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Infineon Technologies CY7C1614KV18-250BZI

Part No.:
CY7C1614KV18-250BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1614KV18-250BZI.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,091

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Product details

Overview

CY7C1614KV18 from Infineon Technologies (formerly Cypress) is a 4M × 36, 144-Mbit QDR® II synchronous SRAM with two-word burst architecture, 250 MHz maximum clock frequency (400 ps cycle time), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports, echo clocks (CQ/CQ), and PLL-based timing control for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C1614KV18 datasheet, CY7C1614KV18 pinout, CY7C1614KV18 application, or CY7C1614KV18 equivalent, this device is selected for deterministic low-latency memory buffering in packet-switched infrastructure where concurrent read/write throughput, precise data capture via echo clocks, and depth expansion via port selects are required.

Technical Context

The CY7C1614KV18 implements QDR II architecture with fully independent read and write ports sharing a multiplexed 21-bit address bus (A[20:0]), enabling true concurrent transactions without bus turnaround. Its 36-bit data width (D[35:0]/Q[35:0]) supports two sequential 36-bit words per access, latched on alternate rising edges of K/K clocks.

It uses dual differential output clocks (C/C) and echo clocks (CQ/CQ) to minimize skew between controller and memory, while the integrated PLL ensures accurate data placement at 250 MHz operation. Byte write select signals (BWS[3:0]) provide granular 9-bit byte-level write control across the 36-bit interface.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 144 Mbit (4M × 36 organization)
Max Clock Frequency 250 MHz - defines 400 ps minimum cycle time for timing-critical system synchronization
Data Bus Width 36-bit bidirectional (D[35:0] inputs / Q[35:0] outputs) - enables two 36-bit words per burst
Core Supply Voltage 1.8 V ± 0.1 V - requires tight-regulated low-noise 1.8 V rail for stable internal SRAM operation
I/O Supply Range 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V HSTL-15/18 systems
Read Latency 1.5 cycles (DOFF = high) or 1 cycle (DOFF = low) - selectable latency mode for timing margin optimization
Package 165-ball FBGA (15 × 17 × 1.4 mm) - fine-pitch package requiring controlled-impedance PCB layout

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data input 36-bit parallel data sampled on rising edge of K clock; supports two-word burst writes
Q[35:0] Synchronous read data output 36-bit parallel data driven on rising edges of C/C clocks; tristated when RPS inactive
A[20:0] Multiplexed address input 21-bit address latched alternately for read (K) and write (K) ports; shared bus reduces routing count
RPS / WPS Active-low port select Enables/disables read or write port independently; allows depth expansion with multiple devices
BWS[3:0] Byte write select Four independent 9-bit byte enables; permits partial writes without read-modify-write overhead
C / C, CQ / CQ Differential output/echo clocks C/C clock data out; CQ/CQ mirror C/C with matched trace delay - simplifies source-synchronous capture
K / K Differential input clocks Positive/negative edges used for address/data latch timing; only rising edges active per QDR II spec
DOFF Read latency mode control High = 1.5-cycle latency (for timing margin); low = 1-cycle latency (for minimal latency)

Key Features

Feature Design Value
Separate read/write ports Eliminates bus turnaround delay - enables simultaneous 36-bit read and 36-bit write every 4 ns at 250 MHz
Two-word burst architecture Delivers 72 bits per access cycle - doubles effective bandwidth versus single-word devices
Echo clocks (CQ/CQ) Provides controller with phase-matched clock copies - enables reliable data capture at 720 MT/s DDR rate
Programmable impedance (ZQ) On-die termination calibration via ZQ pin - reduces external termination components and improves signal integrity
JTAG 1149.1 test access port Supports boundary scan testing and in-system programming - critical for high-reliability telecom board validation

Applications

Network Packet Buffering Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 Ethernet switches operating at 10 Gbps+ line rates.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffering between ingress parser and egress scheduler, synchronized to system clock domain via K/K and C/C.

Use Value: Concurrent 36-bit reads and writes eliminate arbitration stalls, sustaining >72 Gbps aggregate bandwidth (250 MHz × 36-bit × 2 transfers/cycle).

Use Scenario: Interconnecting crossbar switch elements in modular chassis-based routers with distributed forwarding engines.

IC Role / Device Role / Timing Role: Shared memory resource for cell-based switching fabric, using RPS/WPS for port arbitration and BWS[3:0] for partial cell updates.

Use Value: 1.5-cycle read latency (DOFF = high) provides timing margin for multi-hop fabric routing decisions without pipeline bubbles.

