Infineon Technologies CY7C1650KV18-400BZC

Overview

CY7C1650KV18-400BZC from Cypress Semiconductor is a 144-Mbit QDR® II SRAM with 8 M × 18 organization, 333 MHz clock frequency, 1.8 V core supply (VDD), and 1.4–1.8 V I/O supply (VDDQ), packaged in a 165-ball FBGA (15 × 17 × 1.4 mm). It implements separate read/write ports with DDR interfaces on both, four-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking line cards and packet buffers.

For engineers reviewing the CY7C1650KV18-400BZC datasheet, CY7C1650KV18-400BZC pinout, CY7C1650KV18-400BZC application, or CY7C1650KV18-400BZC equivalent, key selection criteria include concurrent read/write capability, 1.5-cycle read latency (DOFF = high), HSTL-18-compatible I/O drive, PLL-based timing accuracy, and depth expansion support via RPS/WPS control.

Technical Context

The device uses true dual-port QDR II architecture with independent K/K input clocks for address/data capture and C/C output clocks for synchronized data launch. Its internal pipelined structure enables full concurrency: reads and writes occur simultaneously without bus turnaround or arbitration delay.

It integrates a PLL for precise data placement, echo clocks (CQ/CQ) referenced to C/C for receiver deskew, and programmable output impedance via ZQ pin tied to external resistor. The DOFF pin selects between 1.5-cycle (QDR II mode) and 1-cycle (QDR I compatibility) read latency - a hardware-configurable timing trade-off.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36120L10BG and IS61WV102418B, CY7C1650KV18-400BZC uniquely balances 333 MHz QDR II performance, 1.8 V core compatibility, and FBGA packaging - making it optimal for space-constrained, mixed-voltage telecom and networking designs requiring deterministic dual-port access.

Availability

CY7C1650KV18-400BZC is available at Aetrix Electronics and suitable for network packet buffers, telecom line card memory, and baseband processing caches requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1650KV18-400BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1650KV18-400BZC belongs to Cypress's QDR II SRAM product line, designed specifically for high-speed, low-latency, concurrent-access applications in networking infrastructure and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1650KV18-400BZC?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted high, the device operates in QDR II mode with 1.5-cycle read latency; when low, it reverts to QDR I mode with 1-cycle latency. This is a static hardware configuration - no register write is needed, and the setting takes effect immediately after reset or power-up.

Can CY7C1650KV18-400BZC operate with only one clock (K) instead of differential K/K?

Yes - the device supports single-clock mode where K serves as both positive and negative clock reference. In this mode, C and C must be driven identically, and CQ/CQ derive from K. However, differential K/K is strongly recommended for noise immunity and timing margin at 333 MHz; single-clock mode reduces maximum reliable frequency and skew tolerance.

How does the ZQ pin affect signal integrity in high-speed layouts?

The ZQ pin calibrates output driver impedance to match the PCB trace characteristic impedance (typically 50 Ω). When tied to a precision resistor (e.g., 240 Ω) to ground, it sets Q[17:0] and CQ/CQ output strength to 0.2 × RQ (≈48 Ω), minimizing reflections and improving eye diagram margins. Leaving ZQ unconnected or shorted to GND violates specification and causes undefined drive strength.

Is JTAG boundary scan supported on CY7C1650KV18-400BZC, and how is it enabled?

Yes - the device implements IEEE 1149.1 JTAG TAP with TDI, TDO, TCK, and TMS pins. JTAG is always active after power-up unless disabled via the JTAG_DISABLE fuse (one-time programmable). No external pull-ups or configuration pins are required; boundary scan testing follows standard IR/DR sequences defined in the datasheet's TAP section.