Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies CY7C187-15PXC

Name: CY7C187-15PXC
Brand: Infineon Technologies
SKU: CY7C187-15PXC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: CY7C187-15PXC

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 22-DIP (0.300", 7.62mm)

Datasheet:: CY7C187-15PXC.pdf

Description:: IC SRAM 64KBIT PARALLEL 22DIP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,939

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

CY7C187-15PXC from Cypress Semiconductor is a 64K × 1-bit (65,536-word) CMOS static RAM with 15 ns access time, TTL-compatible I/O, and automatic CE-controlled power-down. It operates at 5V ±10% over 0°C to +70°C, consumes 495 mW active and 110 mW standby power, and is packaged in a Pb-free 22-pin 300-mil DIP for legacy board-level integration in industrial control and instrumentation systems.

For engineers reviewing the CY7C187-15PXC datasheet, CY7C187-15PXC pinout, CY7C187-15PXC application, or CY7C187-15PXC equivalent, key selection criteria include verified 15 ns read/write timing, CE/WE dual-control logic, high-impedance output behavior during deselect, and compatibility with 5V TTL bus interfaces in memory expansion architectures.

Technical Context

The CY7C187-15PXC implements a full CMOS SRAM core with separate address decoding (A0–A15), single-bit bidirectional data path (DIN/DOUT), and dual enable control via active-low Chip Enable (CE) and Write Enable (WE). Its automatic power-down reduces ICC by 56% when CE is HIGH, and output drivers enter high-Z state under either CE HIGH or WE LOW conditions.

Timing is defined by overlapping CE and WE assertions for write cycles, with tAA = tACE = 15 ns (max), tLZCE = 3 ns, and tHZCE = 8 ns. The device uses die coating for alpha-particle immunity and supports standard 30-pF AC test loads with 5 ns input transition times and 1.5 V timing reference levels.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	64K × 1-bit (65,536 words × 1 bit); enables simple bit-slice expansion without data bus width conversion.
Access Time (tAA)	15 ns max; guarantees valid data on DOUT within 15 ns after stable address and CE assertion in read mode.
Supply Voltage	5V ±10%; compatible with standard TTL logic rails and eliminates need for voltage translation in mixed-logic systems.
Active Current (ICC)	90 mA max at VCC = 5.5V; corresponds to 495 mW typical active power, suitable for low-to-moderate duty-cycle memory access.
Standby Current (ISB1)	40 µA max at VCC = 5.5V and CE ≥ VIH; enables ultra-low quiescent power during idle periods in battery-backed or energy-sensitive designs.
Output Drive	IOH = –4.0 mA / IOL = 12.0 mA; meets TTL voltage thresholds (VOH ≥ 2.4 V, VOL ≤ 0.4 V) for direct interfacing with 74LS/74HC logic families.
Input Compatibility	VIH = 2.2 V min, VIL = 0.8 V max; ensures reliable recognition of TTL-level inputs without external level-shifting circuitry.

Pinout & Package

Package: 22-pin 300-mil molded DIP (Pb-free), JEDEC MS-001 variant, body width 0.310–0.385 inches, lead pitch 0.100 inch.

Pin/Terminal	Circuit Role	Design Meaning
A0–A15	Address Inputs	16-bit address bus accepting 0x0000–0xFFFF; fully decoded to select one of 65,536 memory locations.
DIN	Data Input	Single-bit serial input during write cycles when CE and WE are both LOW; latched on WE rising edge.
DOUT	Data Output	Tri-state buffered output enabled only when CE = LOW and WE = HIGH; high-impedance otherwise.
CE	Chip Enable	Active-low global enable; asserts memory access and disables automatic power-down when LOW; pulls device into 40 µA standby when HIGH.
WE	Write Enable	Active-low write control; initiates write when CE and WE both LOW; forces DOUT to high-Z if asserted during read.
VCC	Power Supply	+5V supply pin (Pin 22); requires local 0.1 µF ceramic decoupling adjacent to pin per layout best practice.
GND	Ground	Reference ground (Pin 11); must be connected to system common ground plane with low-inductance path.

Key Features

Feature	Design Value
15 ns access time	Enables direct interface with 66 MHz CPU buses without wait states in legacy microcontroller systems.
Automatic CE power-down	Reduces standby current to 40 µA without external control logic-no software or hardware sequencing required.
TTL-compatible I/O	Eliminates level translators when interfacing with 74LS, 74F, or early 8051/8085 family peripherals and address latches.
Alpha-immune die coating	Meets industrial reliability requirements for operation in radiation-prone environments (e.g., medical imaging, aerospace avionics).
Pb-free 22-pin DIP packaging	Supports RoHS-compliant rework and hand-soldering in prototyping and low-volume manufacturing without lead contamination risk.

Applications

Industrial PLC Memory Expansion

Legacy Test Equipment Data Buffer

Use Scenario: Adding non-volatile scratchpad memory to a programmable logic controller with limited on-board RAM and no external bus arbitration.

IC Role / Device Role / Timing Role: Standalone 1-bit-wide SRAM providing fast, deterministic read/write access for real-time I/O status logging and intermediate calculation storage.

Use Value: 15 ns access time avoids CPU wait states; CE-driven power-down cuts background power draw during scan-idle cycles by >50%.

