Infineon Technologies CY7C1625KV18-250BZXI

Overview

CY7C1625KV18 from Infineon Technologies (formerly Cypress) is a 16M × 9, 144-Mbit QDR® II SRAM with separate read/write ports, 360-MHz clock operation (720-MHz DDR data rate), 1.8-V core supply, and 1.4–1.8-V I/O supply - deployed in high-bandwidth networking buffers, packet classification engines, and FPGA-based protocol accelerators.

For engineers reviewing the CY7C1625KV18 datasheet, CY7C1625KV18 pinout, CY7C1625KV18 application, or CY7C1625KV18 equivalent, key selection criteria include its two-word burst architecture, echo clock (CQ/CQ) support for timing margin recovery, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, and 165-ball FBGA package compatibility with high-speed PCB routing constraints.

Technical Context

The CY7C1625KV18 implements true dual-port QDR II architecture: independent K/K clocks control write address/data latching, while C/C clocks govern read data output timing - enabling concurrent read/write transactions without bus turnaround. Its internal 8M × 9 array is accessed via multiplexed 23-bit address bus, with RPS/WPS enabling port-level arbitration.

It integrates a PLL for precise data-eye placement, HSTL Class I/II programmable drive strength outputs, JTAG 1149.1 boundary scan, and synchronous self-timed writes. The DOFF pin selects between 1.5-cycle (DOFF = high) and 1-cycle (DOFF = low) read latency modes - matching QDR I or optimizing for QDR II throughput.

Key Specifications

Pinout & Package

165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, with 0.8-mm ball pitch and standard HSTL-compatible ball assignment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102416BLL-10TLI, the CY7C1625KV18 uniquely balances 360-MHz QDR II performance with flexible latency configuration, echo-clock timing resilience, and mature JTAG test infrastructure - making it optimal for telecom and test equipment where deterministic timing and debug visibility are mandatory.

Availability

CY7C1625KV18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA-based protocol acceleration, and telecom baseband processing requiring stable component supply across multi-year production cycles.

Supply support for CY7C1625KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including QDR SRAMs, for mission-critical infrastructure applications.

This device belongs to Infineon's QDR II SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory interfacing in networking, wireless infrastructure, and automated test systems.

FAQ

What is the function of the DOFF pin on CY7C1625KV18?

The DOFF (Data Output Fall-off) pin configures read latency mode: when asserted high, it enables 1.5-cycle latency for QDR II operation with improved timing margin; when low, it selects 1-cycle latency for QDR I compatibility. This setting is sampled synchronously on the K clock edge at power-up or reset and remains static during operation.

Can CY7C1625KV18 operate with only a single clock domain?

Yes - the device supports single-clock mode where K and C are tied together (and K and C tied together), allowing simplified timing closure in systems without dedicated echo clock routing. In this mode, data is clocked using K/K for both read and write, and output timing follows K/K edges directly without deskew compensation.

How does ZQ calibration work on CY7C1625KV18?

ZQ calibration uses an external 240-Ω resistor connected between the ZQ pin and ground to tune internal output driver impedance to match PCB trace impedance. The calibration occurs automatically at power-up and can be retriggered via JTAG command. It adjusts HSTL Class I/II drive strength to maintain ±10% impedance accuracy across voltage/temperature.

Is the 165-ball FBGA package lead-free?

Yes - the CY7C1625KV18-250BZXI variant is specified with Pb-free (RoHS-compliant) finish per ordering code suffix 'X'. The package uses matte tin over nickel underplate on all solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) requirements.