Infineon Technologies CY7C199D-10ZXI
- Part No.:
- CY7C199D-10ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY7C199D-10ZXI.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:4,918
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C199D-10ZXI from Infineon Technologies (formerly Cypress) is a 256-Kbit (32K × 8) CMOS static RAM with TTL-compatible I/O, 10 ns access time, 80 mA active current, and 3 mA CMOS standby current, operating from 5 V ±0.5 V across –40 °C to +85 °C industrial temperature range. It serves as a high-speed, low-power data buffer in microprocessor-based systems requiring fast parallel memory access.
For engineers reviewing the CY7C199D-10ZXI datasheet, CY7C199D-10ZXI pinout, CY7C199D-10ZXI application, or CY7C199D-10ZXI equivalent, key selection considerations include TTL-level interface compatibility, automatic CE-controlled power-down, 28-pin TSOP I package footprint, and 2.0 V data retention capability under battery backup.
Technical Context
The CY7C199D-10ZXI implements a fully static, asynchronous SRAM architecture with tri-state bidirectional I/Os (I/O0–I/O7), independent chip enable (CE), output enable (OE), and write enable (WE) controls. Its address space spans A0–A14 (15-bit), supporting 32,768 × 8-bit organization without internal refresh circuitry.
It features dual power-down modes: ISB1 (10 mA, TTL input thresholds) and ISB2 (3 mA, CMOS input thresholds), activated automatically when CE is HIGH. Data retention at 2.0 V enables low-power backup operation, and timing compliance includes tAA = 10 ns, tRC = 10 ns, and tHZOE/tHZCE = 5 ns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 256 Kbit (32K × 8) - supports byte-wide data bus interfacing with 15-bit addressing |
| Access time (tAA) | 10 ns - enables direct attachment to 100 MHz bus cycles without wait states |
| VCC supply | 5 V ±0.5 V - requires stable 5 V rail; not compatible with 3.3 V-only systems |
| Operating temperature | –40 °C to +85 °C - qualified for industrial-grade embedded control and instrumentation |
| Standby current (ISB2) | 3 mA - enables low-power hold mode during processor sleep with CMOS input biasing |
| Data retention voltage | 2.0 V - allows battery-backed operation using single-cell LiFePO₄ or two NiMH cells |
| I/O interface | TTL-compatible inputs/outputs - interfaces directly with legacy 5 V microcontrollers (e.g., 8051, 68K) without level shifters |
Pinout & Package
Package: 28-pin thin small outline package (TSOP I), 8.1 mm × 13.4 mm body, 0.55 mm pitch, lead-free (Pb-free) construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address inputs | 15-bit unidirectional address bus; latched on CE/WE transitions for random access |
| I/O0–I/O7 | Bidirectional data bus | Tri-state outputs when CE HIGH, OE HIGH, or WE LOW; supports read/write multiplexing |
| CE | Chip enable (active LOW) | Primary device select; enables automatic power-down and high-Z I/O when deasserted |
| OE | Output enable (active LOW) | Controls output drivers only; does not affect internal state or power mode |
| WE | Write enable (active LOW) | Initiates write cycle when CE and WE both LOW; samples data on rising edge of terminating signal |
| VCC | Power supply | 5 V ±0.5 V main supply; decoupling required within 10 mm of pin per JEDEC standards |
| GND | Ground reference | Signal and power return; must be connected to low-impedance plane for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE power-down | Reduces ICC to 3 mA (ISB2) when deselected-eliminates need for external power gating logic |
| TTL-compatible I/O levels | VIH = 2.2 V min, VOH = 2.4 V min @ –4 mA-ensures interoperability with legacy 5 V logic families |
| 2.0 V data retention | Maintains stored contents during brown-out or battery backup without VCC regulation circuitry |
| Easy memory expansion | Dedicated CE/OE/WE controls allow stacking multiple devices with shared address/data buses |
| High noise immunity | Input leakage ≤ ±1 µA and VIH/VIL margins support reliable operation in electrically noisy industrial environments |
Applications
| Industrial PLC Data Buffer | Legacy Microcontroller Memory Extension |
|---|---|
Use Scenario: Real-time I/O scanning in programmable logic controllers where deterministic memory access latency is critical. IC Role / Device Role / Timing Role: Byte-wide SRAM providing zero-wait-state data storage for scan-cycle variables and register mapping. Use Value: 10 ns tAA ensures full 100 MHz bus utilization; ISB2 = 3 mA reduces thermal load during idle scan intervals. | Use Scenario: Adding external RAM to 8-bit microcontrollers (e.g., Intel 8051 derivatives) with limited on-chip memory. IC Role / Device Role / Timing Role: Parallel memory peripheral mapped into external data space via dedicated address decoding. Use Value: TTL-compatible I/O eliminates level-shifter components; CE/OE/WE signals align directly with 8051's RD/WR control timing. |
| Automotive Instrument Cluster Display Cache | Medical Diagnostic Equipment Frame Buffer |