Use Scenario: Capturing transient analog-to-digital samples in automated test equipment where burst-mode acquisition requires deterministic latency.

IC Role / Device Role / Timing Role: Bit-serial buffer staging digitized waveform segments before parallel transfer to host controller via shared address/data bus.

Use Value: Tri-state DOUT and precise tHZCE (8 ns) ensure clean bus release between capture and upload phases without contention.

Military Communications Radio Firmware Cache

Medical Diagnostic Imaging Control FIFO

Use Scenario: Storing firmware patch tables in secure radio transceivers operating in harsh EMI environments with strict power budgets.

IC Role / Device Role / Timing Role: High-reliability static RAM holding critical decryption keys and protocol state variables accessible on-demand with zero refresh overhead.

Use Value: Alpha-immune die coating prevents soft errors in airborne platforms; 40 µA ISB1 supports >10-year battery backup life.

Use Scenario: Implementing a line-buffer FIFO in ultrasound beamforming modules requiring glitch-free data flow between ADC and DSP stages.

IC Role / Device Role / Timing Role: Synchronous 1-bit delay element synchronized to pixel clock, using CE/WE handshaking to absorb timing skew between subsystems.

Use Value: Matched tLZCE (3 ns) and tHZCE (8 ns) minimize metastability window during clock-domain crossing in safety-critical imaging paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
AS6C1008-15PCN	64K × 1-bit, 15 ns, 5V, 28-pin SOIC; higher pin count, no DIP option, lower standby current (1 µA).	Requires PCB redesign for SOIC footprint; better suited for new designs targeting space-constrained layouts.	Select when migrating from through-hole to surface-mount and ultra-low standby (<1 µA) is mandatory.
HM628128ALP-15	128K × 8-bit, 15 ns, 5V, 28-pin DIP; wider data bus, double density, higher active power (120 mA).	Delivers byte-wide access instead of bit-wide; incompatible with existing 1-bit bus architecture without glue logic.	Select only if system requires 8-bit parallel access and board layout allows 28-pin DIP and additional decoupling.

Compared with AS6C1008-15PCN and HM628128ALP-15, the CY7C187-15PXC uniquely preserves legacy 22-pin DIP compatibility while delivering verified 15 ns timing and TTL-level interoperability-critical for drop-in replacement in fielded industrial and military hardware.

Availability

CY7C187-15PXC is available at Aetrix Electronics and suitable for industrial PLC upgrades, legacy test equipment repair, and military radio refurbishment requiring stable component supply and long-term obsolescence management.

Supply support for CY7C187-15PXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C187 belongs to Cypress's legacy parallel SRAM product line, designed specifically for bit-slice memory expansion in resource-constrained 8/16-bit microprocessor systems requiring deterministic timing and minimal external logic.

FAQ

What is the maximum clock frequency supported by CY7C187-15PXC?

The CY7C187-15PXC does not use a clock signal-it is an asynchronous SRAM. Its maximum usable cycle rate is determined by tRC (read cycle time) of 15 ns, supporting up to ~66.7 MHz continuous random-access operation when CE and address are stable. No internal oscillator or clock input exists.

Can CY7C187-15PXC operate at 3.3V?

No. The CY7C187-15PXC is specified only for 5V ±10% (4.5V–5.5V) operation. Its input thresholds (VIH = 2.2 V min), output drive strength, and internal logic are optimized for 5V TTL compatibility. Operation at 3.3V violates Absolute Maximum Ratings and will result in undefined behavior or failure.

Is a pull-up resistor required on the CE pin?

Yes. A pull-up resistor to VCC is required on CE to ensure the device remains deselected and in low-power mode during power-up. Without it, ISB1 may exceed 40 µA due to indeterminate CE state, risking excessive current draw and potential bus contention before system initialization completes.

Does CY7C187-15PXC support battery backup operation?

Yes-its 40 µA ISB1 standby current at 5.5V enables multi-year operation from coin-cell batteries when paired with appropriate power-switching circuitry. However, the device lacks built-in battery-switchover logic; external diode-or or PMOS-based backup switching must be implemented per application requirements.

CY7C187-15PXC Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 22-DIP (0.300", 7.62mm)

Packaging:: Tube

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Asynchronous

Memory Size:: 64Kbit

Memory Organization:: 64K x 1

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 15ns

Access Time:: 15 ns

Voltage - Supply:: 4.5V ~ 5.5V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: 22-PDIP

CY7C187-15PXC FAQ

1.How can I place an order for CY7C187-15PXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C187-15PXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C187-15PXC reliable?

The price and inventory of CY7C187-15PXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C187-15PXC is usually 5 days.

3.What payment methods are accepted for CY7C187-15PXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C187-15PXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C187-15PXC?

CY7C187-15PXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C187-15PXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C187-15PXC?

For technical support, including CY7C187-15PXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C187-15PXC requirements.

6.How does Aetrix verify that CY7C187-15PXC is sourced from the original manufacturer or authorized distributors?

All CY7C187-15PXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C187-15PXC meets industry standards.

7.What is the process for return or replacement of CY7C187-15PXC?

All CY7C187-15PXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C187-15PXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C187-15PXC part is unused and in its original packaging.

Return procedure for CY7C187-15PXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…