Telecom Line Card Buffering High-Speed Test Equipment Memory

Use Scenario: Real-time buffering of OC-192/STM-64 SONET/SDH frame payloads in optical transport terminal cards.

IC Role / Device Role / Timing Role: Deterministic latency SRAM interfacing with SerDes PHYs via HSTL-15 I/O, using echo clocks for jitter-tolerant capture.

Use Value: VDDQ range (1.4–1.8 V) allows direct interface to 1.5 V SerDes I/O without level shifters, reducing BOM cost and signal path complexity.

Use Scenario: Pattern memory in automated test equipment (ATE) for high-speed digital IC validation at >500 MHz test clock rates.

IC Role / Device Role / Timing Role: High-reliability storage for stimulus/response vectors, leveraging JTAG boundary scan for production test coverage.

Use Value: On-die ZQ calibration ensures consistent HSTL output impedance across temperature, maintaining waveform fidelity at 720 MT/s DDR data rates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1612KV18 8M × 18 (144 Mbit), same 165-ball FBGA, but 18-bit data width and 22-bit address bus (A[21:0]) Requires wider data bus routing (18 vs. 36 bits) and different byte write logic (BWS[1:0] only) Select when system data path is 18-bit or when lower pin count per device is prioritized over burst efficiency
AS7C3256B-25JCIN Asynchronous 32K × 8 SRAM, 25 ns access, SOJ-32 package, no DDR/QDR architecture or echo clocks Lacks concurrent read/write, burst capability, or high-speed timing features - suitable only for non-real-time buffering Use only in legacy designs where QDR timing constraints do not apply and bandwidth < 200 MB/s is acceptable

Compared with CY7C1612KV18, the CY7C1614KV18 delivers double the per-cycle data throughput (72 vs. 36 bits) at identical density, while AS7C3256B-25JCIN lacks all QDR II timing mechanisms - making it unsuitable for any application requiring deterministic 250 MHz dual-port operation.

Availability

CY7C1614KV18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, and telecom line card buffering requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for CY7C1614KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the QDR II SRAM portfolio originally developed by Cypress.

This device belongs to Infineon's high-performance memory product line, designed specifically for deterministic, low-latency, high-bandwidth buffering in carrier-grade networking and telecom infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1614KV18?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted high, it configures 1.5-cycle read latency for improved timing margin in high-skew systems; when low, it enables 1-cycle latency for minimal delay. This setting directly affects the number of clock cycles between address assertion and valid Q[35:0] output, and must be set before initialization.

Can CY7C1614KV18 operate with only a single clock domain?

Yes - the device supports single-clock mode where K and K are tied together and C and C are tied together, eliminating need for differential clock generation. In this mode, data is latched and driven on the same clock edges, reducing system clocking complexity at the cost of reduced skew tolerance compared to differential operation.

How does the ZQ pin enable on-die termination calibration?

The ZQ pin connects to a 240 Ω external reference resistor to ground. During calibration, internal circuitry measures this resistance and adjusts output driver impedance to match - achieving ±15% accuracy. This eliminates discrete termination resistors and maintains consistent HSTL-15/18 signal integrity across voltage and temperature variations.

What is the role of BWS[3:0] during a write operation?

BWS[3:0] are active-low byte write selects that gate individual 9-bit segments of the 36-bit D[35:0] bus. When a BWS bit is deasserted (high), its corresponding 9-bit byte is ignored during the write cycle, preserving existing memory contents in those bits - enabling efficient partial writes without read-modify-write sequences.

CY7C1614KV18-250BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
144Mbit
Memory Organization:
4M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1614KV18-250BZI FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1614KV18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1614KV18-250BZI reliable?

The price and inventory of CY7C1614KV18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1614KV18-250BZI is usually 5 days.

3.What payment methods are accepted for CY7C1614KV18-250BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1614KV18-250BZI transactions.

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4.How is shipping managed for CY7C1614KV18-250BZI?

CY7C1614KV18-250BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1614KV18-250BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1614KV18-250BZI?

For technical support, including CY7C1614KV18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1614KV18-250BZI requirements.

6.How does Aetrix verify that CY7C1614KV18-250BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1614KV18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1614KV18-250BZI meets industry standards.

7.What is the process for return or replacement of CY7C1614KV18-250BZI?

All CY7C1614KV18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1614KV18-250BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1614KV18-250BZI part is unused and in its original packaging.

Return procedure for CY7C1614KV18-250BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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