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Infineon Technologies CY7C1645KV18-450BZXI

Part No.:
CY7C1645KV18-450BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1645KV18-450BZXI.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,599

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Product details

Overview

CY7C1645KV18 from Cypress Semiconductor is a 4 M × 36, 144-Mbit QDR® II+ SRAM with 450 MHz clock operation, 2.0-cycle read latency, and separate synchronous read/write ports supporting concurrent DDR transfers at 900 Mbps per port. It uses HSTL I/O (VDDQ = 1.4–1.8 V), integrated PLL for precise data placement, and echo clocks (CQ/CQ) for high-speed data capture in networking packet buffers.

For engineers reviewing the CY7C1645KV18 datasheet, CY7C1645KV18 pinout, CY7C1645KV18 application, or CY7C1645KV18 equivalent, key selection criteria include its 4-word burst architecture, DOFF-configurable latency mode (QDR II+ vs QDR I), byte-write select granularity (BWS[3:0]), and 165-ball FBGA package compatibility with high-density routing in telecom line cards and FPGA co-processor memory subsystems.

Technical Context

The CY7C1645KV18 implements a true quad-data-rate II+ architecture with physically isolated read and write data paths-no bus turnaround required. Its 20-bit address bus (A[19:0]) accesses a 4 M × 36 memory array organized as four 1 M × 36 sub-arrays, with addresses latched on alternating edges of K/K clocks.

It integrates a PLL for jitter-tolerant data sampling and provides echo clocks (CQ/CQ) aligned to output data edges, enabling reliable capture at 900 Mbps without external delay tuning. The DOFF pin selects between 2.0-cycle QDR II+ mode (full spec) and 1-cycle QDR I mode (≤167 MHz, PLL disabled).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 144 Mbit (4 M × 36 organization)
Max Clock Frequency 450 MHz - enables 900 MT/s DDR throughput per port
Read Latency 2.0 clock cycles - fixed when DOFF = HIGH; enables deterministic timing in pipeline-critical systems
I/O Voltage VDDQ = 1.4 V to 1.8 V - supports both 1.5-V and 1.8-V HSTL-18/15 interfaces
Package 165-ball FBGA (15 × 17 × 1.4 mm) - fine-pitch layout optimized for high-speed signal integrity
Core Supply VDD = 1.8 V ± 0.1 V - low-power, noise-sensitive core domain decoupling requirement
Burst Length Four 36-bit words per access - reduces address bus toggling frequency by 4× vs single-word access

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch and standard HSTL-compatible pad layout.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Write data inputs 36-bit synchronous input bus sampled on rising edges of K/K; supports partial writes via BWS[3:0]
Q[35:0] Read data outputs 36-bit DDR output bus edge-aligned with CQ/CQ; tri-stated when RPS inactive
A[19:0] Multiplexed address bus 20-bit address shared by read/write ports; latched on alternating K/K edges for burst addressing
RPS / WPS Port enable controls Active-low synchronous selects; enable independent read/write transactions without arbitration logic
BWS[3:0] Byte write masks Four independent 9-bit write enables (D[8:0], D[17:9], D[26:18], D[35:27]); preserve unmasked data on partial writes
K / K Differential clock inputs Rising-edge-triggered clocks for all synchronous operations; K drives read path, K drives write path
CQ / CQ Echo clock outputs Free-running, phase-aligned copies of K/K; simplify PCB trace length matching for data capture
DOFF PLL enable/disable Active-low control: HIGH → QDR II+ mode (2-cycle latency, 450 MHz); LOW → QDR I mode (1-cycle, ≤167 MHz)
QVLD Data validity indicator Output pulse synchronized to CQ/CQ rising edge; signals valid Q[35:0] data during burst transfer

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround overhead and contention, enabling full-duplex memory access in real-time packet processing
Four-word burst architecture Reduces effective address bus frequency by 75%, lowering routing complexity and EMI in high-speed backplanes
Integrated PLL with echo clocks Enables deterministic 900 Mbps DDR data capture without external delay lines or phase calibration firmware
Programmable impedance (ZQ) Allows dynamic output driver tuning to match system trace impedance (via external 50 Ω resistor to ground), improving signal integrity
Byte-selectable write masking Supports atomic 9-bit field updates in protocol header manipulation without read-modify-write cycles

Applications

Telecom Packet Buffer FPGA Co-Processor Cache

Use Scenario: Line card buffer storing ingress/egress Ethernet frames before classification and forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency dual-port SRAM acting as first-level packet memory with concurrent read (forwarding engine) and write (PHY interface) access.

Use Value: 900 Mbps DDR throughput per port sustains 10 GbE line rate with zero bus turnaround penalty; 2-cycle latency aligns with FPGA pipeline stages.

Use Scenario: Off-chip cache for Xilinx UltraScale+ or Intel Stratix 10 FPGA accelerating matrix multiplication in AI inference engines.

