Infineon Technologies CY7C2264XV18-366BZXC
- Part No.:
- CY7C2264XV18-366BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C2264XV18-366BZXC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C2264XV18 from Infineon Technologies (formerly Cypress) is a 1 M × 36, 36-Mbit QDR® II+ Xtreme SRAM with synchronous pipelined architecture, 2.5-cycle read latency, and on-die termination (ODT). It operates at 450 MHz with DDR interfaces on both read and write ports (900 MT/s effective), supports independent concurrent read/write transactions, and uses HSTL I/O with VDD = 1.8 V and VDDQ = 1.4–1.6 V. It is deployed in high-bandwidth networking line cards for packet buffering.
For engineers reviewing the CY7C2264XV18 datasheet, CY7C2264XV18 pinout, CY7C2264XV18 application, or CY7C2264XV18 equivalent, key selection criteria include burst depth (2-word), ODT support on D[35:0]/BWS[3:0]/K/K, echo clock timing (CQ/CQ), QVLD data validity signaling, and FBGA-165 package compatibility with high-speed PCB routing constraints.
Technical Context
This SRAM implements a true dual-port QDR II+ Xtreme architecture with physically separate read and write data paths-no bus turnaround required. Its 2.5-cycle read latency is enabled when DOFF is HIGH, while asserting DOFF LOW reverts operation to 1-cycle latency like QDR-I devices.
The device integrates a PLL for precise DDR edge alignment, uses echo clocks (CQ/CQ) synchronized to K/K for simplified high-speed data capture, and supports programmable ODT impedance via ZQ calibration and ODT pin logic level-critical for signal integrity above 400 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1 M × 36 organization) |
| Max Clock Frequency | 450 MHz - enables 900 MT/s DDR throughput per port |
| Read Latency | 2.5 clock cycles - reduces pipeline stalls in burst-heavy traffic |
| VDD / VDDQ | 1.8 V ±0.1 V core / 1.4–1.6 V I/O - supports 1.5 V interface compliance |
| On-Die Termination | Supported on D[35:0], BWS[3:0], K/K - eliminates 24 external 50 Ω resistors |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - 0.8 mm ball pitch, RoHS-compliant |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - matches ASIC/FPGA memory controllers |
Pinout & Package
Available in 165-ball Fine-Pitch Ball Grid Array (FBGA) package, 13 mm × 15 mm × 1.4 mm height, 0.8 mm ball pitch, Pb-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit wide DDR input sampled on rising edges of K/K; supports byte-selectable writes via BWS[3:0] |
| Q[35:0] | Synchronous read data output | 36-bit DDR output aligned to K/K; tristated when RPS is deasserted |
| RPS / WPS | Read/Write port select | Active-low synchronous enables; decouples read/write arbitration at system level |
| BWS[3:0] | Byte write select | Four independent active-low signals controlling 9-bit byte lanes; enables partial-word updates without read-modify-write |
| K / K | Differential clock inputs | Rising-edge-triggered for all synchronous operations; K used for read address/data, K for write address/data |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of K/K - used by FPGA/ASIC to latch Q[35:0] with zero setup/hold margin |
| QVLD | Data validity indicator | Output pulse edge-aligned to CQ/CQ - unambiguously marks valid Q[35:0] during burst transfers |
| ODT | On-die termination control | Logic-level input selecting ODT resistance range (RQ/3.33 or RQ/1.66); configured at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus toggling frequency by 50% versus single-word access, lowering EMI and routing complexity |
| Separate read/write data ports | Enables full-duplex memory access-no bus contention or turnaround delay between consecutive read/write commands |
| Programmable ODT with ZQ calibration | Eliminates need for 28 external termination resistors, saving >12 mm² PCB area and improving impedance matching at 450 MHz |
| DOFF-configurable latency mode | Hardware-selectable 2.5-cycle (DOFF = HIGH) or 1-cycle (DOFF = LOW) read latency-supports migration from legacy QDR-I designs |
| JTAG 1149.1 boundary scan | Enables production testability and interconnect verification without additional probe points on dense high-speed layouts |
Applications
| Telecom Line Cards | Network Processor Buffers |
|---|---|
|
Use Scenario: High-speed packet buffering in 100Gbps+ Ethernet line cards where deterministic latency and zero bus turnaround are required. IC Role / Device Role / Timing Role: Dedicated burst SRAM serving as ingress/egress FIFO with concurrent read/write capability and echo-clock-synchronized data capture. Use Value: 900 MT/s per port bandwidth sustains full line-rate traffic; 2.5-cycle latency ensures sub-6 ns read response for time-sensitive control plane lookups. |
Use Scenario: Deep packet inspection engines requiring simultaneous access to header and payload memory regions. IC Role / Device Role / Timing Role: Dual-port buffer enabling parallel header parsing (read port) and payload modification (write port) within same clock cycle. Use Value: Independent RPS/WPS control allows lock-free concurrent access; full coherency guarantees latest data visibility across both ports. |
