Infineon Technologies CY7C1648KV18-400BZXC
- Part No.:
- CY7C1648KV18-400BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1648KV18-400BZXC.pdf
- Description:
- IC SRAM 144MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1648KV18-400BZXC from Cypress Semiconductor is a 144-Mbit QDR® II SRAM with 8 M × 18 organization, 333 MHz clock frequency, 1.8 V core supply (VDD), and 1.4–1.8 V I/O supply (VDDQ), packaged in a 165-ball FBGA (15 × 17 × 1.4 mm). It implements separate read/write ports, four-word burst architecture, and DDR interfaces on both ports for concurrent high-bandwidth memory access in network packet buffers.
For engineers reviewing the CY7C1648KV18-400BZXC datasheet, CY7C1648KV18-400BZXC pinout, CY7C1648KV18-400BZXC application, or CY7C1648KV18-400BZXC equivalent, this device supports precise timing-critical designs requiring zero bus turnaround, echo-clock–assisted data capture, and depth expansion via independent port selects in telecom line cards and FPGA co-processor caches.
Technical Context
The CY7C1648KV18-400BZXC employs QDR II architecture with fully independent synchronous read and write ports, each using DDR signaling-enabling 666 MT/s effective data rate at 333 MHz K/K clock. It uses dual input clocks (K/K) for address/data capture and dual output clocks (C/C) with echo clocks (CQ/CQ) to deskew flight time mismatches across high-speed PCB traces.
It features a 1.5-cycle read latency when DOFF = HIGH (QDR II mode) or 1-cycle latency when DOFF = LOW (QDR I compatibility mode), and supports byte-write masking via BWS[1:0] for selective 9-bit sub-word updates without read-modify-write cycles. Internal self-timed writes ensure deterministic write completion timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 144 Mbit (8 M × 18 organization) |
| Max Clock Frequency | 333 MHz - defines maximum sustained transaction rate of 333 million bursts/sec |
| Data Rate | 666 MT/s - achieved via DDR on both read and write ports |
| Core Supply Voltage | 1.8 V ±0.1 V - powers internal logic and memory array; requires tight regulation |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V system interfaces |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - determines minimum pipeline depth in controller design |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - enables high-density routing with controlled impedance trace support |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | Latched on rising edges of K/K; drives 18-bit parallel data into memory during active WPS |
| Q[17:0] | Synchronous read data outputs | Driven on rising edges of C/C; delivers four sequential 18-bit words per burst |
| WPS | Write port select (active low) | Enables write operation; deassertion ignores D[17:0] and prevents unintended writes |
| RPS | Read port select (active low) | Initiates read burst; deassertion tristates Q[17:0] after pending burst completes |
| K / K | Positive/negative input clocks | Capture all synchronous inputs (address, data, controls); rising edges define timing reference |
| C / C | Positive/negative output clocks | Source timing for Q[17:0] output valid windows; used with CQ/CQ for source-synchronous capture |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies of C/C; simplify FPGA/ASIC data capture timing closure |
| DOFF | Read latency mode control | HIGH → 1.5-cycle latency (QDR II); LOW → 1-cycle latency (QDR I backward compatibility) |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune Q[17:0]/CQ/CQ drive strength to match board trace Z₀ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround overhead and contention, enabling true concurrent R/W at full bandwidth |
| Four-word burst architecture | Reduces address bus toggling by 75% vs. single-word access - lowers EMI and simplifies controller address generation |
| Source-synchronous echo clocks (CQ/CQ) | Enable deterministic setup/hold timing at 666 MT/s without complex PCB length matching across multiple devices |
| Programmable output impedance (ZQ) | Allows dynamic tuning of Q[17:0] and CQ/CQ edge rates to match system trace impedance - improves signal integrity |
| JTAG 1149.1 boundary scan | Supports IEEE-compliant test access for interconnect verification and production ICT without additional test fixtures |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet switch ASICs. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer interfacing directly with MAC and traffic manager logic. Use Value: Concurrent read/write eliminates arbitration stalls; 666 MT/s bandwidth sustains line-rate packet processing without backpressure. |
Use Scenario: Offloading compute-intensive filtering or lookup tasks from FPGA fabric using tightly coupled memory. IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed simultaneously by multiple FPGA pipeline stages. Use Value: 1.5-cycle read latency and echo-clock–assisted capture enable reliable timing closure at 333 MHz system clock. |
| Telecom Line Card Buffer | High-Speed Test Equipment Memory |
Use Scenario: Holding frame-aligned TDM or OTN payloads in multi-port SONET/SDH line interface units. IC Role / Device Role / Timing Role: Synchronous burst memory synchronized to line clock domain via K/K and C/C inputs. Use Value: Independent RPS/WPS allows interleaved buffering of upstream/downstream streams without software coordination. |
