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Infineon Technologies CY7C1665KV18-550BZXC

Part No.:
CY7C1665KV18-550BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1665KV18-550BZXC.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,096

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Product details

Overview

CY7C1665KV18 from Cypress Semiconductor is a 4 M × 36, 144-Mbit QDR® II+ SRAM with separate read/write ports, 550-MHz clock operation (1100-MHz DDR data rate), 2.5-cycle read latency, and HSTL I/O compatible with 1.4–1.8-V VDDQ. It delivers full data coherency and supports concurrent read/write transactions in high-bandwidth networking buffers.

For engineers reviewing the CY7C1665KV18 datasheet, CY7C1665KV18 pinout, CY7C1665KV18 application, or CY7C1665KV18 equivalent, key selection criteria include its QDR II+ burst architecture, echo-clock–assisted timing capture, DOFF-configurable latency mode, and 165-ball FBGA package with ZQ impedance tuning.

Technical Context

The CY7C1665KV18 implements a synchronous pipelined QDR II+ architecture with independent read and write ports sharing a multiplexed 20-bit address bus. It uses dual input clocks (K/K) for DDR edge-aligned data transfers and echo clocks (CQ/CQ) to simplify high-speed data capture at 1100 MHz.

Its internal organization comprises four 1 M × 36 memory arrays; depth expansion is enabled via RPS/WPS and four byte-write selects (BWS[3:0]). The PLL ensures precise data placement, and DOFF pin toggles between 2.5-cycle QDR II+ mode (550 MHz) and 1-cycle QDR I mode (≤167 MHz).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density144 Mbit (4 M × 36)
Max Clock Frequency550 MHz - enables 1100 MT/s DDR bandwidth per port
Read Latency2.5 cycles (DOFF = high) - deterministic timing for pipeline synchronization
I/O Voltage RangeVDDQ = 1.4 V to 1.8 V - supports both 1.5-V and 1.8-V HSTL-18/15 systems
Core SupplyVDD = 1.8 V ± 0.1 V - low-power, noise-immune core operation
Package165-ball FBGA (15 × 17 × 1.4 mm) - fine-pitch, thermally optimized for high-speed routing
Impedance ControlZQ pin tunes output driver impedance to 0.2 × RQ - eliminates external termination resistors

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm, Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Write data inputs36-bit synchronous inputs sampled on rising edges of K/K; support byte-selectable writes via BWS[3:0]
Q[35:0]Read data outputs36-bit DDR outputs edge-aligned with CQ/CQ; tristated when RPS is deasserted
RPS / WPSPort select controlsActive-low synchronous enables for independent read/write port activation
BWS[3:0]Byte write selectsFour independent active-low signals controlling 9-bit byte lanes (D[8:0] through D[35:27])
K / KDual input clocksRising-edge–triggered clocks for all synchronous operations; K drives read path, K drives write path
CQ / CQEcho clocksFree-running, phase-matched copies of K/K - used by FPGA/ASIC to latch Q[35:0] reliably at 1100 MT/s
QVLDValid data indicatorAsserted synchronously with first valid Q[35:0] word in burst - eliminates need for fixed delay-based capture logic
ZQImpedance calibration inputConnects to external resistor to ground to set output driver strength matching PCB trace impedance
DOFFPLL disable controlLow disables PLL, reverting device to QDR I timing (1-cycle latency, ≤167 MHz); high enables QDR II+ mode

Key Features

FeatureDesign Value
Separate read/write portsEliminates data bus turnaround overhead and contention - enables true concurrent access without arbitration logic
Four-word burst architectureReduces effective address bus frequency by 4× - lowers routing complexity and timing closure burden on host controller
Integrated PLL with echo clocksEnables deterministic 550-MHz operation with CQ/CQ providing system-level timing reference for reliable DDR capture
Programmable output impedance (ZQ)Removes need for discrete series termination resistors - simplifies layout and improves signal integrity across temperature/voltage
JTAG 1149.1 test access portSupports boundary-scan testing and in-system programming - critical for high-reliability telecom and aerospace board validation

Applications

Packet Buffer in 10G/25G Ethernet Switch ASICLine Card Memory in Telecom Baseband Processing

Use Scenario: Stores ingress/egress packet headers and metadata in multi-port switch fabric with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-turnaround buffer between ingress parser and egress scheduler; QVLD and CQ enable cycle-accurate data capture.

Use Value: 2.5-cycle latency and 1100-MT/s DDR throughput meet line-rate buffering requirements for 25Gbps interfaces without FIFO staging.

Use Scenario: Buffers IQ samples between ADC/DAC and DSP in 5G massive MIMO radio units requiring deterministic access.

IC Role / Device Role / Timing Role: High-bandwidth memory interface for real-time baseband processing; DOFF pin allows fallback to QDR I mode during low-power sleep states.

