Infineon Technologies CY7C1911KV18-250BZXC

Overview

CY7C1911KV18-250BZXC from Cypress Semiconductor is a 2-Mbit × 9 (18-Mbit total) QDR® II SRAM with separate read/write ports, 250 MHz clock operation (500 MT/s DDR), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write transactions with four-word burst and echo clocks (CQ/CQ) for high-speed data capture in network packet buffers and FPGA co-processor memory.

For engineers reviewing the CY7C1911KV18-250BZXC datasheet, CY7C1911KV18-250BZXC pinout, CY7C1911KV18-250BZXC application, or CY7C1911KV18-250BZXC equivalent, key selection criteria include its 2M × 9 organization, DOFF-controlled 1-cycle vs. 1.5-cycle read latency, HSTL-compatible output drive, JTAG 1149.1 test access, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility with high-density routing.

Technical Context

The device implements true dual-port QDR II architecture: independent K/K input clocks control address/data latching on rising edges only, while C/C output clocks-synchronized to internal timing-drive registered outputs with minimized skew. Echo clocks CQ/CQ provide source-synchronous timing for reliable 500 MT/s data capture at system level.

It supports synchronous self-timed writes, full data coherency, and depth expansion via RPS/WPS port selects. The DOFF pin configures read latency (1 cycle when LOW, 1.5 cycles when HIGH), enabling optimization for latency-sensitive or bandwidth-optimized systems without changing clocking scheme.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free termination.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, CY7C1911KV18-250BZXC provides 2.5× higher throughput, configurable latency, source-synchronous timing, and production-test-ready JTAG-making it optimal for next-generation high-speed digital systems requiring guaranteed coherency and timing precision.

Availability

CY7C1911KV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor memory, telecom baseband processing requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for CY7C1911KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

CY7C1911KV18 belongs to the QDR® II SRAM product line, engineered specifically for ultra-low-latency, concurrent-access memory subsystems in networking, wireless infrastructure, and high-end test equipment.

FAQ

What is the function of the DOFF pin on CY7C1911KV18-250BZXC?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency (standard QDR II operation); when LOW, it reduces latency to 1 cycle (QDR I compatibility mode). This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed. No external timing adjustment is needed-the internal PLL automatically adapts clock-to-data alignment.

Can CY7C1911KV18-250BZXC operate with a 1.5 V VDDQ supply?

Yes-CY7C1911KV18-250BZXC supports VDDQ from 1.4 V to 1.8 V, including 1.5 V nominal. Its HSTL Class I output drivers are fully characterized at 1.5 V, and input receivers meet HSTL-15 thresholds when VREF is set to 0.75 V. System-level timing margins remain valid per AC specifications in the datasheet at this voltage.

How does depth expansion work with RPS and WPS pins?

RPS (Read Port Select) and WPS (Write Port Select) are active-LOW signals that enable independent read/write port activation across multiple devices. When cascading CY7C1911KV18-250BZXC chips for wider memory, each device's RPS/WPS is driven by decoded address bits-ensuring only one device drives Q[8:0] or accepts D[8:0] per transaction. No external logic is needed beyond standard address decoding.

Is the 165-ball FBGA package of CY7C1911KV18-250BZXC compatible with standard reflow profiles?

Yes-the 165-ball FBGA (package code BZXC) is qualified for lead-free reflow per IPC/JEDEC J-STD-020D. Peak temperature is 260 °C, with time above liquidus (TAL) of 60–150 seconds. Board design must follow Cypress's recommended pad layout (0.35 mm stencil aperture, 0.127 mm thickness) and thermal relief for VSS/VDDQ balls to prevent voiding and solder joint reliability issues.