Infineon Technologies CY7C1665KV18-550BZXC
- Part No.:
- CY7C1665KV18-550BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1665KV18-550BZXC.pdf
- Description:
- IC SRAM 144MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,096
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Product details
Overview
CY7C1665KV18 from Cypress Semiconductor is a 4 M × 36, 144-Mbit QDR® II+ SRAM with separate read/write ports, 550-MHz clock operation (1100-MHz DDR data rate), 2.5-cycle read latency, and HSTL I/O compatible with 1.4–1.8-V VDDQ. It delivers full data coherency and supports concurrent read/write transactions in high-bandwidth networking buffers.
For engineers reviewing the CY7C1665KV18 datasheet, CY7C1665KV18 pinout, CY7C1665KV18 application, or CY7C1665KV18 equivalent, key selection criteria include its QDR II+ burst architecture, echo-clock–assisted timing capture, DOFF-configurable latency mode, and 165-ball FBGA package with ZQ impedance tuning.
Technical Context
The CY7C1665KV18 implements a synchronous pipelined QDR II+ architecture with independent read and write ports sharing a multiplexed 20-bit address bus. It uses dual input clocks (K/K) for DDR edge-aligned data transfers and echo clocks (CQ/CQ) to simplify high-speed data capture at 1100 MHz.
Its internal organization comprises four 1 M × 36 memory arrays; depth expansion is enabled via RPS/WPS and four byte-write selects (BWS[3:0]). The PLL ensures precise data placement, and DOFF pin toggles between 2.5-cycle QDR II+ mode (550 MHz) and 1-cycle QDR I mode (≤167 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 144 Mbit (4 M × 36) |
| Max Clock Frequency | 550 MHz - enables 1100 MT/s DDR bandwidth per port |
| Read Latency | 2.5 cycles (DOFF = high) - deterministic timing for pipeline synchronization |
| I/O Voltage Range | VDDQ = 1.4 V to 1.8 V - supports both 1.5-V and 1.8-V HSTL-18/15 systems |
| Core Supply | VDD = 1.8 V ± 0.1 V - low-power, noise-immune core operation |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - fine-pitch, thermally optimized for high-speed routing |
| Impedance Control | ZQ pin tunes output driver impedance to 0.2 × RQ - eliminates external termination resistors |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Write data inputs | 36-bit synchronous inputs sampled on rising edges of K/K; support byte-selectable writes via BWS[3:0] |
| Q[35:0] | Read data outputs | 36-bit DDR outputs edge-aligned with CQ/CQ; tristated when RPS is deasserted |
| RPS / WPS | Port select controls | Active-low synchronous enables for independent read/write port activation |
| BWS[3:0] | Byte write selects | Four independent active-low signals controlling 9-bit byte lanes (D[8:0] through D[35:27]) |
| K / K | Dual input clocks | Rising-edge–triggered clocks for all synchronous operations; K drives read path, K drives write path |
| CQ / CQ | Echo clocks | Free-running, phase-matched copies of K/K - used by FPGA/ASIC to latch Q[35:0] reliably at 1100 MT/s |
| QVLD | Valid data indicator | Asserted synchronously with first valid Q[35:0] word in burst - eliminates need for fixed delay-based capture logic |
| ZQ | Impedance calibration input | Connects to external resistor to ground to set output driver strength matching PCB trace impedance |
| DOFF | PLL disable control | Low disables PLL, reverting device to QDR I timing (1-cycle latency, ≤167 MHz); high enables QDR II+ mode |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround overhead and contention - enables true concurrent access without arbitration logic |
| Four-word burst architecture | Reduces effective address bus frequency by 4× - lowers routing complexity and timing closure burden on host controller |
| Integrated PLL with echo clocks | Enables deterministic 550-MHz operation with CQ/CQ providing system-level timing reference for reliable DDR capture |
| Programmable output impedance (ZQ) | Removes need for discrete series termination resistors - simplifies layout and improves signal integrity across temperature/voltage |
| JTAG 1149.1 test access port | Supports boundary-scan testing and in-system programming - critical for high-reliability telecom and aerospace board validation |
Applications
| Packet Buffer in 10G/25G Ethernet Switch ASIC | Line Card Memory in Telecom Baseband Processing |
|---|---|
Use Scenario: Stores ingress/egress packet headers and metadata in multi-port switch fabric with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-turnaround buffer between ingress parser and egress scheduler; QVLD and CQ enable cycle-accurate data capture. Use Value: 2.5-cycle latency and 1100-MT/s DDR throughput meet line-rate buffering requirements for 25Gbps interfaces without FIFO staging. | Use Scenario: Buffers IQ samples between ADC/DAC and DSP in 5G massive MIMO radio units requiring deterministic access. IC Role / Device Role / Timing Role: High-bandwidth memory interface for real-time baseband processing; DOFF pin allows fallback to QDR I mode during low-power sleep states. Use Value: 1.4–1.8-V VDDQ range and ZQ calibration maintain signal integrity across wide temperature swings in outdoor RF environments. |
| High-Frequency Trading (HFT) Network Accelerator | PCIe Gen4 Endpoint Descriptor Cache |
