Infineon Technologies CY7C2163KV18-450BZXI

Overview

CY7C2163KV18 from Infineon Technologies (formerly Cypress) is a 18-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and on-die termination (ODT). It features separate read/write ports, DDR interfaces operating at 1100 Mbps effective data rate (550 MHz clock), and 1M × 18 organization. Designed for high-bandwidth networking buffers and packet forwarding engines in telecom infrastructure.

For engineers reviewing the CY7C2163KV18 datasheet, CY7C2163KV18 pinout, CY7C2163KV18 application, or CY7C2163KV18 equivalent, key selection criteria include 550 MHz max clock frequency, HSTL I/O compatibility, ODT support on D[17:0]/BWS[1:0]/K/K inputs, and 165-ball FBGA package thermal and routing constraints.

Technical Context

The CY7C2163KV18 implements a true dual-port synchronous SRAM architecture with independent read and write pipelines, enabling concurrent access without bus turnaround. Its QDR II+ core uses two phase-aligned input clocks (K and K) to latch addresses and data on rising edges only, while echo clocks (CQ/CQ) provide source-synchronous timing for reliable data capture at 1100 Mbps.

Internally, it integrates a PLL for precise data placement, on-die termination configurable via ODT and ZQ pins, and synchronous self-timed writes. The device supports both 1.5 V and 1.8 V I/O supply (VDDQ = 1.4 V to VDD), with core VDD = 1.8 V ± 0.1 V, and delivers full data coherency across all burst transfers.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, RoHS-compliant Pb-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10PF and AS7C331024PFSIG, CY7C2163KV18 uniquely combines 550 MHz operation, ODT, and true dual-port burst architecture - making it the only option capable of sustaining 1100 Mbps sustained bandwidth with minimal PCB routing overhead in next-gen infrastructure designs.

Availability

CY7C2163KV18 is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and 5G baseband processing requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C2163KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and high-performance memory solutions.

CY7C2163KV18 belongs to Infineon's QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in carrier-grade networking and communications infrastructure.

FAQ

What is the function of the DOFF pin on CY7C2163KV18?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency required for QDR II+ operation; when LOW, it reverts to 1-cycle latency compatible with legacy QDR I timing. This pin is sampled at power-up and must remain stable during operation to avoid timing violations.

Can CY7C2163KV18 operate with VDDQ = 1.5 V while VDD = 1.8 V?

Yes. The device supports VDDQ from 1.4 V to VDD, allowing 1.5 V I/O operation with 1.8 V core supply. This enables interoperability with 1.5 V FPGA I/O banks without level shifters, provided VDDQ decoupling meets datasheet ripple specifications (< ±30 mV).

How is on-die termination calibrated on CY7C2163KV18?

ODT calibration uses the ZQ pin connected to a precision 240 Ω resistor to ground. During power-up initialization, the device measures this reference and sets internal output drivers to 48 Ω (0.2 × 240 Ω). ODT range (low/high) is selected by the logic level on the ODT pin, with HIGH as default if left floating.

Is CY7C2163KV18 pin-compatible with CY7C2165KV18?

No. Although both share the same 165-ball FBGA package, CY7C2163KV18 (1M × 18) and CY7C2165KV18 (512K × 36) have different address widths (18 vs. 17 bits), byte write select count (BWS[1:0] vs. BWS[3:0]), and pin assignments for D/Q buses - requiring distinct PCB layouts and firmware addressing schemes.