IC Role / Device Role / Timing Role: Burst-access memory providing parallel 36-bit operand fetches to FPGA DSP slices during compute-intensive kernels.

Use Value: Four-word burst delivers 144 bits/cycle, matching FPGA native wide-bus width; HSTL-15 compatibility ensures clean signal integrity at 450 MHz.

Network Processor Lookup Table High-Speed Test Equipment Memory

Use Scenario: Storing IPv4/IPv6 forwarding tables and ACL entries in programmable network processors (e.g., Broadcom BCM886xx).

IC Role / Device Role / Timing Role: Deterministic-latency memory serving as TCAM replacement for longest-prefix-match lookups with parallel read/write capability.

Use Value: DOFF-configurable latency allows runtime switching between QDR II+ (high-throughput search) and QDR I (low-jitter update mode) without hardware change.

Use Scenario: Pattern memory in automated test equipment (ATE) generating and capturing high-speed digital waveforms for SoC validation.

IC Role / Device Role / Timing Role: Synchronous burst memory interfacing directly to ATE pattern generator ICs with precise edge-aligned data capture via CQ/CQ.

Use Value: Echo clocks eliminate setup/hold uncertainty; ZQ impedance tuning ensures <10 ps skew across 36-bit data bus at 450 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 36-bit × 2 M, 100 MHz max, LVDS I/O, no PLL, no echo clocks Limited to lower bandwidth (<200 Mbps), requires external clock management; suited for cost-sensitive industrial controllers Select when system clock <200 MHz and LVDS interface is already standardized; avoid for 10G+ packet buffering
ISSI IS61WV102436B 36-bit × 1 M, 165 MHz max, CMOS I/O, asynchronous control, no burst mode No DDR, no burst, no separate ports - requires external arbitration logic and suffers bus turnaround delays Only viable for legacy upgrades where board space permits larger footprint and timing margin is >5 ns

Compared with IDT72T36120L10BG and ISSI IS61WV102436B, the CY7C1645KV18 delivers 4.5× higher bandwidth, eliminates bus arbitration overhead via true dual-port architecture, and provides built-in timing aids (PLL, echo clocks, QVLD) essential for deterministic 450 MHz system integration.

Availability

CY7C1645KV18 is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA-accelerated computing, network processor subsystems, and high-speed test equipment requiring stable component supply and long-lifecycle support.

Supply support for CY7C1645KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

The QDR® II+ SRAM product line targets ultra-low-latency, high-throughput memory subsystems in networking, telecommunications, and FPGA-based acceleration where deterministic timing and concurrent access are critical.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal PLL when pulled low, forcing the device into QDR I mode with 1-cycle read latency and maximum 167 MHz operation. When high, it enables QDR II+ mode with 2.0-cycle latency and full 450 MHz performance. Timing parameters differ significantly between modes-data sheet Tables 10 and 11 specify separate AC characteristics for each configuration.

How does the ZQ pin configure output drive strength?

ZQ connects to an external 50 Ω resistor to ground, allowing the device to calibrate its output drivers to match system trace impedance. This sets CQ, CQ, and Q[35:0] output impedance to 0.2 × RQ (i.e., 10 Ω). Alternatively, tying ZQ to VDDQ enables minimum impedance mode (~7 Ω), but direct grounding or leaving it floating is prohibited and may cause functional failure.

Can CY7C1645KV18 be used with a single-ended clock source?

No. The device requires true differential K/K clock inputs for proper operation. Driving only K while holding K static violates AC timing requirements and causes undefined behavior in address latching, data capture, and PLL lock. A dedicated differential clock generator or transformer is mandatory for compliant operation at 450 MHz.

What is the role of BWS[3:0] during a write operation?

BWS[3:0] are active-low byte write enables that gate corresponding 9-bit segments of D[35:0]: BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27]. Only bytes with asserted (low) BWS signals are written; unmasked bytes retain prior content, enabling efficient partial-word updates without read-modify-write sequences.

CY7C1645KV18-450BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
144Mbit
Memory Organization:
4M x 36
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1645KV18-450BZXI FAQ

1.How can I place an order for CY7C1645KV18-450BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1645KV18-450BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1645KV18-450BZXI reliable?

The price and inventory of CY7C1645KV18-450BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1645KV18-450BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1645KV18-450BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1645KV18-450BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1645KV18-450BZXI?

CY7C1645KV18-450BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1645KV18-450BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1645KV18-450BZXI?

For technical support, including CY7C1645KV18-450BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1645KV18-450BZXI requirements.

6.How does Aetrix verify that CY7C1645KV18-450BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1645KV18-450BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1645KV18-450BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1645KV18-450BZXI?

All CY7C1645KV18-450BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1645KV18-450BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1645KV18-450BZXI part is unused and in its original packaging.

Return procedure for CY7C1645KV18-450BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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