Infineon Technologies CY7C1618KV18-300BZXC
- Part No.:
- CY7C1618KV18-300BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1618KV18-300BZXC.pdf
- Description:
- IC SRAM 144MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1618KV18-300BZXC from Infineon Technologies (formerly Cypress) is a 144-Mbit DDR II SRAM with 8M × 18 organization, 333 MHz clock support, 666 MHz effective data rate, and 1.8-V core supply. It implements two-word burst architecture with echo clocks (CQ/CQ), dual input clocks (K/K), and programmable output drive for high-speed memory buffering in networking line cards and packet processors.
For engineers reviewing the CY7C1618KV18-300BZXC datasheet, CY7C1618KV18-300BZXC pinout, CY7C1618KV18-300BZXC application, or CY7C1618KV18-300BZXC equivalent, key selection criteria include DDR II read latency (1.5-cycle with DOFF high), HSTL I/O compatibility (1.4–1.8 V), JTAG 1149.1 test access, and 165-ball FBGA (15 × 17 × 1.4 mm) package thermal and routing constraints.
Technical Context
This SRAM uses synchronous pipelined architecture with internal self-timed writes and a 1-bit burst counter driven by A0. Address latching occurs on alternating rising edges of K and K, enabling two-word burst transfers without external address toggling between words.
The device supports dual-clock domain operation: K/K control all synchronous inputs and write data capture, while C/C govern read data output timing and enable flight-time deskewing. Echo clocks CQ/CQ are phase-aligned to C/C and simplify system-level data capture without per-device timing margining.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 144 Mbit (8M × 18), enabling 18-bit wide high-bandwidth buffering for packet header processing |
| Max Clock Frequency | 333 MHz - sets maximum sustained throughput of 1.2 GB/s (666 MT/s × 18 bits) |
| Data Rate | 666 MT/s DDR - delivers double-data-rate transfers on both rising and falling edges of C/C |
| Read Latency | 1.5 cycles (DOFF = high) or 1 cycle (DOFF = low) - selectable timing mode for latency-critical vs. compatibility use cases |
| I/O Voltage Range | 1.4 V to VDDQ (1.8 V) - supports mixed-voltage board designs and impedance tuning via ZQ calibration |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - provides 0.8 mm ball pitch, thermal performance suitable for sustained 650 mA operation |
| Core Supply | 1.8 V ± 0.1 V - requires tight regulation; decoupling critical due to high di/dt during DDR bursts |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | Shares physical pins for read/write; driven on rising edges of C/C (or K/K); tristated automatically on deselect |
| K / K | Positive/negative input clocks | Capture all synchronous inputs (address, R/W, BWS); define burst initiation timing; used for write data registration |
| C / C | Positive/negative output data clocks | Control timing of DQ[17:0] read data output; enable board-level flight-time deskew across multiple SRAMs |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies of C/C; simplify controller data capture without per-pin delay calibration |
| DOFF | DDR latency mode select | High = DDR II mode (1.5-cycle read latency); low = DDR I compatibility mode (1-cycle latency) |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune DQ/CQ output drive strength to match PCB trace impedance (typically 50 Ω) |
| BWS[1:0] | Byte write select (active low) | BWS0 controls D[8:0]; BWS1 controls D[17:9]; enables partial-word writes without read-modify-write overhead |
| LD | Load signal | Active-low strobe indicating valid address and R/W setup; initiates burst sequence for both words |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus toggling frequency by 50% versus single-word SRAMs, lowering EMI and simplifying controller logic |
| Programmable HSTL output drive | Impedance calibrated via ZQ pin to match 40–60 Ω PCB traces, minimizing reflections at 666 MT/s |
| JTAG 1149.1 test access port | Enables boundary-scan testing of interconnects in dense FBGA layouts without physical probe access |
| PLL-based data placement | Ensures precise alignment between CQ/CQ and DQ[17:0] edges, eliminating need for dynamic phase adjustment in FPGA controllers |
| Variable I/O voltage support | Operates with 1.5 V or 1.8 V VDDQ, allowing interoperability with legacy 1.5 V DDR I controllers or newer 1.8 V systems |
Applications
| Telecom Line Card Buffering | Network Packet Processor Cache |
|---|---|
|
Use Scenario: High-throughput buffering of Ethernet frames between MAC and switch fabric ASICs in 10G/25G line cards. IC Role / Device Role / Timing Role: Synchronous DDR II SRAM providing low-latency, burst-aligned storage for ingress/egress packet headers and metadata. Use Value: 666 MT/s bandwidth and 1.5-cycle latency meet deterministic timing budgets for cut-through switching without pipeline stalls. |
Use Scenario: Temporary storage of parsed packet descriptors and flow-state entries in multi-core network processors. IC Role / Device Role / Timing Role: Pipelined burst SRAM acting as shared descriptor cache with byte-selectable writes to avoid full-line overwrites. Use Value: BWS[1:0] enables atomic 9-bit or 18-bit updates to descriptor fields, reducing memory traffic by >40% versus full-word writes. |
| Baseband Digital Front-End Memory | Industrial Real-Time Control Buffer |
|
Use Scenario: Storing time-aligned IQ samples between ADC/DAC interfaces and DSP engines in LTE/5G radio units. IC Role / Device Role / Timing Role: DDR II SRAM synchronized to baseband clock domain using K/K and C/C for deterministic sample buffering. Use Value: Echo clocks CQ/CQ eliminate skew-induced sampling jitter across 18-bit parallel paths, maintaining <±50 ps timing closure. |
