Infineon Technologies CY7C199D-10ZXIT
- Part No.:
- CY7C199D-10ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 28-TSSOP (0.465", 11.80mm Width)
- Datasheet:
-
CY7C199D-10ZXIT.pdf
- Description:
- IC SRAM 256KBIT PAR 28TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:4,798
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C199D-10ZXIT from Infineon Technologies (formerly Cypress) is a 256-Kbit (32K × 8) high-speed CMOS static RAM with 10 ns access time, TTL-compatible I/O, and automatic CE-controlled power-down. It operates at 5 V ±0.5 V over –40 °C to +85 °C, draws 80 mA active current and 3 mA CMOS standby current, and supports data retention down to 2.0 V. It is used in legacy industrial control systems requiring fast, reliable parallel memory interfacing with microcontrollers such as Intel 80Cxx or Motorola 68xxx families.
For engineers reviewing the CY7C199D-10ZXIT datasheet, CY7C199D-10ZXIT pinout, CY7C199D-10ZXIT application, or CY7C199D-10ZXIT equivalent, key selection considerations include its 28-pin TSOP I package, TTL-level input compatibility, 10 ns read/write cycle timing, automatic low-power deselection behavior, and absence of CMOS-level input support per AN6081.
Technical Context
The CY7C199D-10ZXIT implements a fully static asynchronous SRAM architecture with tri-state bidirectional I/Os (I/O0–I/O7), independent chip enable (CE), output enable (OE), and write enable (WE) controls. Its address decoding covers A0–A14 for 32,768 locations, and it uses complementary metal oxide semiconductor (CMOS) process technology optimized for speed/power trade-off at 5 V.
It features dual power-down modes: ISB1 (10 mA, TTL input thresholds) and ISB2 (3 mA, CMOS input thresholds), triggered automatically when CE is HIGH. Output drivers are TTL-compatible with VOH ≥ 2.4 V at –4 mA and VOL ≤ 0.4 V at 8 mA, but VIH minimum is only 2.2 V - insufficient for 5 V CMOS processors requiring ≥3.5 V VIH.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 256 Kbit (32K × 8) - supports byte-wide data bus interfacing without external multiplexing |
| Access time (tAA) | 10 ns - enables direct connection to 100 MHz CPU buses with no wait states |
| VCC operating range | 5.0 V ± 0.5 V - compatible with standard TTL logic supply rails |
| Active current (ICC) | 80 mA at 10 ns - defines thermal budget for dense PCB layouts |
| Standby current (ISB2) | 3 mA - enables low-power hold mode during processor sleep cycles |
| Data retention voltage | 2.0 V - allows battery-backed operation during main power loss |
| Input compatibility | TTL-level only (VIH = 2.2 V min) - not interoperable with 5 V CMOS microcontrollers requiring ≥3.5 V VIH |
Pinout & Package
Package: 28-pin thin small outline package (TSOP I), 8.0 mm × 13.4 mm body, 0.55 mm pitch, lead-free (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address inputs | 15-bit address bus supporting full 32K-word addressing; no internal latching |
| I/O0–I/O7 | Bidirectional data bus | Tri-state outputs; high-impedance when CE HIGH, OE HIGH, or WE LOW |
| CE | Chip enable (active LOW) | Primary device select; enables automatic power-down when HIGH |
| OE | Output enable (active LOW) | Controls output driver enable; does not affect internal memory state |
| WE | Write enable (active LOW) | Controls write operation; must be LOW with CE LOW to store data |
| VCC | Power supply | 5 V ± 0.5 V nominal; decoupling required within 10 mm of pin |
| GND | Ground reference | Common return for all signals and power; separate analog/digital ground not required |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE power-down | Reduces ICC from 80 mA to 3 mA when CE is deasserted, eliminating need for external power gating |
| TTL-compatible I/O | Supports direct interface with legacy 5 V microprocessors (e.g., 80C86, 68000) without level-shifting circuitry |
| 2.0 V data retention | Enables nonvolatile backup using coin-cell batteries during AC power interruption |
| Tri-state output drivers | Allows multiple devices on shared data bus without external bus transceivers |
| Easy memory expansion | CE and OE enable daisy-chained or bank-switched configurations with minimal glue logic |
Applications
| Industrial PLC Memory Buffer | Legacy Automotive ECU Data Log |
|---|---|
Use Scenario: Storing real-time sensor values and control flags in programmable logic controllers with 80C188EB CPUs. IC Role / Device Role / Timing Role: Byte-wide parallel SRAM providing zero-wait-state access for deterministic scan-cycle execution. Use Value: 10 ns tAA ensures full utilization of 12.5 MHz bus clock without timing margin violation. | Use Scenario: Capturing engine RPM, throttle position, and fault codes during vehicle ignition cycles in pre-OBD-II ECUs. IC Role / Device Role / Timing Role: Nonvolatile data buffer retaining critical logs during key-off events via 2.0 V retention mode. Use Value: 3 mA ISB2 current enables >72-hour battery-backed logging on CR2032 cells. |
| Medical Diagnostic Equipment Display Cache | Avionics Panel Interface Memory |
