Infineon Technologies CY7C2265KV18-550BZXI

Overview

CY7C2265KV18 from Cypress Semiconductor is a 1 M × 36, 36-Mbit QDR® II+ SRAM with 2.5-cycle read latency, 550 MHz clock operation, and on-die termination (ODT) supporting D[35:0], BWS[3:0], and K/K inputs. It features separate read/write ports, DDR interfaces delivering 1100 MT/s data rate, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.

For engineers reviewing the CY7C2265KV18 datasheet, CY7C2265KV18 pinout, CY7C2265KV18 application, or CY7C2265KV18 equivalent, key selection criteria include burst depth (4-word), I/O supply compatibility (1.4 V–1.8 V), HSTL interface compliance, FBGA-165 package constraints, and DOFF-controlled latency mode switching between 1-cycle and 2.5-cycle read timing.

Technical Context

The CY7C2265KV18 implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 18-bit address bus (A[17:0]). Each port uses DDR signaling synchronized to complementary K/K clocks, with all inputs latched on rising edges and outputs registered to match echo clock (CQ/CQ) timing.

It integrates a PLL for precise data placement, supports depth expansion via RPS/WPS controls, and enables byte-selectable writes using four BWS signals. ODT configuration is set at power-up via the ODT pin and ZQ resistor network, targeting system impedance matching without external termination resistors.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II+ SRAM applications.

Compared with CY7C2263KV18 and IDT72T3615, the CY7C2265KV18 uniquely combines 550 MHz operation, DOFF-configurable latency, and FBGA-165 packaging-enabling higher throughput in space-constrained telecom and test equipment where timing adaptability and pin efficiency are critical.

Availability

CY7C2265KV18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, telecom baseband processing, and high-speed test equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for CY7C2265KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR® II+ SRAM product line was designed specifically for high-bandwidth, low-latency memory subsystems in networking infrastructure and real-time signal processing systems where concurrent access and deterministic timing are mandatory.

FAQ

What is the function of the DOFF pin on CY7C2265KV18?

The DOFF (Delay OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency (QDR II+ mode); when LOW, it reverts to 1-cycle latency (QDR I compatibility mode). This allows system-level timing optimization without hardware changes and is sampled at initialization, not dynamically during operation.

How does on-die termination (ODT) work on CY7C2265KV18?

ODT is enabled via the ODT pin and calibrated using an external resistor (RQ) tied between ZQ and ground. A LOW on ODT selects RQ/3.33 termination (175–350 Ω range); HIGH selects RQ/1.66 (175–250 Ω). ODT applies to D[35:0], BWS[3:0], and K/K inputs, eliminating need for 32 discrete 50 Ω resistors and improving signal integrity above 500 MHz.

Can CY7C2265KV18 operate with VDDQ = 1.5 V?

Yes. The device supports VDDQ from 1.4 V to VDD (1.8 V), explicitly including 1.5 V operation per datasheet Note 1. At 1.5 V, HSTL output drive strength is reduced versus 1.8 V, but timing parameters remain valid across the full 1.4–1.8 V range, enabling interoperability with 1.5 V ASIC/FPGA I/O banks.

What is the purpose of CQ and CQ echo clocks?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They provide a deterministic, low-jitter timing reference for capturing Q[35:0] output data in high-speed systems. Unlike system clocks, echo clocks track internal path delays, allowing receivers to sample data with minimal setup/hold margin-critical for reliable 1100 MT/s operation.