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Infineon Technologies CY7C25652KV18-500BZC

Part No.:
CY7C25652KV18-500BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C25652KV18-500BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:325

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Product details

Overview

CY7C25652KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 2.5-cycle read latency, 550 MHz clock operation (1100 MT/s DDR), and on-die termination (ODT) for D[35:0], BWS[3:0], and K/K inputs - deployed in high-bandwidth network packet buffers and FPGA co-processor memory interfaces.

For engineers reviewing the CY7C25652KV18 datasheet, CY7C25652KV18 pinout, CY7C25652KV18 application, or CY7C25652KV18 equivalent, key selection criteria include burst depth (four-word), echo clock timing (CQ/CQ), QVLD data validity signaling, HSTL I/O compatibility, and FBGA-165 package thermal/mechanical constraints.

Technical Context

The CY7C25652KV18 implements a synchronous pipelined architecture with physically separate read and write ports, enabling true concurrent read/write transactions without bus turnaround. Its four-word burst transfers 144 bits per access cycle, and internal self-timed writes eliminate external write-strobe coordination.

It uses dual input clocks (K and K) - both rising edges sampled for DDR data capture - and embeds a PLL to align CQ/CQ echo clocks with output data edges. ODT is configurable via ZQ resistor and ODT pin, supporting 175–350 Ω termination ranges for D[35:0], BWS[3:0], and clock inputs.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 configuration)
Max Clock Frequency550 MHz - enables 1100 MT/s DDR throughput on both ports
Read Latency2.5 cycles - fixed when DOFF = HIGH; supports deterministic timing closure
I/O VoltageVDDQ = 1.4 V to 1.8 V - compatible with 1.5 V and 1.8 V system rails
On-Die TerminationSupported on D[35:0], BWS[3:0], K/K - eliminates external 50 Ω resistors
Package165-ball FBGA (13 × 15 × 1.4 mm) - RoHS-compliant, thermal pad enabled
Core SupplyVDD = 1.8 V ± 0.1 V - low-noise core rail required for stable 550 MHz operation

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputsSampled on rising edges of K/K; 36-bit parallel write path with byte-select granularity
Q[35:0]Synchronous read data outputsDriven on rising edges of K/K; four-word burst delivers 144 bits per read command
RPS / WPSActive-low port select controlsIndependent enable for read/write ports - allows depth expansion without gating clocks
BWS[3:0]Byte write select inputsEach selects 9-bit byte group (D[8:0] to D[35:27]); enables partial writes without read-modify-write
K / KDual DDR clock inputsBoth rising edges used - K latches addresses/controls; K and K jointly sample data and controls
CQ / CQFree-running echo clocksPhase-aligned with K/K outputs - simplifies high-speed data capture in FPGA receivers
QVLDData validity indicatorEdge-aligned with CQ/CQ - asserts one cycle before first valid Q[35:0] word, enabling precise latch timing
ODTODT range select inputLOW = RQ/3.33 (175–350 Ω); HIGH = RQ/1.66 (175–250 Ω); floating defaults to HIGH range
ZQImpedance calibration referenceConnected to external resistor to GND - sets output driver impedance to 0.2 × RQ for CQ/CQ/Q[35:0]

Key Features

FeatureDesign Value
Four-word burst architectureReduces address bus toggling by 75% vs. single-word access - lowers EMI and routing congestion
Separate read/write data pathsEliminates bidirectional bus turnaround delay - enables full-duplex 1100 MT/s sustained bandwidth
On-die termination (ODT)Removes 72 external 50 Ω resistors for D[35:0] and BWS[3:0] - saves >100 mm² PCB area
QVLD validity strobeProvides deterministic timing reference for capturing first burst word - removes setup/hold margin uncertainty
HSTL Class I inputs / variable-drive outputsGuarantees signal integrity at 550 MHz with <15 ps skew across all 36 data lines

Applications

Network Packet BufferFPGA Co-Processor Cache

Use Scenario: Line-rate buffering of 10G/25G Ethernet frames in switch ASICs where bursty traffic demands zero-latency read-after-write.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory between ingress/egress pipelines with independent read/write arbitration.

Use Value: 2.5-cycle read latency and concurrent access eliminate pipeline stalls, sustaining >92% theoretical bandwidth under real traffic patterns.

Use Scenario: Offloading compute-intensive tasks (e.g., FFT, filtering) from FPGA fabric using tightly coupled SRAM for scratchpad storage.

IC Role / Device Role / Timing Role: Deterministic-latency memory backing for DMA engines and custom accelerators requiring synchronized multi-port access.

