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Infineon Technologies CY7C25652KV18-550BZXC

Part No.:
CY7C25652KV18-550BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C25652KV18-550BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,729

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Product details

Overview

CY7C25652KV18 from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 550 MHz clock frequency, 2.5-cycle read latency, and on-die termination (ODT) supporting D[35:0], BWS[3:0], and K/K inputs. It delivers 1100 MT/s data rate via DDR interfaces on independent read/write ports and operates at core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4–1.8 V, targeting high-bandwidth packet buffering in network line cards.

For engineers reviewing the CY7C25652KV18 datasheet, CY7C25652KV18 pinout, CY7C25652KV18 application, or CY7C25652KV18 equivalent, this device is selected for systems requiring concurrent read/write access, precise echo-clock–based data capture, and impedance-matched HSTL signaling without external termination resistors.

Technical Context

The CY7C25652KV18 implements a synchronous pipelined architecture with physically separate read and write data paths, enabling true concurrency-reads and writes may occur simultaneously without bus turnaround. Its four-word burst transfers 144 bits per read or write cycle, latching addresses on alternating rising edges of complementary K/K clocks.

It integrates a PLL for accurate data placement, echo clocks (CQ/CQ) aligned to output data for simplified high-speed capture, and a programmable ODT controller tied to ZQ and ODT pins to set output impedance to 0.2 × RQ. The DOFF pin selects between 2.5-cycle (HIGH) and 1-cycle (LOW) read latency modes, preserving backward compatibility with QDR I systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 configuration)
Maximum Clock Frequency 550 MHz - enables 1100 MT/s DDR throughput on both ports
Read Latency 2.5 cycles (DOFF = HIGH) - balances bandwidth and timing margin in high-speed switch fabric
VDD / VDDQ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4–1.8 V - supports dual-voltage system integration
On-Die Termination Configurable ODT for D[35:0], BWS[3:0], K/K - eliminates 32+ external 50 Ω resistors, reducing PCB area and signal integrity risk
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for thermal and routing-constrained telecom modules
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - ensures compatibility with FPGA/ASIC memory controllers meeting JEDEC JESD8-15A

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs Latched on rising edges of K/K; full 36-bit parallel write path enables single-cycle burst loading
Q[35:0] Synchronous read data outputs DDR-aligned outputs driven on K/K rising edges; QVLD indicates valid data edge-aligned with CQ/CQ
BWS[3:0] Byte write select inputs Independent 9-bit byte enables (BWS0–BWS3); allows partial-word writes without read-modify-write overhead
RPS / WPS Read/Write port select (active LOW) Asynchronous port enable; deassertion tri-states Q[35:0] or ignores D[35:0], enabling depth expansion
K / K Differential clock inputs Rising-edge–triggered for all synchronous operations; K drives read logic, K drives write logic
CQ / CQ Echo clock outputs Free-running, phase-aligned copies of K/K; used by receiving logic to sample Q[35:0] with zero setup/hold penalty
ZQ / ODT Impedance calibration control ZQ sets output drive strength (0.2 × RQ); ODT selects ODT range (LOW = RQ/3.33, HIGH = RQ/1.66)

Key Features

Feature Design Value
Separate read/write ports Enables simultaneous 1100 MT/s read + 1100 MT/s write - no arbitration delay or bus contention in traffic shaping buffers
Four-word burst architecture Reduces address bus toggling by 75% vs. single-word access - lowers EMI and simplifies address routing in dense backplanes
Programmable 2.5/1-cycle latency DOFF pin selects mode at power-up - supports migration from legacy QDR I designs without redesigning timing constraints
HSTL I/O with variable drive Meets JEDEC JESD8-15A; drive strength tuned via ZQ - ensures signal integrity across 10+ inch FR4 traces at 550 MHz
JTAG 1149.1 test access port Enables boundary scan testing of interconnects and BGA solder joints - critical for high-reliability telecom hardware validation

Applications

Network Packet Buffering High-Speed Switch Fabric

Use Scenario: Storing ingress/egress packets in 10G/40G Ethernet line cards where sustained 2200 MB/s bidirectional bandwidth is required.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level shared buffer between ingress parser and egress scheduler, synchronized to line-rate clocks.

Use Value: Concurrent read/write eliminates serialization bottlenecks; ODT removes 36 termination resistors per device, cutting board area by >12 mm².

Use Scenario: Implementing crossbar switch lookup tables and queue management in carrier-grade routers with sub-100 ns latency budgets.

IC Role / Device Role / Timing Role: Low-latency memory for forwarding decision caching and priority queue indexing, clocked at 550 MHz with echo-clock–driven sampling.