Use Scenario: Capturing high-fidelity waveform samples in automated test equipment with real-time pattern analysis. IC Role / Device Role / Timing Role: High-bandwidth acquisition memory feeding FPGA-based FFT or correlation engines. Use Value: Four-word burst reduces controller address rate by factor of 4 - easing timing constraints on sample clock domain crossing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PA | 144-Mbit QDR II+, 250 MHz max, 1.5 V core, ×36 only, no ZQ calibration | Lower speed; lacks impedance tuning and echo clock flexibility; limited to 36-bit interface | Select if system operates ≤250 MHz and uses 36-bit datapath; avoid for 18-bit or >300 MHz designs |
| ISSI IS61QW25636A-300BQ | 256-Mbit QDR II, 300 MHz, 1.8 V core, ×36 only, no DOFF latency selection | Higher density but fixed 1-cycle latency; no QDR I compatibility mode; incompatible pinout | Consider only for new 300 MHz ×36 designs needing >144 Mbit; not drop-in or functional substitute |
Compared with IDT72T3615L10PA and IS61QW25636A-300BQ, CY7C1648KV18-400BZXC uniquely supports 333 MHz operation, 18-bit ×8M configuration, programmable ZQ impedance, and selectable 1/1.5-cycle read latency - making it optimal for bandwidth-constrained, mixed-voltage telecom and FPGA-attached buffer applications.
Availability
CY7C1648KV18-400BZXC is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor caches, telecom line card buffers, and high-speed test equipment requiring stable component supply, long-lifecycle assurance, and consistent FBGA packaging.
Supply support for CY7C1648KV18-400BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1648KV18-400BZXC belongs to Cypress's QDR II SRAM product line, engineered specifically for ultra-low-latency, concurrent-access memory subsystems in networking infrastructure and high-end test instrumentation where deterministic timing and bus efficiency are critical.
FAQ
What is the function of the DOFF pin on CY7C1648KV18-400BZXC?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables QDR II mode with 1.5-cycle read latency; when LOW, it reverts to QDR I compatibility mode with 1-cycle latency. This setting is sampled synchronously on the rising edge of K and remains latched until next power-up or reset. It does not affect write timing or burst structure.
Can CY7C1648KV18-400BZXC operate with only a single clock domain?
Yes - the device supports single-clock mode where K and C are tied together (and K and C tied together), allowing simplified timing with one pair of differential clocks. In this mode, Q[17:0] is clocked by K/K instead of C/C, and CQ/CQ are generated relative to K/K. All timing parameters shift accordingly, and read latency remains configurable via DOFF.
How is output impedance calibrated using the ZQ pin?
ZQ connects to an external precision resistor (typically 240 Ω) between ZQ and ground, enabling on-die calibration of Q[17:0] and CQ/CQ driver impedance to 0.2 × RQ (≈48 Ω). This matches standard PCB trace impedances and minimizes reflections. Connecting ZQ directly to VDDQ enables minimum-impedance (strongest drive) mode; floating or grounding ZQ is prohibited and may cause malfunction.
Is CY7C1648KV18-400BZXC pin-compatible with other Cypress QDR II SRAMs?
No - CY7C1648KV18-400BZXC is not pin-compatible with CY7C1613KV18 or CY7C1615KV18 despite sharing the same FBGA package footprint. Pin assignments differ significantly (e.g., BWS[1:0] placement, CQ/CQ location, and VREF routing), and the 165-ball mapping is unique to this variant. Board-level reuse requires full schematic and layout revision.
CY7C1648KV18-400BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II+
- Memory Size:
- 144Mbit
- Memory Organization:
- 8M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1648KV18-400BZXC FAQ
1.How can I place an order for CY7C1648KV18-400BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1648KV18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1648KV18-400BZXC reliable?
The price and inventory of CY7C1648KV18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1648KV18-400BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1648KV18-400BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1648KV18-400BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1648KV18-400BZXC?
CY7C1648KV18-400BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1648KV18-400BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1648KV18-400BZXC?
For technical support, including CY7C1648KV18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1648KV18-400BZXC requirements.
6.How does Aetrix verify that CY7C1648KV18-400BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1648KV18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1648KV18-400BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1648KV18-400BZXC?
All CY7C1648KV18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1648KV18-400BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1648KV18-400BZXC part is unused and in its original packaging.
Return procedure for CY7C1648KV18-400BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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