Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1618KV18-300BZXC

Part No.:
CY7C1618KV18-300BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1618KV18-300BZXC.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,919

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1618KV18-300BZXC from Infineon Technologies (formerly Cypress) is a 144-Mbit DDR II SRAM with 8M × 18 organization, 333 MHz clock support, 666 MHz effective data rate, and 1.8-V core supply. It implements two-word burst architecture with echo clocks (CQ/CQ), dual input clocks (K/K), and programmable output drive for high-speed memory buffering in networking line cards and packet processors.

For engineers reviewing the CY7C1618KV18-300BZXC datasheet, CY7C1618KV18-300BZXC pinout, CY7C1618KV18-300BZXC application, or CY7C1618KV18-300BZXC equivalent, key selection criteria include DDR II read latency (1.5-cycle with DOFF high), HSTL I/O compatibility (1.4–1.8 V), JTAG 1149.1 test access, and 165-ball FBGA (15 × 17 × 1.4 mm) package thermal and routing constraints.

Technical Context

This SRAM uses synchronous pipelined architecture with internal self-timed writes and a 1-bit burst counter driven by A0. Address latching occurs on alternating rising edges of K and K, enabling two-word burst transfers without external address toggling between words.

The device supports dual-clock domain operation: K/K control all synchronous inputs and write data capture, while C/C govern read data output timing and enable flight-time deskewing. Echo clocks CQ/CQ are phase-aligned to C/C and simplify system-level data capture without per-device timing margining.

Key Specifications

Parameter Value and Actual Design Meaning
Density 144 Mbit (8M × 18), enabling 18-bit wide high-bandwidth buffering for packet header processing
Max Clock Frequency 333 MHz - sets maximum sustained throughput of 1.2 GB/s (666 MT/s × 18 bits)
Data Rate 666 MT/s DDR - delivers double-data-rate transfers on both rising and falling edges of C/C
Read Latency 1.5 cycles (DOFF = high) or 1 cycle (DOFF = low) - selectable timing mode for latency-critical vs. compatibility use cases
I/O Voltage Range 1.4 V to VDDQ (1.8 V) - supports mixed-voltage board designs and impedance tuning via ZQ calibration
Package 165-ball FBGA (15 × 17 × 1.4 mm) - provides 0.8 mm ball pitch, thermal performance suitable for sustained 650 mA operation
Core Supply 1.8 V ± 0.1 V - requires tight regulation; decoupling critical due to high di/dt during DDR bursts

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus Shares physical pins for read/write; driven on rising edges of C/C (or K/K); tristated automatically on deselect
K / K Positive/negative input clocks Capture all synchronous inputs (address, R/W, BWS); define burst initiation timing; used for write data registration
C / C Positive/negative output data clocks Control timing of DQ[17:0] read data output; enable board-level flight-time deskew across multiple SRAMs
CQ / CQ Echo clocks referenced to C/C Free-running, phase-aligned copies of C/C; simplify controller data capture without per-pin delay calibration
DOFF DDR latency mode select High = DDR II mode (1.5-cycle read latency); low = DDR I compatibility mode (1-cycle latency)
ZQ Output impedance calibration input Connects to external resistor to ground to tune DQ/CQ output drive strength to match PCB trace impedance (typically 50 Ω)
BWS[1:0] Byte write select (active low) BWS0 controls D[8:0]; BWS1 controls D[17:9]; enables partial-word writes without read-modify-write overhead
LD Load signal Active-low strobe indicating valid address and R/W setup; initiates burst sequence for both words

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling frequency by 50% versus single-word SRAMs, lowering EMI and simplifying controller logic
Programmable HSTL output drive Impedance calibrated via ZQ pin to match 40–60 Ω PCB traces, minimizing reflections at 666 MT/s
JTAG 1149.1 test access port Enables boundary-scan testing of interconnects in dense FBGA layouts without physical probe access
PLL-based data placement Ensures precise alignment between CQ/CQ and DQ[17:0] edges, eliminating need for dynamic phase adjustment in FPGA controllers
Variable I/O voltage support Operates with 1.5 V or 1.8 V VDDQ, allowing interoperability with legacy 1.5 V DDR I controllers or newer 1.8 V systems

Applications

Telecom Line Card Buffering Network Packet Processor Cache

Use Scenario: High-throughput buffering of Ethernet frames between MAC and switch fabric ASICs in 10G/25G line cards.

IC Role / Device Role / Timing Role: Synchronous DDR II SRAM providing low-latency, burst-aligned storage for ingress/egress packet headers and metadata.

Use Value: 666 MT/s bandwidth and 1.5-cycle latency meet deterministic timing budgets for cut-through switching without pipeline stalls.

Use Scenario: Temporary storage of parsed packet descriptors and flow-state entries in multi-core network processors.

IC Role / Device Role / Timing Role: Pipelined burst SRAM acting as shared descriptor cache with byte-selectable writes to avoid full-line overwrites.

Use Value: BWS[1:0] enables atomic 9-bit or 18-bit updates to descriptor fields, reducing memory traffic by >40% versus full-word writes.

Baseband Digital Front-End Memory Industrial Real-Time Control Buffer

Use Scenario: Storing time-aligned IQ samples between ADC/DAC interfaces and DSP engines in LTE/5G radio units.

IC Role / Device Role / Timing Role: DDR II SRAM synchronized to baseband clock domain using K/K and C/C for deterministic sample buffering.

