Infineon Technologies CY7C199CN-12VXI
- Part No.:
- CY7C199CN-12VXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-BSOJ (0.300", 7.62mm Width)
- Datasheet:
-
CY7C199CN-12VXI.pdf
- Description:
- IC SRAM 256KBIT PARALLEL 28SOJ
- Quantity:
- Payment:

- Shipping:

Inventory:1,530
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C199CN-12VXI from Cypress Semiconductor is a 256K-bit (32K × 8) asynchronous CMOS static RAM with 12 ns access time, 5.0 V ±10% supply operation, TTL-compatible I/O, and automatic CE-controlled power-down mode. It delivers low standby current (500 µA), 2.0 V data retention, and supports industrial temperature range (–40°C to +85°C) in a Pb-free 28-pin TSOP I package for embedded memory buffering.
For engineers reviewing the CY7C199CN-12VXI datasheet, CY7C199CN-12VXI pinout, CY7C199CN-12VXI application, or CY7C199CN-12VXI equivalent, key selection criteria include access time vs. power trade-offs, CE-driven sleep entry timing (tPD = 12 ns), I/O drive strength (IOH = –4.0 mA / IOL = 8.0 mA), and compatibility with legacy 5V microcontroller buses requiring high-Z control on OE/WE/CE.
Technical Context
The CY7C199CN-12VXI implements a fully asynchronous SRAM architecture with independent address decoding, sense amplifier array, and tri-state I/O buffers. Its CE-controlled power-down circuitry reduces ICC to 10 µA (ISB2) when CE ≥ VCC – 0.3 V and all inputs are at valid logic levels.
Timing is governed by overlapping control signals: write initiation requires simultaneous CE LOW and WE LOW; read output is enabled only when CE and OE are both LOW. The device uses standard TTL voltage thresholds (VIH = 2.2 V, VIL = 0.8 V) and guarantees tHZOE ≤ 5 ns and tHZCE ≤ 5 ns under industrial conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K × 8 bits - provides byte-wide data interface compatible with 8-bit microcontrollers and legacy bus architectures |
| Access Time (tAA) | 12 ns - enables direct interfacing with 80 MHz CPU buses without wait states |
| VCC Operating Range | 4.5 V to 5.5 V - ensures robust operation across noisy 5V power rails in industrial control systems |
| Standby Current (ISB2) | 10 µA - supports low-power sleep modes in battery-backed memory applications |
| Data Retention Voltage | 2.0 V - allows memory state preservation during brown-out or backup-battery operation |
| Input/Output Drive | IOH = –4.0 mA, IOL = 8.0 mA - meets TTL loading requirements for direct connection to 74LS logic families |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems without derating |
Pinout & Package
Package: Pb-free 28-pin TSOP I (8 mm × 13.4 mm), JEDEC MO-153 compliant, surface-mountable with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Input | 15-bit address bus supporting full 32K-word addressing; driven by CPU or FPGA address lines |
| IO0–IO7 | Bidirectional Data I/O | 8-bit parallel data path; high-impedance when OE or CE HIGH, actively driven during read/write |
| CE | Chip Enable | Primary enable/disable control; asserts internal power-down when HIGH (ISB2 mode) and disables outputs |
| OE | Output Enable | Controls output buffer direction; LOW enables data readout, HIGH places IOx in high-Z state |
| WE | Write Enable | Active-LOW signal initiating write cycle; must overlap with CE LOW to store data into RAM array |
| VCC | Power Supply | +5.0 V ±10% core supply; decoupling capacitor required within 10 mm of Pin 7 per layout guidelines |
| VSS | Ground | Signal and power return reference; connected to PCB ground plane at Pin 21 for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces ICC to 10 µA without external control logic-enables zero-software-overhead sleep in microcontroller systems |
| TTL-Compatible I/O | Eliminates level-shifter requirements when interfacing with legacy 5V MCUs, CPLDs, or peripheral controllers |
| 2.0 V Data Retention | Preserves stored contents during main power loss, enabling use in nonvolatile backup memory with coin-cell support |
| Low Capacitance I/O | CIN/COUT = 8 pF - minimizes signal integrity degradation and timing skew on high-speed 8-bit buses |
| Pb-Free TSOP I Package | RoHS-compliant, reflow-solderable footprint compatible with automated SMT assembly and IPC-7351B land patterns |
Applications
| Industrial PLC Memory Buffer | Legacy Microcontroller Data Cache |
|---|---|
|
Use Scenario: Storing real-time I/O status and configuration registers in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM providing deterministic 12 ns read/write latency for deterministic scan-cycle execution. Use Value: CE-controlled power-down cuts background current to 10 µA during idle cycles, extending thermal margin in sealed enclosures. |
Use Scenario: Serving as external RAM for 8-bit microcontrollers (e.g., 8051, PIC18) lacking on-chip memory for firmware variables and stack expansion. IC Role / Device Role / Timing Role: Directly mapped into MCU address space via A0–A14 and controlled by dedicated OE/WE/CE pins. Use Value: TTL-compatible I/O and 4.5–5.5 V operation eliminate level shifters and simplify power design in cost-sensitive designs. |
| Automotive Instrument Cluster Display Buffer | Medical Device Parameter Storage |
|
