Infineon Technologies CY7C1911KV18-250BZCT
- Part No.:
- CY7C1911KV18-250BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1911KV18-250BZCT.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1911KV18-250BZCT from Cypress Semiconductor is a 2-Mbit × 9 (18-Mbit total) QDR® II SRAM with separate read/write ports, 250 MHz clock operation (500 MT/s DDR), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write transactions with four-word burst and echo clocks (CQ/CQ) for high-speed data capture in network packet buffers and baseband processing.
For engineers reviewing the CY7C1911KV18-250BZCT datasheet, CY7C1911KV18-250BZCT pinout, CY7C1911KV18-250BZCT application, or CY7C1911KV18-250BZCT equivalent, key selection factors include its 2M × 9 organization, DOFF-controlled 1-cycle vs. 1.5-cycle read latency, HSTL-compatible output drive, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility with high-density routing constraints.
Technical Context
This QDR II SRAM implements dual independent synchronous ports: write port latches D[8:0] on rising K/K edges, while read port drives Q[8:0] on rising C/C edges - enabling true concurrent access without bus turnaround. Its internal 4-array architecture (each 512K × 9) supports depth expansion via RPS/WPS controls and byte-level write masking via BWS0.
The device uses an on-chip PLL for precise data placement and includes JTAG 1149.1 test access, programmable impedance (ZQ), and VREF-referenced HSTL I/O. Echo clocks CQ/CQ are phase-aligned to output data edges, reducing timing margin burden in 500 MT/s systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2 M × 9 (18-Mbit total); enables 9-bit wide data path for parity-aware networking buffers |
| Max Clock Frequency | 250 MHz (K/K and C/C inputs); supports 500 MT/s effective throughput with DDR interface |
| Read Latency | Selectable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH); critical for pipeline alignment in switch ASICs |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5 V or 1.8 V logic domains |
| Burst Length | Four-word burst per address; reduces address bus toggling frequency by 75% versus single-word access |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); compatible with standard 0.8-mm pitch PCB assembly processes |
| Output Interface | HSTL Class I outputs with programmable drive strength and ZQ calibration; ensures signal integrity at 500 MT/s |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[8:0] | Synchronous write data inputs | Sampled on rising edge of K/K; 9-bit parallel input for burst writes |
| Q[8:0] | Synchronous read data outputs | Driven on rising edge of C/C; 9-bit parallel output with echo-clock alignment |
| WPS | Write port select (active LOW) | Enables write operations; deassertion blocks D[8:0] latching and write execution |
| RPS | Read port select (active LOW) | Enables read operations; deassertion disables Q[8:0] output drivers |
| BWS0 | Byte write select 0 (active LOW) | Controls write enable for full 9-bit D[8:0]; no nibble-level control in ×9 mode |
| K / K | Input clocks for write/read address and data setup | Dual-phase clocks used for DDR timing; only rising edges sampled for synchronization |
| C / C | Output clocks for read data timing | Phase-matched to Q[8:0] edges; used with CQ/CQ for source-synchronous capture |
| CQ / CQ | Echo clocks | Output copies of C/C, aligned to Q[8:0] valid windows; simplify high-speed FPGA receiver design |
| DOFF | Read latency control | HIGH → 1.5-cycle latency; LOW → 1-cycle latency; sets pipeline depth for system timing closure |
| VREF | Reference voltage input | Supplies mid-point reference for HSTL input receivers; must be externally decoupled |
| ZQ | Impedance calibration terminal | Connects to external 240 Ω resistor to ground for output driver impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround overhead; enables simultaneous 500 MT/s read + write in packet buffering |
| Four-word burst architecture | Reduces address bus frequency to 125 MHz for 250 MHz clock; lowers routing congestion and EMI |
| Programmable read latency (DOFF) | Supports both 1-cycle (low-latency control plane) and 1.5-cycle (high-throughput data plane) modes |
| HSTL Class I I/O with ZQ calibration | Ensures consistent 25–35 Ω output impedance across voltage/temperature; meets JEDEC HSTL-I spec |
| JTAG 1149.1 boundary scan | Enables production test and debug of high-speed memory interconnects without physical probe access |
Applications
| Network Packet Buffering | Baseband Signal Processing |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decision and egress scheduling. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer with concurrent read/write capability for cut-through switching. Use Value: 500 MT/s throughput and 1-cycle latency (DOFF = LOW) enable sub-100 ns frame buffering with zero backpressure on line-rate 10G interfaces. |
Use Scenario: Temporary storage of FFT/IFFT coefficients and channel estimation data in LTE/5G baseband FPGAs. IC Role / Device Role / Timing Role: Dual-port scratchpad memory interfacing between DSP engine and DMA controller in real-time PHY layer pipelines. Use Value: Four-word burst and echo clocks (CQ/CQ) reduce FPGA timing closure effort while sustaining >4 Gbps sustained bandwidth per port. |
