Infineon Technologies CY7C2270KV18-550BZXC

Overview

CY7C2270KV18 from Infineon Technologies (formerly Cypress) is a 36-Mbit synchronous pipelined DDR II+ SRAM configured as 1M × 36, operating at 550 MHz with 2.5-cycle read latency when DOFF = HIGH, featuring on-die termination (ODT), echo clocks (CQ/CQ), and QVLD data-valid signaling for high-speed memory subsystems in networking line cards and packet buffers.

For engineers reviewing the CY7C2270KV18 datasheet, CY7C2270KV18 pinout, CY7C2270KV18 application, or CY7C2270KV18 equivalent, key selection criteria include its 1M × 36 organization, 1100 MT/s DDR interface, HSTL I/O compatibility, 165-ball FBGA package, and dual-clock (K/K) timing architecture supporting precise data capture in burst-oriented systems.

Technical Context

The CY7C2270KV18 implements a two-word burst architecture where each address access delivers 36-bit data on consecutive rising edges of K and K clocks, enabling 2.5-cycle read latency under DOFF = HIGH or 1-cycle latency under DOFF = LOW. Its internal SRAM core is synchronized by a phase-locked loop (PLL) to align output data with echo clocks CQ/CQ.

All synchronous inputs-address (A[18:0]), R/W, LD, BWS[3:0], and DQ[35:0]-are registered on K or K edges; outputs are edge-aligned to CQ/CQ with QVLD indicating valid data windows. ODT supports dynamic impedance matching on DQ, BWS, and clock inputs using ZQ calibration.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with CY7C2270KV18-450BZXC, the -550BZXC delivers +22% bandwidth and tighter timing margins for next-gen packet processing; versus AS7C3256B-15JCIN, it offers burst DDR architecture essential for high-throughput data planes but requires full DDR timing design discipline.

Availability

CY7C2270KV18 is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, network processor co-processor memory, and test equipment pattern memory requiring stable component supply and long-term industrial availability.

Supply support for CY7C2270KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-performance memory solutions.

The CY7C2270KV18 belongs to Infineon's QDR II+ SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory subsystems in networking and communications infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C2270KV18?

The DOFF (Double-Off) pin configures read latency mode: when asserted HIGH, it enables DDR II+ operation with 2.5-cycle read latency; when LOW, it reverts to DDR I behavior with 1-cycle latency. This allows hardware-level compatibility switching without firmware changes or external logic.

How does the ZQ pin calibrate output impedance?

ZQ connects to an external precision resistor (typically 240 Ω) to ground, enabling internal circuitry to set output driver and ODT impedance to 0.2 × RQ (e.g., 48 Ω). Direct connection to VDDQ activates minimum-impedance mode; floating or grounding ZQ is prohibited and may cause undefined behavior.

Can CY7C2270KV18 operate with only the K clock, ignoring K?

No. The device requires both K and K differential clocks for correct operation: K latches address and control signals, while both K and K sample write data and drive read data. Omitting K violates timing requirements and will result in failed writes or invalid read outputs.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes - the CY7C2270KV18-550BZXC uses a JEDEC-standard 165-ball FBGA package qualified for IPC/JEDEC J-STD-020 moisture sensitivity level 3 and compatible with standard lead-free reflow profiles (peak temperature ≤ 260°C, time above liquidus 60–150 seconds).