Infineon Technologies CY7C199C-20ZXI
- Part No.:
- CY7C199C-20ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY7C199C-20ZXI.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:2,528
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C199C-20ZXI from Cypress Semiconductor is a 256K-bit (32K × 8) asynchronous CMOS static RAM with 12 ns access time, 5.0V ±10% supply operation, and automatic CE-controlled power-down. It supports TTL-compatible I/O, 2.0V data retention, and low standby current (10 µA in CMOS mode), deployed in industrial control memory buffers and legacy microprocessor system expansion.
For engineers reviewing the CY7C199C-20ZXI datasheet, CY7C199C-20ZXI pinout, CY7C199C-20ZXI application, or CY7C199C-20ZXI equivalent, key selection criteria include access timing consistency across temperature, CE-triggered power-down behavior, I/O drive compatibility with 5V TTL logic families, and TSOP I package thermal resistance (88.6°C/W).
Technical Context
The CY7C199C-20ZXI implements a fully asynchronous SRAM architecture with independent address decoding, sense amplifier-based read path, and bidirectional I/O gating controlled by CE, OE, and WE. Its internal power-down circuit activates when CE remains HIGH, reducing ICC to ≤10 µA without external sequencing.
Timing is defined by overlapping CE/WE assertion for writes and CE/OE coordination for reads; tHZOE (5–9 ns), tHZCE (5–9 ns), and tHZWE (7–10 ns) specify output disable delays referenced to 1.5V thresholds under 30 pF load conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K × 8 bits - provides byte-wide data interface compatible with 8-bit microcontrollers and legacy bus architectures |
| Access Time (tAA) | 12 ns - guarantees valid data at I/O pins within 12 ns of stable address and CE assertion at 5.0V/25°C |
| Supply Voltage Range | 4.5V to 5.5V - supports standard 5V TTL logic rails with ±10% tolerance for industrial voltage variation |
| Standby Current (ISB2) | 10 µA - enables ultra-low-power retention mode when CE ≥ VCC – 0.3V and no inputs toggle |
| Data Retention Voltage | 2.0V - maintains stored data with VCC reduced to 2.0V while CE held inactive, critical for battery-backed hold |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems requiring extended thermal reliability |
| Output Drive Strength | IOH = –4.0 mA / IOL = 8.0 mA - meets TTL output loading requirements for direct interfacing without level-shifting |
Pinout & Package
Package: 28-pin TSOP I (8 mm × 13.4 mm), RoHS-compliant, surface-mountable with 0.55 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | 15-bit address bus accepting 0–32767 row/column select; all inputs TTL-compatible with VIH ≥ 2.2V |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel data path with high-impedance tri-state control via OE and CE; supports read/write multiplexing |
| CE | Chip Enable | Active-low master enable; initiates power-down when HIGH and gates all internal operations |
| OE | Output Enable | Active-low read control; disables outputs (high-Z) when HIGH, independent of CE state |
| WE | Write Enable | Active-low write strobe; latches input data on falling edge when CE is LOW |
| VCC | Power Supply | +5.0V core supply; must be decoupled locally due to 85 mA max operating current |
| VSS | Ground | Signal and power reference plane; pin 21 in TSOP I layout requires low-inductance connection |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-down | Reduces ICC to 10 µA without external control logic-eliminates need for dedicated sleep-mode sequencing |
| TTL-Compatible I/O | Accepts 0.8V/2.2V logic thresholds and drives ±4 mA/8 mA-enables direct connection to 5V microcontrollers and FPGAs |
| 2.0V Data Retention | Maintains memory contents during brown-out or backup battery operation-supports fail-safe state preservation |
| Three Package Options | TSOP I (primary), SOJ, and DIP-allows migration from through-hole prototyping to space-constrained PCB layouts |
| Low Capacitance I/O | Input/output capacitance ≤8 pF-minimizes signal integrity degradation on high-speed 12 ns bus cycles |
Applications
| Industrial PLC Memory Buffer | Legacy Microprocessor System Expansion |
|---|---|
Use Scenario: Real-time I/O mapping and register caching in programmable logic controllers operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Asynchronous SRAM providing non-blocking read/write access to CPU during scan cycle execution. Use Value: 12 ns tAA ensures deterministic response to fieldbus interrupt requests without pipeline stalls. | Use Scenario: Adding external RAM to Z80 or 8086-based embedded systems where bus timing margins are tight. IC Role / Device Role / Timing Role: Byte-wide memory extension with CE/OE/WE decode matching legacy bus controller waveforms. Use Value: TTL-compatible inputs eliminate level translators; 5.0V ±10% range accommodates aging power supplies. |