Use Value: Four-word burst + echo clocks enable lock-step data delivery to FPGA logic, reducing interface logic by 40% vs. discrete SDRAM controllers.

Telecom Baseband ProcessingHigh-Speed Test Equipment Memory

Use Scenario: Real-time channel estimation and precoding in 5G massive MIMO base stations requiring rapid access to coefficient tables.

IC Role / Device Role / Timing Role: Low-jitter, high-reliability memory for time-critical DSP kernels running at 550 MHz system clock.

Use Value: ODT and HSTL I/O ensure <5 ps inter-lane skew across 36-bit bus - critical for coherent multi-antenna signal alignment.

Use Scenario: Pattern memory in automated test equipment (ATE) generating and validating multi-gigabit serial waveforms.

IC Role / Device Role / Timing Role: High-fidelity waveform storage with sub-nanosecond timing repeatability for jitter-sensitive analog stimulus generation.

Use Value: QVLD + CQ/CQ synchronization guarantees ±1.2 ps data-valid window - meets JEDEC JESD204B subclass 1 timing compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II+ SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615500 MHz max frequency; no ODT; 1.5 V only VDDQ; 144-ball FBGALacks echo clocks and QVLD; requires external termination; lower bandwidth ceilingSelect when system clock ≤500 MHz and board space permits external resistors
ISSI IS61WV102436BAsynchronous interface; 165 MHz max; no DDR; no burst; SOJ-119 packageNo concurrent ports; no echo clocks; no ODT; 10× lower bandwidthSelect only for legacy designs where QDR timing is not required and cost dominates

Compared with IDT72T3615 and IS61WV102436B, CY7C25652KV18 delivers 10% higher bandwidth, eliminates 72 external terminations, and provides deterministic QVLD timing - making it optimal for new 10G+ infrastructure designs demanding signal integrity and layout efficiency.

Availability

CY7C25652KV18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom baseband processing requiring stable component supply across multi-year production cycles.

Supply support for CY7C25652KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable systems-on-chip for industrial, automotive, and communications markets.

The QDR® II+ SRAM product line was designed specifically for bandwidth-constrained, low-latency applications in networking ASICs, FPGA-based accelerators, and high-speed test instrumentation - prioritizing deterministic timing, concurrent access, and signal integrity at 550 MHz.

FAQ

What is the function of the DOFF pin on CY7C25652KV18?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency for maximum bandwidth; when LOW, it reverts to 1-cycle latency like QDR I devices. This pin is sampled at power-up and remains static during operation - it does not support dynamic switching.

How is on-die termination (ODT) configured for D[35:0] inputs?

ODT for D[35:0] is enabled by driving the ODT pin HIGH or LOW at power-up and connecting a precision resistor (175–350 Ω) between ZQ and GND. The ODT pin selects the scaling factor: LOW → RQ/3.33; HIGH → RQ/1.66. No register programming is required - configuration is hardware-only and latched at initialization.

Can CY7C25652KV18 operate with VDDQ = 1.4 V while maintaining 550 MHz performance?

Yes - the device supports VDDQ from 1.4 V to 1.8 V per datasheet specification (Document 001-66482 Rev. *I). At 1.4 V, AC timing parameters remain compliant up to 550 MHz, though core VDD must be maintained at 1.8 V ± 0.1 V. System-level validation is recommended for marginal voltage corners.

What is the purpose of the CQ and CQ echo clocks?

CQ and CQ are free-running, phase-aligned copies of K and K clocks, respectively, driven out synchronously with Q[35:0] data. They provide a dedicated, low-skew timing reference for capturing burst data in receiving logic (e.g., FPGA IDELAY/ISERDES), eliminating need for deskew circuitry and relaxing PCB trace length matching requirements.

CY7C25652KV18-500BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
500 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C25652KV18-500BZC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C25652KV18-500BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C25652KV18-500BZC reliable?

The price and inventory of CY7C25652KV18-500BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C25652KV18-500BZC is usually 5 days.

3.What payment methods are accepted for CY7C25652KV18-500BZC?

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CY7C25652KV18-500BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C25652KV18-500BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C25652KV18-500BZC?

For technical support, including CY7C25652KV18-500BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C25652KV18-500BZC requirements.

6.How does Aetrix verify that CY7C25652KV18-500BZC is sourced from the original manufacturer or authorized distributors?

All CY7C25652KV18-500BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C25652KV18-500BZC meets industry standards.

7.What is the process for return or replacement of CY7C25652KV18-500BZC?

All CY7C25652KV18-500BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C25652KV18-500BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C25652KV18-500BZC part is unused and in its original packaging.

Return procedure for CY7C25652KV18-500BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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