Use Scenario: Holding display frame buffers and calibration tables in automotive digital dashboards requiring AEC-Q100 Grade 3 qualification. IC Role / Device Role / Timing Role: Nonvolatile-capable SRAM retaining critical UI state during ignition cycling using 2.0 V data retention mode. Use Value: Industrial temperature rating (–40°C to +85°C) and Pb-free TSOP I package meet automotive manufacturing and reliability standards. |
Use Scenario: Storing patient-specific therapy parameters and runtime logs in portable medical devices with battery backup capability. IC Role / Device Role / Timing Role: Low-leakage (500 µA ISB1) memory holding configuration between power cycles without volatile refresh. Use Value: 2.0 V data retention enables seamless transition to backup power during AC mains failure, preserving life-critical settings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-12TQLI | 32K × 16 organization, 3.3 V only, 12 ns access, LVCMOS I/O | Requires data bus width adaptation (16-bit vs. 8-bit); incompatible with 5V TTL systems | Select only if migrating to 3.3 V system architecture and wider data path is acceptable |
| ON Semiconductor MCM6295DW12 | 32K × 8, 5 V, 12 ns, but obsolete (last-time-buy status), DIP-only packaging | Lacks Pb-free TSOP I option; no RoHS compliance or modern SMT support | Use only for legacy repair; not recommended for new designs due to lifecycle risk |
Compared with IS61LV25616AL-12TQLI and MCM6295DW12, CY7C199CN-12VXI uniquely combines 5V TTL compatibility, Pb-free TSOP I packaging, and guaranteed 10 µA ISB2 current-making it the sole viable choice for new industrial 8-bit bus designs requiring drop-in 5V SRAM replacement.
Availability
CY7C199CN-12VXI is available at Aetrix Electronics and suitable for industrial PLCs, legacy microcontroller systems, automotive instrument clusters, and medical device parameter storage requiring stable component supply across extended product lifecycles.
Supply support for CY7C199CN-12VXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, PSoC, and USB solutions for embedded systems.
The CY7C199CN belongs to Cypress's legacy asynchronous SRAM product line, designed specifically for cost-sensitive, high-reliability 5V memory expansion in industrial and automotive applications where pin compatibility and long-term availability are critical.
FAQ
What is the minimum VCC required to retain data in CY7C199CN-12VXI?
The device guarantees data retention down to VCC = 2.0 V, as specified in the Data Retention Characteristics table (Page 6). At this voltage, ICCDR remains ≤ 150 µA with CE ≥ VCC – 0.3 V and inputs held at valid logic levels. No external refresh or clocking is needed during retention mode.
Can CY7C199CN-12VXI be used with a 3.3 V microcontroller?
No-CY7C199CN-12VXI is strictly a 5 V device with VIH = 2.2 V minimum and VCC range of 4.5–5.5 V. Interfacing with 3.3 V logic requires level translation for all control and data lines; direct connection risks undervoltage I/O recognition and violates absolute maximum ratings.
Does CY7C199CN-12VXI require an external clock or refresh signal?
No. As a static RAM, it operates asynchronously and retains data indefinitely as long as VCC remains within specification and CE is asserted. No clock, refresh cycle, or periodic access is required-unlike DRAM or pseudo-SRAM devices.
What is the thermal resistance (θJA) of the TSOP I package?
The θJA for the 28-pin TSOP I package is 88.6 °C/W under standard test conditions: still air, mounted on a 3 × 4.5 inch, two-layer PCB. This value assumes proper copper pour and thermal vias beneath the package for optimal heat dissipation in industrial ambient environments.
CY7C199CN-12VXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-BSOJ (0.300", 7.62mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOJ
CY7C199CN-12VXI FAQ
1.How can I place an order for CY7C199CN-12VXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C199CN-12VXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C199CN-12VXI reliable?
The price and inventory of CY7C199CN-12VXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C199CN-12VXI is usually 5 days.
3.What payment methods are accepted for CY7C199CN-12VXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C199CN-12VXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C199CN-12VXI?
CY7C199CN-12VXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C199CN-12VXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C199CN-12VXI?
For technical support, including CY7C199CN-12VXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C199CN-12VXI requirements.
6.How does Aetrix verify that CY7C199CN-12VXI is sourced from the original manufacturer or authorized distributors?
All CY7C199CN-12VXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C199CN-12VXI meets industry standards.
7.What is the process for return or replacement of CY7C199CN-12VXI?
All CY7C199CN-12VXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C199CN-12VXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C199CN-12VXI part is unused and in its original packaging.
Return procedure for CY7C199CN-12VXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C199CN-12VXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