Use Value: 1.4–1.8-V VDDQ range and ZQ calibration maintain signal integrity across wide temperature swings in outdoor RF environments.

High-Frequency Trading (HFT) Network AcceleratorPCIe Gen4 Endpoint Descriptor Cache

Use Scenario: Holds order book snapshots and market data feeds with microsecond-level update consistency.

IC Role / Device Role / Timing Role: Coherent shared memory between multiple FPGA engines; full data coherency ensures latest snapshot always available on read port.

Use Value: Concurrent read/write capability allows simultaneous feed ingestion and order matching without lock contention or software serialization.

Use Scenario: Caches PCIe transaction descriptors and completion queues in smart NICs and accelerators.

IC Role / Device Role / Timing Role: Low-latency, burst-capable SRAM interfacing directly to PCIe controller's AXI4 stream; RPS/WPS enable depth expansion across multiple devices.

Use Value: 165-ball FBGA footprint and HSTL-15 compatibility ensure signal integrity at Gen4 speeds while minimizing board layer count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II+ SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T361504 M × 36, 550 MHz, but uses differential LVDS I/O (not HSTL); no ZQ pin; requires external terminationSuitable for backplane systems with LVDS signaling; less flexible for mixed-voltage HSTL designsSelect if system already uses LVDS infrastructure and board space permits external termination networks
ISSI IS61WV102436B1 M × 36, 333 MHz max; asynchronous interface; no echo clocks or PLL; single VDD onlyFits cost-sensitive, lower-bandwidth control-plane buffers where deterministic latency is not requiredChoose only for non-real-time management functions - not for line-rate data-path use

Compared with IDT72T36150 and IS61WV102436B, CY7C1665KV18 uniquely combines 550-MHz QDR II+ performance with HSTL-15/18 compatibility, on-die impedance tuning, and echo-clock–assisted timing - making it optimal for new high-speed serial fabric designs requiring minimal external components and guaranteed coherency.

Availability

CY7C1665KV18 is available at Aetrix Electronics and suitable for 10G/25G Ethernet switching, 5G baseband processing, high-frequency trading accelerators, and PCIe Gen4 endpoint caching requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1665KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

The QDR® II+ SRAM product line was designed specifically for ultra-low-latency, high-throughput data-path buffering in networking, telecom, and financial infrastructure - prioritizing deterministic timing, concurrent access, and signal integrity at multi-GHz rates.

FAQ

What is the function of the DOFF pin on CY7C1665KV18?

The DOFF (PLL Disable) pin is an active-low control that disables the internal PLL. When pulled low, the device reverts to QDR I timing with 1-cycle read latency and maximum operating frequency reduced to 167 MHz. For full QDR II+ operation at 550 MHz with 2.5-cycle latency, DOFF must be held high via a ≤10-kΩ pull-up to VDDQ.

How does the ZQ pin affect signal integrity in high-speed designs?

The ZQ pin connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (e.g., 48 Ω). This matches standard PCB trace impedances, reducing reflections and improving eye diagram margins without discrete series termination resistors.

Can CY7C1665KV18 operate with different supply voltages on VDD and VDDQ?

Yes - VDD is strictly 1.8 V ± 0.1 V for the core logic, while VDDQ may be independently set between 1.4 V and 1.8 V to match host interface voltage (e.g., HSTL-15 at 1.5 V or HSTL-18 at 1.8 V). This dual-supply flexibility enables interoperability with diverse FPGA I/O banks without level-shifting circuitry.

What is the purpose of the QVLD signal, and how is it timed relative to data?

QVLD is a synchronous output that asserts one cycle before the first valid data word appears on Q[35:0] in each read burst. It is edge-aligned with CQ and CQ, providing a clean, jitter-free strobe for capturing the full four-word burst - eliminating setup/hold uncertainty and enabling robust DDR sampling in FPGA logic without manual delay tuning.

CY7C1665KV18-550BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
144Mbit
Memory Organization:
4M x 36
Memory Interface:
Parallel
Clock Frequency:
550 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1665KV18-550BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1665KV18-550BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1665KV18-550BZXC reliable?

The price and inventory of CY7C1665KV18-550BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1665KV18-550BZXC is usually 5 days.

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CY7C1665KV18-550BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1665KV18-550BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1665KV18-550BZXC?

For technical support, including CY7C1665KV18-550BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1665KV18-550BZXC requirements.

6.How does Aetrix verify that CY7C1665KV18-550BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1665KV18-550BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1665KV18-550BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1665KV18-550BZXC?

All CY7C1665KV18-550BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1665KV18-550BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1665KV18-550BZXC part is unused and in its original packaging.

Return procedure for CY7C1665KV18-550BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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