Use Value: Echo clocks CQ/CQ eliminate skew-induced sampling jitter across 18-bit parallel paths, maintaining <±50 ps timing closure.

Use Scenario: Deterministic buffering of sensor fusion data streams in motion-control PLCs with sub-microsecond loop timing.

IC Role / Device Role / Timing Role: Low-jitter SRAM interfaced to FPGA-based real-time engine, leveraging DOFF-selectable latency for worst-case timing analysis.

Use Value: Configurable 1-cycle (DOFF low) or 1.5-cycle (DOFF high) read latency allows guaranteed timing closure under worst-case voltage/temperature corners.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C3256A-15JCIN Asynchronous 256K × 16 SRAM; no DDR, no burst, no echo clocks; 15 ns access, 3.3 V only Used in legacy control-plane buffers where timing determinism is less critical and bandwidth <200 MB/s suffices Select only if DDR interface and >500 MB/s throughput are unnecessary; incompatible pinout and voltage
IS61WV102418BLL-10BLI Synchronous 1M × 18 SRAM; single-data-rate; 10 ns cycle time; 1.8 V core/I/O; no burst or echo clocks Suitable for lower-bandwidth control buffers in FPGA-based motor drives requiring simple address sequencing Choose when DDR complexity adds design risk; lacks CQ/CQ and DOFF latency control, limiting high-speed system scalability

Compared with AS7C3256A-15JCIN and IS61WV102418BLL-10BLI, CY7C1618KV18-300BZXC uniquely delivers DDR II timing, echo-clock–assisted data capture, and configurable latency-enabling deterministic 1.2 GB/s throughput in systems where asynchronous or single-data-rate alternatives would bottleneck real-time data paths.

Availability

CY7C1618KV18-300BZXC is available at Aetrix Electronics and suitable for telecom line card buffering, network packet processor caching, and industrial real-time control applications requiring stable component supply, long-lifecycle support, and Pb-free compliance.

Supply support for CY7C1618KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including DDR II SRAMs engineered for infrastructure and industrial applications demanding reliability and longevity.

CY7C1618KV18-300BZXC belongs to Infineon's legacy Cypress DDR II SRAM product line, designed specifically for high-bandwidth, low-latency buffering in telecom, networking, and real-time embedded systems where deterministic timing and signal integrity are critical.

FAQ

What is the function of the DOFF pin on CY7C1618KV18-300BZXC?

The DOFF (DDR Off) pin selects read latency mode: when asserted high, it enables DDR II operation with 1.5-cycle read latency; when low, it reverts to DDR I–compatible 1-cycle latency. This allows system designers to trade off timing margin for performance or maintain backward compatibility with existing DDR I controllers without hardware changes.

How does the ZQ pin calibrate output drive strength?

ZQ connects to an external precision resistor (typically 240 Ω) tied to ground, enabling on-die calibration of DQ and CQ output driver impedance to 0.2 × RQ (e.g., 48 Ω). This compensates for process/voltage/temperature variations and ensures consistent signal integrity across the 18-bit bus at 666 MT/s, eliminating manual trace-length matching.

Can CY7C1618KV18-300BZXC operate with only K and K clocks, without C and C?

Yes - in single-clock mode, the device uses K and K for both input capture and output data timing. Read data is driven on rising edges of K/K instead of C/C, and CQ/CQ are generated relative to K/K. This reduces clock routing complexity but sacrifices flight-time deskew capability and limits maximum achievable system bandwidth.

What is the purpose of BWS[1:0] in byte-write operations?

BWS0 and BWS1 are active-low byte write select signals that gate 9-bit segments of the 18-bit DQ bus during writes. BWS0 enables D[8:0], BWS1 enables D[17:9]. When either is deasserted, corresponding bytes retain prior values - enabling efficient partial-word updates without read-modify-write cycles, critical for descriptor and metadata buffers.

CY7C1618KV18-300BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
144Mbit
Memory Organization:
4M x 36
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1618KV18-300BZXC FAQ

1.How can I place an order for CY7C1618KV18-300BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1618KV18-300BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1618KV18-300BZXC reliable?

The price and inventory of CY7C1618KV18-300BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1618KV18-300BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1618KV18-300BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1618KV18-300BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1618KV18-300BZXC?

CY7C1618KV18-300BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1618KV18-300BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1618KV18-300BZXC?

For technical support, including CY7C1618KV18-300BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1618KV18-300BZXC requirements.

6.How does Aetrix verify that CY7C1618KV18-300BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1618KV18-300BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1618KV18-300BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1618KV18-300BZXC?

All CY7C1618KV18-300BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1618KV18-300BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1618KV18-300BZXC part is unused and in its original packaging.

Return procedure for CY7C1618KV18-300BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1618KV18-300BZXC Tags

  • CY7C1618KV18-300BZXC
  • CY7C1618KV18-300BZXC PDF
  • CY7C1618KV18-300BZXC Datasheet
  • CY7C1618KV18-300BZXC Specifications
  • CY7C1618KV18-300BZXC Images
  • Infineon Technologies
  • Infineon Technologies CY7C1618KV18-300BZXC
  • Buy CY7C1618KV18-300BZXC
  • CY7C1618KV18-300BZXC Price
  • CY7C1618KV18-300BZXC Distributor
  • CY7C1618KV18-300BZXC Supplier
  • CY7C1618KV18-300BZXC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER