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Infineon Technologies CY7C1911KV18-250BZCT

Part No.:
CY7C1911KV18-250BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1911KV18-250BZCT.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,521

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Product details

Overview

CY7C1911KV18-250BZCT from Cypress Semiconductor is a 2-Mbit × 9 (18-Mbit total) QDR® II SRAM with separate read/write ports, 250 MHz clock operation (500 MT/s DDR), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write transactions with four-word burst and echo clocks (CQ/CQ) for high-speed data capture in network packet buffers and baseband processing.

For engineers reviewing the CY7C1911KV18-250BZCT datasheet, CY7C1911KV18-250BZCT pinout, CY7C1911KV18-250BZCT application, or CY7C1911KV18-250BZCT equivalent, key selection factors include its 2M × 9 organization, DOFF-controlled 1-cycle vs. 1.5-cycle read latency, HSTL-compatible output drive, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility with high-density routing constraints.

Technical Context

This QDR II SRAM implements dual independent synchronous ports: write port latches D[8:0] on rising K/K edges, while read port drives Q[8:0] on rising C/C edges - enabling true concurrent access without bus turnaround. Its internal 4-array architecture (each 512K × 9) supports depth expansion via RPS/WPS controls and byte-level write masking via BWS0.

The device uses an on-chip PLL for precise data placement and includes JTAG 1149.1 test access, programmable impedance (ZQ), and VREF-referenced HSTL I/O. Echo clocks CQ/CQ are phase-aligned to output data edges, reducing timing margin burden in 500 MT/s systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 2 M × 9 (18-Mbit total); enables 9-bit wide data path for parity-aware networking buffers
Max Clock Frequency 250 MHz (K/K and C/C inputs); supports 500 MT/s effective throughput with DDR interface
Read Latency Selectable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH); critical for pipeline alignment in switch ASICs
Supply Voltages VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5 V or 1.8 V logic domains
Burst Length Four-word burst per address; reduces address bus toggling frequency by 75% versus single-word access
Package 165-ball FBGA (13 × 15 × 1.4 mm); compatible with standard 0.8-mm pitch PCB assembly processes
Output Interface HSTL Class I outputs with programmable drive strength and ZQ calibration; ensures signal integrity at 500 MT/s

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[8:0] Synchronous write data inputs Sampled on rising edge of K/K; 9-bit parallel input for burst writes
Q[8:0] Synchronous read data outputs Driven on rising edge of C/C; 9-bit parallel output with echo-clock alignment
WPS Write port select (active LOW) Enables write operations; deassertion blocks D[8:0] latching and write execution
RPS Read port select (active LOW) Enables read operations; deassertion disables Q[8:0] output drivers
BWS0 Byte write select 0 (active LOW) Controls write enable for full 9-bit D[8:0]; no nibble-level control in ×9 mode
K / K Input clocks for write/read address and data setup Dual-phase clocks used for DDR timing; only rising edges sampled for synchronization
C / C Output clocks for read data timing Phase-matched to Q[8:0] edges; used with CQ/CQ for source-synchronous capture
CQ / CQ Echo clocks Output copies of C/C, aligned to Q[8:0] valid windows; simplify high-speed FPGA receiver design
DOFF Read latency control HIGH → 1.5-cycle latency; LOW → 1-cycle latency; sets pipeline depth for system timing closure
VREF Reference voltage input Supplies mid-point reference for HSTL input receivers; must be externally decoupled
ZQ Impedance calibration terminal Connects to external 240 Ω resistor to ground for output driver impedance tuning

Key Features

Feature Design Value
Separate read/write data ports Eliminates bus turnaround overhead; enables simultaneous 500 MT/s read + write in packet buffering
Four-word burst architecture Reduces address bus frequency to 125 MHz for 250 MHz clock; lowers routing congestion and EMI
Programmable read latency (DOFF) Supports both 1-cycle (low-latency control plane) and 1.5-cycle (high-throughput data plane) modes
HSTL Class I I/O with ZQ calibration Ensures consistent 25–35 Ω output impedance across voltage/temperature; meets JEDEC HSTL-I spec
JTAG 1149.1 boundary scan Enables production test and debug of high-speed memory interconnects without physical probe access

Applications

Network Packet Buffering Baseband Signal Processing

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decision and egress scheduling.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer with concurrent read/write capability for cut-through switching.

Use Value: 500 MT/s throughput and 1-cycle latency (DOFF = LOW) enable sub-100 ns frame buffering with zero backpressure on line-rate 10G interfaces.

Use Scenario: Temporary storage of FFT/IFFT coefficients and channel estimation data in LTE/5G baseband FPGAs.