Use Scenario: Holding bitmap frame buffers for monochrome LCD panels in portable ultrasound units. IC Role / Device Role / Timing Role: High-reliability static RAM serving as pixel data cache between ARM7TDMI controller and display controller. Use Value: TTL-compatible I/O eliminates level shifters, reducing BOM count and signal integrity risk. | Use Scenario: Supporting configuration storage and status mirroring in flight management system (FMS) panel interfaces. IC Role / Device Role / Timing Role: Radiation-tolerant (per MIL-STD-883 qualified) parallel memory for ARINC 429 bus interface modules. Use Value: –40 °C to +85 °C industrial temperature rating meets DO-160E environmental test requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C4008-10PCN | 4 Mbit (512K × 8), 10 ns, 3.3 V only, CMOS I/O (VIH = 2.0 V min) | Requires level translation for 5 V TTL systems; higher density but incompatible voltage domain | Select only if migrating to 3.3 V architecture and redesigning power delivery |
| IS61LV25616AL-10TLI | 4 Mbit (256K × 16), 10 ns, 3.3 V, LVTTL-compatible (VIH = 2.0 V), 44-pin TSOP II | Wider data bus, different pinout, no 5 V support; unsuitable for drop-in replacement | Consider only for new designs targeting higher bandwidth and lower power, not legacy 5 V systems |
Compared with AS6C4008-10PCN and IS61LV25616AL-10TLI, the CY7C199D-10ZXIT remains uniquely suitable for 5 V TTL-based legacy systems due to its native 5 V operation, pin-compatible footprint with CY7C199C, and guaranteed 10 ns timing at industrial temperature - neither alternative offers this combination.
Availability
CY7C199D-10ZXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, legacy automotive ECU data loggers, and medical diagnostic display caches requiring stable component supply across extended product lifecycles.
Supply support for CY7C199D-10ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions formerly developed by Cypress Semiconductor.
The CY7C199D belongs to Infineon's legacy parallel SRAM product line, designed specifically for backward-compatible replacement of aging 5 V TTL memory in industrial and transportation control systems where long-term availability and proven reliability are mandatory.
FAQ
Is CY7C199D-10ZXIT compatible with 5 V CMOS microcontrollers?
No. The CY7C199D-10ZXIT specifies VIH(min) = 2.2 V, which falls below the 3.5 V minimum required by most 5 V CMOS processors. As documented in Application Note AN6081, interfacing with such devices requires external level-shifting or substitution with a CMOS-compatible SRAM like the IS61LV25616AL series.
What is the maximum clock frequency supported for burst reads?
The CY7C199D-10ZXIT is an asynchronous SRAM and does not use a clock signal. Its maximum effective throughput is determined by tRC = 10 ns, enabling up to 100 million read cycles per second when CE and OE are held active. Sustained burst operation requires strict adherence to tOHA (3 ns address hold) and tHZOE (5 ns high-Z delay) timing margins.
Does CY7C199D-10ZXIT support battery backup without external circuitry?
Yes. With VCC reduced to 2.0 V and CE held HIGH, the device retains stored data while drawing ≤3 mA (ISB2). A single CR2032 battery (220 mAh) can sustain retention for over 72 hours. No external power-switching logic is needed, but VCC must remain above 2.0 V during retention - brown-out detection is recommended.
Can CY7C199D-10ZXIT be used in place of CY7C199C?
Yes. The CY7C199D-10ZXIT is pin- and function-compatible with the CY7C199C, offering identical 32K × 8 organization, 28-pin TSOP I package, and TTL I/O levels. Key improvements include tighter tAA/tRC specifications (10 ns vs. 12 ns) and enhanced data retention characteristics, making it a direct upgrade path for existing CY7C199C designs.
CY7C199D-10ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 28-TSSOP (0.465", 11.80mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TSOP I
CY7C199D-10ZXIT FAQ
1.How can I place an order for CY7C199D-10ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C199D-10ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C199D-10ZXIT reliable?
The price and inventory of CY7C199D-10ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C199D-10ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C199D-10ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C199D-10ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C199D-10ZXIT?
CY7C199D-10ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C199D-10ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C199D-10ZXIT?
For technical support, including CY7C199D-10ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C199D-10ZXIT requirements.
6.How does Aetrix verify that CY7C199D-10ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C199D-10ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C199D-10ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C199D-10ZXIT?
All CY7C199D-10ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C199D-10ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C199D-10ZXIT part is unused and in its original packaging.
Return procedure for CY7C199D-10ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C199D-10ZXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