Use Scenario: Deterministic buffering of sensor fusion data streams in motion-control PLCs with sub-microsecond loop timing. IC Role / Device Role / Timing Role: Low-jitter SRAM interfaced to FPGA-based real-time engine, leveraging DOFF-selectable latency for worst-case timing analysis. Use Value: Configurable 1-cycle (DOFF low) or 1.5-cycle (DOFF high) read latency allows guaranteed timing closure under worst-case voltage/temperature corners. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-15JCIN | Asynchronous 256K × 16 SRAM; no DDR, no burst, no echo clocks; 15 ns access, 3.3 V only | Used in legacy control-plane buffers where timing determinism is less critical and bandwidth <200 MB/s suffices | Select only if DDR interface and >500 MB/s throughput are unnecessary; incompatible pinout and voltage |
| IS61WV102418BLL-10BLI | Synchronous 1M × 18 SRAM; single-data-rate; 10 ns cycle time; 1.8 V core/I/O; no burst or echo clocks | Suitable for lower-bandwidth control buffers in FPGA-based motor drives requiring simple address sequencing | Choose when DDR complexity adds design risk; lacks CQ/CQ and DOFF latency control, limiting high-speed system scalability |
Compared with AS7C3256A-15JCIN and IS61WV102418BLL-10BLI, CY7C1618KV18-300BZXC uniquely delivers DDR II timing, echo-clock–assisted data capture, and configurable latency-enabling deterministic 1.2 GB/s throughput in systems where asynchronous or single-data-rate alternatives would bottleneck real-time data paths.
Availability
CY7C1618KV18-300BZXC is available at Aetrix Electronics and suitable for telecom line card buffering, network packet processor caching, and industrial real-time control applications requiring stable component supply, long-lifecycle support, and Pb-free compliance.
Supply support for CY7C1618KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including DDR II SRAMs engineered for infrastructure and industrial applications demanding reliability and longevity.
CY7C1618KV18-300BZXC belongs to Infineon's legacy Cypress DDR II SRAM product line, designed specifically for high-bandwidth, low-latency buffering in telecom, networking, and real-time embedded systems where deterministic timing and signal integrity are critical.
FAQ
What is the function of the DOFF pin on CY7C1618KV18-300BZXC?
The DOFF (DDR Off) pin selects read latency mode: when asserted high, it enables DDR II operation with 1.5-cycle read latency; when low, it reverts to DDR I–compatible 1-cycle latency. This allows system designers to trade off timing margin for performance or maintain backward compatibility with existing DDR I controllers without hardware changes.
How does the ZQ pin calibrate output drive strength?
ZQ connects to an external precision resistor (typically 240 Ω) tied to ground, enabling on-die calibration of DQ and CQ output driver impedance to 0.2 × RQ (e.g., 48 Ω). This compensates for process/voltage/temperature variations and ensures consistent signal integrity across the 18-bit bus at 666 MT/s, eliminating manual trace-length matching.
Can CY7C1618KV18-300BZXC operate with only K and K clocks, without C and C?
Yes - in single-clock mode, the device uses K and K for both input capture and output data timing. Read data is driven on rising edges of K/K instead of C/C, and CQ/CQ are generated relative to K/K. This reduces clock routing complexity but sacrifices flight-time deskew capability and limits maximum achievable system bandwidth.
What is the purpose of BWS[1:0] in byte-write operations?
BWS0 and BWS1 are active-low byte write select signals that gate 9-bit segments of the 18-bit DQ bus during writes. BWS0 enables D[8:0], BWS1 enables D[17:9]. When either is deasserted, corresponding bytes retain prior values - enabling efficient partial-word updates without read-modify-write cycles, critical for descriptor and metadata buffers.
CY7C1618KV18-300BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 144Mbit
- Memory Organization:
- 4M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1618KV18-300BZXC FAQ
1.How can I place an order for CY7C1618KV18-300BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1618KV18-300BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1618KV18-300BZXC reliable?
The price and inventory of CY7C1618KV18-300BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1618KV18-300BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1618KV18-300BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1618KV18-300BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1618KV18-300BZXC?
CY7C1618KV18-300BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1618KV18-300BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1618KV18-300BZXC?
For technical support, including CY7C1618KV18-300BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1618KV18-300BZXC requirements.
6.How does Aetrix verify that CY7C1618KV18-300BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1618KV18-300BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1618KV18-300BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1618KV18-300BZXC?
All CY7C1618KV18-300BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1618KV18-300BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1618KV18-300BZXC part is unused and in its original packaging.
Return procedure for CY7C1618KV18-300BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1618KV18-300BZXC Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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