IC Role / Device Role / Timing Role: Dual-port scratchpad memory interfacing between DSP engine and DMA controller in real-time PHY layer pipelines.

Use Value: Four-word burst and echo clocks (CQ/CQ) reduce FPGA timing closure effort while sustaining >4 Gbps sustained bandwidth per port.

Telecom Line Card Memory High-Speed Test Equipment Buffer

Use Scenario: Holding time-division multiplexed (TDM) voice samples and signaling messages in carrier-grade VoIP gateways.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access for TDM frame assembly/disassembly engines.

Use Value: 1.8 V core + 1.5 V I/O compatibility simplifies power delivery alongside TI C66x DSPs; BWS0 enables selective update of CRC fields without full-word rewrite.

Use Scenario: Capturing high-fidelity analog waveform samples at 1+ GS/s in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Deep, fast-access memory staging buffer between ADC/DAC interfaces and pattern sequencer logic.

Use Value: 165-ball FBGA footprint supports dense layout with controlled-impedance traces; ZQ calibration maintains signal fidelity across temperature drift in production test environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10PA 100 MHz max clock (200 MT/s), ×18 organization, 2.5 V I/O only, no DOFF latency control Limited to lower-bandwidth telecom control planes; incompatible with 1.8 V core systems Choose only if legacy 2.5 V infrastructure and <200 MT/s throughput suffice
ISSI IS61QW25618A-250BQI 250 MHz, ×18 organization, 1.8 V core/I/O, but lacks echo clocks (CQ/CQ) and ZQ calibration Requires tighter FPGA timing margins; no on-die impedance tuning for production yield stability Acceptable for cost-sensitive designs where board-level termination suffices and echo clock logic is implemented externally

Compared with IDT72T3615L10PA and IS61QW25618A-250BQI, CY7C1911KV18-250BZCT uniquely combines 500 MT/s throughput, 1.8 V/1.5 V flexible I/O, echo clocks for simplified capture, and ZQ calibration - making it optimal for new 10G+ networking and 5G PHY designs requiring production robustness.

Availability

CY7C1911KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, telecom line card memory, and high-speed test equipment requiring stable component supply across multi-year production cycles.

Supply support for CY7C1911KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1911KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for high-throughput, low-latency packet and signal processing applications in networking and wireless infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C1911KV18-250BZCT?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle read latency for improved timing margin in high-frequency systems; when LOW, it enables 1-cycle latency for minimal pipeline delay. This setting directly affects the number of clock cycles between address assertion and first valid Q[8:0] output, and must be fixed at power-up based on system timing budget.

Can CY7C1911KV18-250BZCT operate with only one clock domain (K = C)?

Yes - the device supports single-clock-domain operation where K and C are tied together. In this mode, all synchronous inputs (address, data, controls) are registered on K, and all outputs (Q[8:0]) are registered on the same K edge. However, echo clocks (CQ/CQ) remain functional and phase-aligned to Q[8:0], preserving their utility for source-synchronous capture even without separate C/C inputs.

How does the BWS0 pin function in ×9 configuration?

In CY7C1911KV18-250BZCT's 2M × 9 organization, BWS0 serves as the sole byte write select and is active LOW to enable writing all 9 bits of D[8:0]. Unlike ×8 or ×18 variants, there is no nibble- or multi-byte granularity - BWS0 asserts the entire 9-bit word. When deasserted, the corresponding write operation is ignored, preserving memory contents.

Is ZQ calibration required for reliable operation?

Yes - ZQ calibration is mandatory for production use. The device uses the ZQ pin to tune output driver impedance against an external 240 Ω resistor to ground. Skipping calibration results in uncontrolled output impedance (typically 45–60 Ω), causing signal reflections, timing violations, and bit errors at 500 MT/s. Calibration occurs automatically at power-up and can be retriggered via JTAG.

CY7C1911KV18-250BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
2M x 9
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1911KV18-250BZCT FAQ

1.How can I place an order for CY7C1911KV18-250BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1911KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1911KV18-250BZCT reliable?

The price and inventory of CY7C1911KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1911KV18-250BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1911KV18-250BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1911KV18-250BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1911KV18-250BZCT?

CY7C1911KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1911KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1911KV18-250BZCT?

For technical support, including CY7C1911KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1911KV18-250BZCT requirements.

6.How does Aetrix verify that CY7C1911KV18-250BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1911KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1911KV18-250BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1911KV18-250BZCT?

All CY7C1911KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1911KV18-250BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1911KV18-250BZCT part is unused and in its original packaging.

Return procedure for CY7C1911KV18-250BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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