| Telecom Line Card Memory | High-Speed Test Equipment Buffer |
|
Use Scenario: Holding time-division multiplexed (TDM) voice samples and signaling messages in carrier-grade VoIP gateways. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access for TDM frame assembly/disassembly engines. Use Value: 1.8 V core + 1.5 V I/O compatibility simplifies power delivery alongside TI C66x DSPs; BWS0 enables selective update of CRC fields without full-word rewrite. |
Use Scenario: Capturing high-fidelity analog waveform samples at 1+ GS/s in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Deep, fast-access memory staging buffer between ADC/DAC interfaces and pattern sequencer logic. Use Value: 165-ball FBGA footprint supports dense layout with controlled-impedance traces; ZQ calibration maintains signal fidelity across temperature drift in production test environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PA | 100 MHz max clock (200 MT/s), ×18 organization, 2.5 V I/O only, no DOFF latency control | Limited to lower-bandwidth telecom control planes; incompatible with 1.8 V core systems | Choose only if legacy 2.5 V infrastructure and <200 MT/s throughput suffice |
| ISSI IS61QW25618A-250BQI | 250 MHz, ×18 organization, 1.8 V core/I/O, but lacks echo clocks (CQ/CQ) and ZQ calibration | Requires tighter FPGA timing margins; no on-die impedance tuning for production yield stability | Acceptable for cost-sensitive designs where board-level termination suffices and echo clock logic is implemented externally |
Compared with IDT72T3615L10PA and IS61QW25618A-250BQI, CY7C1911KV18-250BZCT uniquely combines 500 MT/s throughput, 1.8 V/1.5 V flexible I/O, echo clocks for simplified capture, and ZQ calibration - making it optimal for new 10G+ networking and 5G PHY designs requiring production robustness.
Availability
CY7C1911KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, telecom line card memory, and high-speed test equipment requiring stable component supply across multi-year production cycles.
Supply support for CY7C1911KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1911KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for high-throughput, low-latency packet and signal processing applications in networking and wireless infrastructure equipment.
FAQ
What is the function of the DOFF pin on CY7C1911KV18-250BZCT?
The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle read latency for improved timing margin in high-frequency systems; when LOW, it enables 1-cycle latency for minimal pipeline delay. This setting directly affects the number of clock cycles between address assertion and first valid Q[8:0] output, and must be fixed at power-up based on system timing budget.
Can CY7C1911KV18-250BZCT operate with only one clock domain (K = C)?
Yes - the device supports single-clock-domain operation where K and C are tied together. In this mode, all synchronous inputs (address, data, controls) are registered on K, and all outputs (Q[8:0]) are registered on the same K edge. However, echo clocks (CQ/CQ) remain functional and phase-aligned to Q[8:0], preserving their utility for source-synchronous capture even without separate C/C inputs.
How does the BWS0 pin function in ×9 configuration?
In CY7C1911KV18-250BZCT's 2M × 9 organization, BWS0 serves as the sole byte write select and is active LOW to enable writing all 9 bits of D[8:0]. Unlike ×8 or ×18 variants, there is no nibble- or multi-byte granularity - BWS0 asserts the entire 9-bit word. When deasserted, the corresponding write operation is ignored, preserving memory contents.
Is ZQ calibration required for reliable operation?
Yes - ZQ calibration is mandatory for production use. The device uses the ZQ pin to tune output driver impedance against an external 240 Ω resistor to ground. Skipping calibration results in uncontrolled output impedance (typically 45–60 Ω), causing signal reflections, timing violations, and bit errors at 500 MT/s. Calibration occurs automatically at power-up and can be retriggered via JTAG.
CY7C1911KV18-250BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 2M x 9
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1911KV18-250BZCT FAQ
1.How can I place an order for CY7C1911KV18-250BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1911KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1911KV18-250BZCT reliable?
The price and inventory of CY7C1911KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1911KV18-250BZCT is usually 5 days.
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Once your CY7C1911KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1911KV18-250BZCT?
For technical support, including CY7C1911KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1911KV18-250BZCT requirements.
6.How does Aetrix verify that CY7C1911KV18-250BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1911KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1911KV18-250BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1911KV18-250BZCT?
All CY7C1911KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1911KV18-250BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1911KV18-250BZCT part is unused and in its original packaging.
Return procedure for CY7C1911KV18-250BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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