| Medical Device Data Logging | Automotive Body Control Module |
Use Scenario: Storing sensor calibration tables and event logs in portable diagnostic equipment with intermittent power. IC Role / Device Role / Timing Role: Nonvolatile data buffer using 2.0V retention mode during battery switchover. Use Value: 10 µA ISB2 enables >1-year backup runtime on coin-cell batteries without refresh circuitry. | Use Scenario: Supporting EEPROM wear-leveling algorithms and CAN message queue buffering in BCM ECUs. IC Role / Device Role / Timing Role: Fast-access scratchpad memory for real-time CAN frame assembly/disassembly. Use Value: tHZOE ≤9 ns allows rapid I/O reconfiguration between transmit/receive phases without bus contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-12TQLI | 32K × 16 organization, 3.3V-only supply, 12 ns access, LVCMOS I/O | Requires data bus width adaptation and level translation for 5V systems | Select only if migrating to 3.3V architecture and needing wider word size |
| ON Semiconductor MCM6295DW12 | 32K × 8, 5V, 12 ns, but no automatic power-down; ISB = 1 mA typical | Lacks CE-triggered low-power mode-requires external gating for standby reduction | Choose when legacy footprint compatibility is critical and power budget permits higher idle draw |
Compared with IS61LV25616AL-12TQLI and MCM6295DW12, the CY7C199C-20ZXI uniquely delivers 5V TTL compatibility, sub-10 µA CMOS standby, and seamless integration into existing 5V microprocessor buses without redesign.
Availability
CY7C199C-20ZXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, legacy microprocessor system expansion, and medical device data logging requiring stable component supply over extended product lifecycles.
Supply support for CY7C199C-20ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C199C belongs to Cypress's legacy asynchronous SRAM portfolio, engineered specifically for drop-in replacement of older 5V NMOS and HMOS memories in cost-sensitive, thermally demanding embedded systems.
FAQ
What is the minimum VCC required to retain data in CY7C199C-20ZXI?
The device guarantees data retention down to VCC = 2.0V when CE is held inactive (≥ VCC – 0.3V) and all inputs are clamped to valid logic levels. Below 2.0V, retention is not specified; operation below 4.5V is unsupported for active read/write cycles.
Does CY7C199C-20ZXI support concurrent read and write operations?
No. The CY7C199C-20ZXI is a single-port asynchronous SRAM with shared I/O lines. Read and write operations are mutually exclusive and controlled by OE (read) and WE (write) in conjunction with CE; simultaneous access is not possible.
Can CY7C199C-20ZXI be used with 3.3V microcontrollers?
Not directly. Its inputs require VIH ≥ 2.2V but are rated only for 5.0V ±10% operation; driving it from 3.3V logic violates VIL/VIL AC specs and risks unreliable operation. A level translator or 5V-compatible MCU is required.
What is the thermal resistance (θJA) of the TSOP I package?
The TSOP I package has θJA = 88.6°C/W when soldered on a 3 × 4.5 inch, two-layer PCB in still air. This value assumes standard JEDEC test conditions and guides heatsink or layout decisions for sustained 85 mA operation at +85°C ambient.
CY7C199C-20ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Bag
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY7C199C-20ZXI FAQ
1.How can I place an order for CY7C199C-20ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C199C-20ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C199C-20ZXI reliable?
The price and inventory of CY7C199C-20ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C199C-20ZXI is usually 5 days.
3.What payment methods are accepted for CY7C199C-20ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C199C-20ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C199C-20ZXI?
CY7C199C-20ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C199C-20ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C199C-20ZXI?
For technical support, including CY7C199C-20ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C199C-20ZXI requirements.
6.How does Aetrix verify that CY7C199C-20ZXI is sourced from the original manufacturer or authorized distributors?
All CY7C199C-20ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C199C-20ZXI meets industry standards.
7.What is the process for return or replacement of CY7C199C-20ZXI?
All CY7C199C-20ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C199C-20ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C199C-20ZXI part is unused and in its original packaging.
Return procedure for CY7C199C-20ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C199C-20ZXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