| Switch Fabric Memory | High-Frequency Trading Systems |
|
Use Scenario: Centralized shared memory in modular switch fabrics handling multi-terabit switching matrices. IC Role / Device Role / Timing Role: QDR II+ Xtreme SRAM acting as crossbar lookup table with deterministic 2.5-cycle latency for arbitration decisions. Use Value: On-die termination and HSTL I/O maintain signal integrity across 20+ inch backplane traces; 165-ball FBGA enables dense memory stacking. |
Use Scenario: Ultra-low-latency order book synchronization in FPGA-accelerated trading platforms. IC Role / Device Role / Timing Role: Time-critical buffer storing real-time market depth data with guaranteed read availability every 2.22 ns (450 MHz). Use Value: QVLD pin eliminates timing uncertainty in data capture; echo clocks (CQ/CQ) enable zero-margin sampling in 7-series/Xilinx Versal designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615 | 36-Mbit QDR-II+, 333 MHz max, no ODT, 165-ball FBGA, 2-cycle latency only | Lacks ODT and echo clocks; requires external termination and tighter board layout control | Preferred where cost sensitivity outweighs signal integrity requirements and clock frequency ≤333 MHz suffices |
| AS7C362000B | 36-Mbit QDR-II+, 400 MHz max, no DOFF latency selection, 165-ball FBGA, 2.5-cycle latency fixed | Fixed latency mode limits design reuse; no JTAG boundary scan support | Selected when legacy QDR-I compatibility is unnecessary and JTAG test access is not required |
Compared with IDT72T3615 and AS7C362000B, CY7C2264XV18 uniquely combines 450 MHz operation, hardware-selectable latency (1- or 2.5-cycle), integrated ODT, and echo clocks-enabling simpler PCB routing, higher bandwidth, and smoother migration from QDR-I systems.
Availability
CY7C2264XV18 is available at Aetrix Electronics and suitable for telecom line cards, network processor buffers, and switch fabric memory requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY7C2264XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and manufacturing for the QDR® II+ Xtreme SRAM portfolio.
This device belongs to Infineon's high-performance memory product line, engineered specifically for deterministic-latency, high-throughput applications in networking infrastructure, data center accelerators, and real-time financial systems.
FAQ
What is the function of the DOFF pin on CY7C2264XV18?
The DOFF (Data-Off) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle latency for QDR II+ Xtreme operation; when LOW, it reverts to 1-cycle latency compatible with legacy QDR-I timing. This pin is sampled at power-up and remains static during operation-no runtime switching is supported.
How does the ODT feature work and what external components does it replace?
ODT provides programmable on-die termination for D[35:0], BWS[3:0], and K/K inputs using an external ZQ resistor (175–350 Ω) tied to the ZQ pin. With ODT enabled, it replaces up to 28 discrete 50 Ω surface-mount termination resistors, reducing PCB area, BOM count, and signal reflection at 450 MHz.
Can CY7C2264XV18 operate with a single-ended clock instead of differential K/K?
No. The device requires true differential K and K clock inputs-both must be driven with complementary HSTL signals. Single-ended clocking violates AC timing specifications and disables proper DDR edge alignment; the internal PLL and echo clock generation depend on differential clock integrity.
What is the role of the QVLD signal and how is it timed relative to data output?
QVLD is an active-high pulse that indicates valid data on Q[35:0]. It is edge-aligned to the rising edges of CQ and CQ echo clocks-not to K/K-and asserts one cycle before valid data appears, providing unambiguous setup/hold reference for downstream capture logic in FPGAs or ASICs.
CY7C2264XV18-366BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 366 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C2264XV18-366BZXC FAQ
1.How can I place an order for CY7C2264XV18-366BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C2264XV18-366BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C2264XV18-366BZXC reliable?
The price and inventory of CY7C2264XV18-366BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2264XV18-366BZXC is usually 5 days.
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Once your CY7C2264XV18-366BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C2264XV18-366BZXC?
For technical support, including CY7C2264XV18-366BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2264XV18-366BZXC requirements.
6.How does Aetrix verify that CY7C2264XV18-366BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C2264XV18-366BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2264XV18-366BZXC meets industry standards.
7.What is the process for return or replacement of CY7C2264XV18-366BZXC?
All CY7C2264XV18-366BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2264XV18-366BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C2264XV18-366BZXC part is unused and in its original packaging.
Return procedure for CY7C2264XV18-366BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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