank reduce noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Eliminates bus turnaround overhead; enables true concurrent access without arbitration delay |
| Two-word burst architecture | Fixed-length burst ensures deterministic latency and simplifies controller FIFO management |
| Echo clock outputs (CQ/CQ) | Provides source-synchronous timing reference for high-speed FPGA/ASIC receivers at 720 MT/s |
| Configurable read latency (DOFF) | Enables drop-in replacement for QDR I designs or optimization for new QDR II timing margins |
| HSTL-18 compatible I/O | Meets JEDEC HSTL Class I specifications for 1.8 V operation; supports 1.5 V VDDQ for mixed-voltage systems |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Line-rate buffering of 10G/25G Ethernet frames in switch fabric ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM serving as ingress/egress packet memory with zero-turnaround concurrent read/write. Use Value: 720 MT/s per port sustains full-duplex line rate without backpressure; echo clocks enable reliable capture in FPGA-based traffic managers. |
Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE). IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to high-speed DAC/ADC controllers. Use Value: Independent ports allow simultaneous acquisition and playback; 360 MHz clock supports >1 GSample/s sustained streaming. |
| Telecom Baseband Processing | AI Accelerator On-Chip Cache |
|
Use Scenario: Shared memory between DSP cores and hardware accelerators in 5G massive MIMO baseband units. IC Role / Device Role / Timing Role: Low-latency, coherent memory resource accessed by multiple processing engines. Use Value: Full data coherency guarantees most recent write visibility on next read; DOFF flexibility eases integration with legacy timing constraints. |
Use Scenario: L2/L3 cache extension for AI inference accelerators requiring deterministic memory access. IC Role / Device Role / Timing Role: High-throughput off-die memory supplementing on-chip SRAM capacity. Use Value: Two-word burst matches typical tensor tile sizes; HSTL-18 interface ensures signal integrity at 720 MT/s across PCB interconnects. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1625KV18-360BZXC | 16M × 9 configuration; lower pin count (165-ball), reduced data width | Better suited for space-constrained designs where 9-bit granularity suffices | Select when system bus width aligns with ×9 and board area is critical |
| CY7C1614KV18-360BZXC | 4M × 36 configuration; same package, wider data path, halved depth | Preferred for wide-bus architectures (e.g., 32-bit+ processors with ECC) | Choose when higher per-cycle throughput outweighs memory depth requirements |
Compared with CY7C1625KV18-360BZXC and CY7C1614KV18-360BZXC, CY7C1612KV18-360BZXC offers optimal balance of depth (8M words) and width (18 bits), supporting common 16-bit + parity or dual 9-bit channel configurations without over-provisioning pins or sacrificing density.
Availability
CY7C1612KV18-360BZXC is available at Aetrix Electronics and suitable for network switching, high-speed test instrumentation, and telecom baseband processing requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CY7C1612KV18-360BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the QDR II SRAM portfolio, including design, manufacturing, and long-term supply assurance.
This device belongs to the QDR® II family of high-speed synchronous SRAMs, engineered specifically for deterministic, low-latency, concurrent memory access in networking, test, and communications infrastructure.
FAQ
What is the function of the DOFF pin on CY7C1612KV18-360BZXC?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency (standard QDR II operation); when LOW, it reduces latency to 1 cycle for backward compatibility with QDR I timing. This setting is sampled synchronously on the K clock and affects all subsequent read accesses until changed.
Can CY7C1612KV18-360BZXC operate with 1.5 V VDDQ?
Yes - the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V. At 1.5 V, it meets HSTL Class I specifications with appropriate termination, enabling interoperability with 1.5 V logic families while maintaining full 360 MHz operation and signal integrity.
How does the echo clock (CQ/CQ) improve system timing margin?
CQ and CQ are output-referenced clocks driven synchronously with Q[17:0] data edges. They provide a local timing reference at the receiver, eliminating flight-time mismatch between clock and data paths - critical for reliable capture at 720 MT/s in multi-drop or long-trace PCB layouts.
Is JTAG boundary scan supported on CY7C1612KV18-360BZXC?
Yes - the device implements IEEE 1149.1 (JTAG) compliant test access port with TDI, TDO, TCK, and TMS pins. Boundary scan supports interconnect testing and allows in-system programming of configuration registers, though no user-programmable nonvolatile storage is present.
CY7C1612KV18-360BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 144Mbit
- Memory Organization:
- 8M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 360 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1612KV18-360BZXC FAQ
1.How can I place an order for CY7C1612KV18-360BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1612KV18-360BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1612KV18-360BZXC reliable?
The price and inventory of CY7C1612KV18-360BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1612KV18-360BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1612KV18-360BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1612KV18-360BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1612KV18-360BZXC?
CY7C1612KV18-360BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1612KV18-360BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1612KV18-360BZXC?
For technical support, including CY7C1612KV18-360BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1612KV18-360BZXC requirements.
6.How does Aetrix verify that CY7C1612KV18-360BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1612KV18-360BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1612KV18-360BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1612KV18-360BZXC?
All CY7C1612KV18-360BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1612KV18-360BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1612KV18-360BZXC part is unused and in its original packaging.
Return procedure for CY7C1612KV18-360BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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