Infineon Technologies CY7C2564XV18-450BZXI

Overview

CY7C2564XV18-450BZXI from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with 450 MHz clock frequency, 2.5-cycle read latency, and on-die termination (ODT) for D[35:0], BWS[3:0], and K/K inputs. It features separate read/write ports, DDR interfaces on both ports (900 Mbps effective data rate), and HSTL I/O supporting 1.5 V VDDQ. Used in high-bandwidth network packet buffering and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C2564XV18-450BZXI datasheet, CY7C2564XV18-450BZXI pinout, CY7C2564XV18-450BZXI application, or CY7C2564XV18-450BZXI equivalent, key selection criteria include 2.5-cycle vs. 1-cycle latency mode (DOFF-controlled), ODT impedance configuration via ZQ/ODT pins, echo clock timing alignment (CQ/CQ), and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements QDR II+ architecture with fully independent synchronous read and write ports sharing a multiplexed address bus. Address latching occurs on alternate rising edges of K and K clocks, enabling concurrent access without bus turnaround. The internal PLL ensures precise data placement relative to echo clocks CQ and CQ.

Read operations deliver two sequential 36-bit words per access with 2.5-cycle latency when DOFF = HIGH; switching to 1-cycle latency (QDR I mode) when DOFF = LOW. On-die termination supports programmable input impedance (175–350 Ω range) via external ZQ resistor and ODT pin state, eliminating need for discrete termination resistors on D, BWS, and clock lines.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant Pb-free construction (BZXI suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with AS7C36256P-15JIN and MT47H64M16HR-37E, CY7C2564XV18-450BZXI uniquely delivers deterministic 2.5-cycle latency, true dual-port concurrency, and integrated ODT - essential for FPGA-ASIC interconnects demanding sub-7 ns read response and zero bus turnaround penalty.

Availability

CY7C2564XV18-450BZXI is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and telecom baseband processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C2564XV18-450BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets.

This device belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in FPGA- and ASIC-based networking and signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C2564XV18-450BZXI?

The DOFF (Data-Off) pin controls read latency mode: when HIGH, the device operates in QDR II+ Xtreme mode with 2.5-cycle read latency; when LOW or tied to VSS, it reverts to QDR I mode with 1-cycle latency. This pin is sampled at power-up and remains latched during operation, enabling system-level optimization between bandwidth and timing margin.

How does the ZQ pin interact with the ODT feature?

The ZQ pin connects to an external 240 Ω ±1% resistor to ground, providing the reference for on-die termination calibration. During power-up initialization, the device measures this resistor and scales internal termination impedances accordingly - selecting either RQ/3.33 (ODT = LOW) or RQ/1.66 (ODT = HIGH) - ensuring accurate impedance matching across voltage and temperature variations.

Can CY7C2564XV18-450BZXI be used with a 1.8 V-only supply?

No. The device requires two independent supplies: core VDD = 1.8 V ±0.1 V and I/O VDDQ = 1.4–1.6 V (typically 1.5 V). Using 1.8 V on VDDQ violates absolute maximum ratings and will damage HSTL output buffers. Separate regulation is mandatory to meet HSTL Class I input thresholds and drive strength specifications.

What is the purpose of the CQ and CQ echo clocks?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They provide a clean, low-skew timing reference at the receiver (e.g., FPGA input register) to capture Q[35:0] data without requiring complex input delay tuning. Their edge alignment with QVLD enables robust, margin-insensitive data sampling in 450 MHz DDR systems.