Use Scenario: Holds order book snapshots and market data feeds with microsecond-level update consistency. IC Role / Device Role / Timing Role: Coherent shared memory between multiple FPGA engines; full data coherency ensures latest snapshot always available on read port. Use Value: Concurrent read/write capability allows simultaneous feed ingestion and order matching without lock contention or software serialization. | Use Scenario: Caches PCIe transaction descriptors and completion queues in smart NICs and accelerators. IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM interfacing directly to PCIe controller's AXI4 stream; RPS/WPS enable depth expansion across multiple devices. Use Value: 165-ball FBGA footprint and HSTL-15 compatibility ensure signal integrity at Gen4 speeds while minimizing board layer count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150 | 4 M × 36, 550 MHz, but uses differential LVDS I/O (not HSTL); no ZQ pin; requires external termination | Suitable for backplane systems with LVDS signaling; less flexible for mixed-voltage HSTL designs | Select if system already uses LVDS infrastructure and board space permits external termination networks |
| ISSI IS61WV102436B | 1 M × 36, 333 MHz max; asynchronous interface; no echo clocks or PLL; single VDD only | Fits cost-sensitive, lower-bandwidth control-plane buffers where deterministic latency is not required | Choose only for non-real-time management functions - not for line-rate data-path use |
Compared with IDT72T36150 and IS61WV102436B, CY7C1665KV18 uniquely combines 550-MHz QDR II+ performance with HSTL-15/18 compatibility, on-die impedance tuning, and echo-clock–assisted timing - making it optimal for new high-speed serial fabric designs requiring minimal external components and guaranteed coherency.
Availability
CY7C1665KV18 is available at Aetrix Electronics and suitable for 10G/25G Ethernet switching, 5G baseband processing, high-frequency trading accelerators, and PCIe Gen4 endpoint caching requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1665KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.
The QDR® II+ SRAM product line was designed specifically for ultra-low-latency, high-throughput data-path buffering in networking, telecom, and financial infrastructure - prioritizing deterministic timing, concurrent access, and signal integrity at multi-GHz rates.
FAQ
What is the function of the DOFF pin on CY7C1665KV18?
The DOFF (PLL Disable) pin is an active-low control that disables the internal PLL. When pulled low, the device reverts to QDR I timing with 1-cycle read latency and maximum operating frequency reduced to 167 MHz. For full QDR II+ operation at 550 MHz with 2.5-cycle latency, DOFF must be held high via a ≤10-kΩ pull-up to VDDQ.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (e.g., 48 Ω). This matches standard PCB trace impedances, reducing reflections and improving eye diagram margins without discrete series termination resistors.
Can CY7C1665KV18 operate with different supply voltages on VDD and VDDQ?
Yes - VDD is strictly 1.8 V ± 0.1 V for the core logic, while VDDQ may be independently set between 1.4 V and 1.8 V to match host interface voltage (e.g., HSTL-15 at 1.5 V or HSTL-18 at 1.8 V). This dual-supply flexibility enables interoperability with diverse FPGA I/O banks without level-shifting circuitry.
What is the purpose of the QVLD signal, and how is it timed relative to data?
QVLD is a synchronous output that asserts one cycle before the first valid data word appears on Q[35:0] in each read burst. It is edge-aligned with CQ and CQ, providing a clean, jitter-free strobe for capturing the full four-word burst - eliminating setup/hold uncertainty and enabling robust DDR sampling in FPGA logic without manual delay tuning.
CY7C1665KV18-550BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 144Mbit
- Memory Organization:
- 4M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 550 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1665KV18-550BZXC FAQ
1.How can I place an order for CY7C1665KV18-550BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1665KV18-550BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1665KV18-550BZXC reliable?
The price and inventory of CY7C1665KV18-550BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1665KV18-550BZXC is usually 5 days.
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Once your CY7C1665KV18-550BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1665KV18-550BZXC?
For technical support, including CY7C1665KV18-550BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1665KV18-550BZXC requirements.
6.How does Aetrix verify that CY7C1665KV18-550BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1665KV18-550BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1665KV18-550BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1665KV18-550BZXC?
All CY7C1665KV18-550BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1665KV18-550BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1665KV18-550BZXC part is unused and in its original packaging.
Return procedure for CY7C1665KV18-550BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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