Use Scenario: Storing rendered GUI frames in analog-digital hybrid instrument clusters operating across extended temperature ranges. IC Role / Device Role / Timing Role: Static frame buffer holding bitmap data for LCD driver ICs synchronized to display refresh clocks. Use Value: –40 °C to +85 °C rating meets AEC-Q100 Grade 3 requirements; 2.0 V retention supports safe shutdown logging. | Use Scenario: Capturing and staging image data from analog front-end ADCs before DSP processing in portable ultrasound units. IC Role / Device Role / Timing Role: High-throughput temporary storage for digitized RF echo samples prior to FFT computation. Use Value: 32K × 8 depth accommodates 256×128 pixel monochrome frames; tRC = 10 ns enables burst transfers at >50 MB/s effective bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C4008-10TIN | 3.3 V supply only; 10 ns access; 1 µA standby current; CMOS I/O levels | Requires level translation for 5 V processors; unsuitable for direct TTL interface | Select only when migrating to 3.3 V system architecture with strict low-power constraints |
| IS61LV25616AL-10TLI | 32K × 16 organization; 3.3 V supply; 12 ns access; 20 µA standby; LVTTL I/O | Provides wider data bus but incompatible byte-select signaling; needs address remapping | Choose for higher bandwidth needs where 16-bit data path is available and 3.3 V supply is established |
Compared with AS6C4008-10TIN and IS61LV25616AL-10TLI, the CY7C199D-10ZXI uniquely delivers 5 V TTL compatibility, 2.0 V data retention, and industrial temperature operation in a 32K × 8 configuration-making it irreplaceable in legacy 5 V embedded systems requiring robust, drop-in memory expansion.
Availability
CY7C199D-10ZXI is available at Aetrix Electronics and suitable for industrial PLCs, legacy microcontroller designs, and automotive instrument clusters requiring stable component supply with long-term lifecycle assurance.
Supply support for CY7C199D-10ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong industrial and automotive focus.
The CY7C199D belongs to Infineon's legacy Cypress SRAM product line, designed specifically for cost-sensitive, high-reliability 5 V embedded systems requiring pin-compatible upgrades from earlier generations like CY7C199C.
FAQ
Is CY7C199D-10ZXI compatible with 3.3 V microcontrollers?
No. The device requires 5 V ±0.5 V supply and features TTL-compatible I/O thresholds (VIH ≥ 2.2 V, VOH ≥ 2.4 V @ –4 mA). Direct connection to 3.3 V logic risks undriven outputs and marginal input recognition. Level translation or a 3.3 V SRAM alternative is required for such systems.
What is the significance of ISB1 vs. ISB2 standby current specs?
ISB1 (10 mA) applies when inputs meet TTL thresholds (VIH > 2.0 V); ISB2 (3 mA) applies under stricter CMOS thresholds (VIH > VCC – 0.3 V). Designers must bias input signals accordingly to achieve the lower 3 mA standby-critical for battery-backed retention mode optimization.
Can CY7C199D-10ZXI be used in place of CY7C199C?
Yes-CY7C199D-10ZXI is pin- and function-compatible with CY7C199C per datasheet Rev. *N. It offers identical timing (10 ns), voltage, and packaging, with enhanced data retention (2.0 V) and updated manufacturing process. No PCB or firmware changes are needed for replacement.
Does this SRAM require an external clock or refresh controller?
No. As a static RAM, CY7C199D-10ZXI is fully asynchronous and requires no clock signal or periodic refresh. Data remains valid as long as VCC is maintained above 2.0 V (retention) or 4.5 V (active operation), with all timing governed solely by CE/OE/WE control edges.
CY7C199D-10ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY7C199D-10ZXI FAQ
1.How can I place an order for CY7C199D-10ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C199D-10ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C199D-10ZXI reliable?
The price and inventory of CY7C199D-10ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C199D-10ZXI is usually 5 days.
3.What payment methods are accepted for CY7C199D-10ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C199D-10ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C199D-10ZXI?
CY7C199D-10ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C199D-10ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C199D-10ZXI?
For technical support, including CY7C199D-10ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C199D-10ZXI requirements.
6.How does Aetrix verify that CY7C199D-10ZXI is sourced from the original manufacturer or authorized distributors?
All CY7C199D-10ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C199D-10ZXI meets industry standards.
7.What is the process for return or replacement of CY7C199D-10ZXI?
All CY7C199D-10ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C199D-10ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C199D-10ZXI part is unused and in its original packaging.
Return procedure for CY7C199D-10ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C199D-10ZXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