Use Value: 2.5-cycle latency mode meets timing closure at 550 MHz; CQ/CQ alignment eliminates FPGA input register timing uncertainty.

Telecom Baseband Processing Test Equipment Memory Subsystem

Use Scenario: Supporting real-time channel bonding and OFDM symbol buffering in LTE-Advanced base stations with multi-carrier aggregation.

IC Role / Device Role / Timing Role: Burst-access SRAM interfacing directly to ASIC baseband processors via HSTL buses, handling 144-bit wide data bursts.

Use Value: Four-word burst reduces address bus width to 19 pins; BWS[3:0] enables selective update of modulation-specific metadata without full-word overwrite.

Use Scenario: Serving as acquisition memory in high-sample-rate oscilloscopes and protocol analyzers requiring deterministic 1100 MT/s capture and playback.

IC Role / Device Role / Timing Role: High-throughput FIFO replacement with guaranteed coherency between read and write pointers under concurrent access.

Use Value: Full data coherency ensures latest-written samples are always read; JTAG support enables in-system verification of memory integrity post-calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 36-Mbit (1M × 36), 1000 MHz interface (500 MHz clock), no ODT, LVDS I/O Higher speed but half density; requires external termination and differential routing Select when >1 Gbps bandwidth is mandatory and board space allows LVDS layout complexity
ISSI IS61WV102432ALL 32-Mbit (1M × 32), 200 MHz async interface, no burst, no ODT, CMOS I/O Lower cost, lower performance; lacks concurrency, DDR, and echo clocks Select only for non-real-time buffering where latency >50 ns is acceptable and BOM cost dominates

Compared with IDT72T36120L10BG and ISSI IS61WV102432ALL, the CY7C25652KV18 uniquely combines 72-Mbit density, 550 MHz QDR II+ concurrency, integrated ODT, and echo-clock timing - making it the only choice for space-constrained, high-coherency telecom buffer designs requiring <10 ns read-to-write turnaround.

Availability

CY7C25652KV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric, telecom baseband processing, and test equipment memory subsystems requiring stable component supply across extended product lifecycles.

Supply support for CY7C25652KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR® II+ SRAM product line was engineered specifically for deterministic, low-latency, high-bandwidth buffering in networking infrastructure - emphasizing concurrent access, signal integrity at >500 MHz, and system-level integration simplicity.

FAQ

What is the function of the DOFF pin on CY7C25652KV18?

The DOFF (Double-Off) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle latency for optimal bandwidth in QDR II+ operation; when LOW, it reverts to 1-cycle latency compatible with legacy QDR I timing. This selection is sampled at power-up and remains static during operation - no runtime switching is supported.

How does On-Die Termination (ODT) work on CY7C25652KV18?

ODT is enabled via the ODT pin and calibrated using an external resistor (RQ) tied between ZQ and ground. A LOW on ODT selects RQ/3.33 termination (175–350 Ω range); HIGH selects RQ/1.66 (175–250 Ω). Supported signals include all D[35:0], BWS[3:0], and K/K inputs - eliminating need for 40+ discrete 50 Ω resistors and improving signal integrity at 550 MHz.

Can CY7C25652KV18 be used with a 1.5 V VDDQ supply?

Yes. The device supports VDDQ from 1.4 V to VDD (1.8 V), explicitly including 1.5 V operation per datasheet Note 1. At 1.5 V, HSTL output drive strength is reduced versus 1.8 V, but timing parameters remain valid across the full 550 MHz range - verified in AC Electrical Characteristics tables for VDDQ = 1.5 V conditions.

What is the purpose of CQ and CQ echo clocks?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They are routed alongside Q[35:0] outputs to the receiving device (e.g., FPGA) to provide a dedicated, jitter-minimized strobe for capturing DDR data. This eliminates setup/hold timing uncertainty at the receiver, enabling reliable 1100 MT/s operation without complex deskew circuitry.

CY7C25652KV18-550BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
550 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C25652KV18-550BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C25652KV18-550BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C25652KV18-550BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C25652KV18-550BZXC is usually 5 days.

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4.How is shipping managed for CY7C25652KV18-550BZXC?

CY7C25652KV18-550BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C25652KV18-550BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C25652KV18-550BZXC?

For technical support, including CY7C25652KV18-550BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C25652KV18-550BZXC requirements.

6.How does Aetrix verify that CY7C25652KV18-550BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C25652KV18-550BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C25652KV18-550BZXC meets industry standards.

7.What is the process for return or replacement of CY7C25652KV18-550BZXC?

All CY7C25652KV18-550BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C25652KV18-550BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C25652KV18-550BZXC part is unused and in its original packaging.

Return procedure for CY7C25652KV18-550BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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