Infineon Technologies CY7C2262XV18-366BZXC

Overview

CY7C2262XV18-366BZXC from Infineon Technologies (formerly Cypress) is a 36-Mbit QDR® II+ Xtreme SRAM with 2 M × 18 organization, 450 MHz clock support, 2.5-cycle read latency, and on-die termination (ODT). It implements separate read/write ports with DDR interfaces, enabling concurrent high-bandwidth memory access in networking line cards and packet buffer applications.

For engineers reviewing the CY7C2262XV18-366BZXC datasheet, CY7C2262XV18-366BZXC pinout, CY7C2262XV18-366BZXC application, or CY7C2262XV18-366BZXC equivalent, key selection criteria include its 900 Mbps DDR data rate per port, HSTL I/O compatibility, 165-ball FBGA package, 1.8 V core / 1.5 V I/O supply, and JTAG 1149.1 test access capability.

Technical Context

This SRAM uses QDR-II+ Xtreme architecture with fully independent synchronous read and write ports sharing a multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling pipelined burst transfers without bus turnaround.

The device integrates a PLL for precise data placement, echo clocks (CQ/CQ) for simplified high-speed data capture, and programmable ODT for D[17:0], BWS[1:0], and K/K inputs. DOFF pin selects between 2.5-cycle (HIGH) and 1-cycle (LOW) read latency modes, maintaining functional alignment with legacy QDR-I systems.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36120L10BG and AS7C336200B-15JIN, CY7C2262XV18-366BZXC uniquely combines programmable latency (DOFF), integrated ODT, and echo clocks-reducing system-level timing risk and PCB component count in 450 MHz designs.

Availability

CY7C2262XV18-366BZXC is available at Aetrix Electronics and suitable for high-speed network switch fabric, telecom line card buffering, PCIe-based accelerator memory, and high-frequency trading engine cache requiring stable component supply across multi-year production cycles.

Supply support for CY7C2262XV18-366BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and supply chain support for the former Cypress SRAM portfolio.

This device belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-throughput memory access in packet-processing and real-time signal-path applications where bus turnaround overhead must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C2262XV18-366BZXC?

The DOFF (Data-Off) pin selects read latency mode: HIGH configures 2.5-cycle latency for maximum bandwidth in QDR-II+ Xtreme operation; LOW configures 1-cycle latency for backward compatibility with QDR-I timing. This is a static configuration set at power-up and held throughout operation.

Does CY7C2262XV18-366BZXC require external termination resistors?

No. The device integrates On-Die Termination (ODT) for D[17:0], BWS[1:0], and K/K inputs. A single external resistor tied to the ZQ pin sets the termination value, and the ODT pin selects between two impedance ranges-eliminating up to 22 discrete resistors and associated PCB area.

How does the CQ/CQ echo clock improve system timing margin?

CQ and CQ are free-running, phase-aligned copies of K and K clocks, respectively. They provide source-synchronous timing references at the receiver (e.g., FPGA), allowing data capture with relaxed setup/hold requirements-critical for reliable 900 Mbps DDR operation across temperature and voltage variations.

Can CY7C2262XV18-366BZXC be used in place of CY7C2262AV18-333BZXC?

Yes, with electrical and timing validation. CY7C2262XV18-366BZXC operates at 450 MHz (vs. 333 MHz), has identical 165-ball FBGA packaging and pinout, and shares the same QDR-II+ Xtreme architecture-but requires verification of signal integrity, power delivery, and timing closure at the higher frequency.