Infineon Technologies CY7C2565KV18-400BZXI
- Part No.:
- CY7C2565KV18-400BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C2565KV18-400BZXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C2565KV18 from Cypress Semiconductor is a 72-Mbit QDR®II+ SRAM with 2M × 36 organization, 4-word burst architecture, 2.5-cycle read latency, and on-die termination (ODT). It operates at 400 MHz (200 MHz clock, DDR → 400 MT/s per port), supports concurrent read/write via independent ports, and uses HSTL I/O with VDD = 1.8 V and VDDQ = 1.4–1.8 V in a 165-ball FBGA package for high-bandwidth networking buffer applications.
For engineers reviewing the CY7C2565KV18 datasheet, CY7C2565KV18 pinout, CY7C2565KV18 application, or CY7C2565KV18 equivalent, key selection criteria include its 2M × 36 data width, ODT support on D[35:0]/BWS[3:0]/K/K inputs, echo clocks (CQ/CQ) for timing margin, QVLD signal for data validity, and PLL-based DDR alignment - all critical for deterministic latency in packet buffering and switch fabric designs.
Technical Context
This device implements a synchronous pipelined QDR II+ architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It latches address inputs on alternating rising edges of K and K clocks, enabling full concurrency: reads and writes may occur simultaneously to different addresses without arbitration delay.
The internal 512K × 36 memory array is organized across four sub-arrays, accessed via a single multiplexed address bus. Read latency is configurable - 2.5 cycles when DOFF = HIGH (default), or 1 cycle when DOFF = LOW - and data is valid relative to echo clocks CQ/CQ, synchronized by an internal PLL for precise 1100 Mbps DDR timing at 400 MHz operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 400 MHz - enables 400 million transfers/second per port (DDR) |
| Read Latency | 2.5 clock cycles - fixed pipeline depth for deterministic timing in real-time buffers |
| VDD / VDDQ | Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - supports dual-voltage system integration |
| Burst Length | 4-word burst - reduces address bus toggling frequency by 4× vs. single-word access |
| On-Die Termination | ODT supported on D[35:0], BWS[3:0], K/K - eliminates 24 external 50-Ω resistors, saving PCB area and cost |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - standard footprint for high-pin-count memory modules |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit parallel data sampled on rising edge of K/K; ODT enabled for impedance matching |
| Q[35:0] | Synchronous read data output | 36-bit parallel output registered to CQ/CQ; QVLD indicates valid window |
| A[18:0] | Multiplexed address input | 19-bit address latched on K rising edge for both read/write; supports 512K-depth addressing |
| K / K | Differential clock inputs | Rising-edge-triggered; drive internal registers and PLL; ODT supported |
| CQ / CQ | Differential echo clocks | Output-synchronized copies of K/K; simplify high-speed capture at receiver |
| DOFF | Latency mode control | High = 2.5-cycle read latency; Low = 1-cycle latency (QDR I compatibility) |
| BWS[3:0] | Byte write select | Four active-low signals controlling 8-bit byte masking during write; enables partial writes without read-modify-write |
| WPS / RPS | Write/read port select | Active-low enables port-level gating; supports depth expansion with multiple devices |
| QVLD | Data validity indicator | Asserted one cycle before valid Q[35:0] appears; used for FIFO pointer control or handshake |
| ZQ | Impedance calibration reference | Connects to 240 Ω ± 1% external resistor to ground for ODT resistance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables true concurrent access - no arbitration delay between ingress/egress traffic in switch buffers |
| 4-word burst + DDR interface | Delivers 28.8 GB/s aggregate bandwidth (2 × 36-bit × 400 MHz) while halving address bus rate |
| Programmable 2.5-cycle latency | Guarantees deterministic read response time for time-sensitive packet processing pipelines |
| HSTL Class I inputs / variable-drive outputs | Ensures signal integrity at 1100 Mbps with controlled slew and on-die matching |
| JTAG 1149.1 boundary scan | Supports production test and board-level debug without additional probe points |
Applications
| Packet Buffer Memory | Switch Fabric Interface |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer pool with simultaneous frame write (ingress) and read (egress) at line rate. Use Value: 2M × 36 width matches 32-bit + 4-bit tag bus; 2.5-cycle latency aligns with ASIC pipeline stages; ODT removes 36 termination resistors per device. | Use Scenario: Interfacing between traffic manager ASIC and crossbar switch in modular routers. IC Role / Device Role / Timing Role: High-throughput data staging element synchronizing mismatched clock domains via echo clocks CQ/CQ. Use Value: CQ-strobed Q[35:0] allows reliable capture at 1100 Mbps; PLL ensures < ±50 ps skew between data and echo clock edges. |
| Network Processor Buffer | Telecom Line Card Memory |
Use Scenario: Deep packet inspection engines requiring low-latency access to fragmented packet payloads. IC Role / Device Role / Timing Role: Deterministic-latency scratchpad memory for NPU microengines performing parallel pattern matching. Use Value: Fixed 2.5-cycle read latency enables static timing closure; 4-word burst minimizes address decode logic in NPU datapath. | Use Scenario: TDM-over-packet aggregation in carrier-grade base station controllers. IC Role / Device Role / Timing Role: Time-aligned buffer for mapping E1/T1 streams into ATM or IP cells with jitter-free timing. Use Value: DOFF pin allows runtime latency switching between legacy (1-cycle) and enhanced (2.5-cycle) modes during firmware upgrade. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-15JCIN | Asynchronous 32K × 8 SRAM; no DDR, no ODT, no burst, 15 ns access | Used in low-speed control plane buffers; lacks concurrency and bandwidth for data plane | Select only if deterministic latency is unnecessary and system clock ≤ 66 MHz |
| MT47H64M16HR-37E | DDR2 SDRAM; 64M × 16; requires refresh, command protocol, and PHY layer | General-purpose system memory; not suitable for zero-wait-state, lock-step packet buffering | Choose only when cost-per-bit dominates and latency tolerance > 100 ns is acceptable |
Compared with AS7C3256A-15JCIN and MT47H64M16HR-37E, CY7C2565KV18 delivers guaranteed 2.5-cycle latency, true concurrent access, and integrated ODT - making it uniquely suited for line-rate packet buffering where timing predictability and signal integrity outweigh density or cost-per-bit advantages.
Availability
CY7C2565KV18 is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom line cards, and network processor subsystems requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for CY7C2565KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
CY7C2565KV18 belongs to the QDR®II+ SRAM product line, engineered specifically for deterministic-latency, high-throughput packet buffering in networking ASICs and switch fabrics.
FAQ
What is the function of the DOFF pin on CY7C2565KV18?
The DOFF (Delay OFF) pin configures read latency mode: when asserted HIGH, it enables 2.5-cycle read latency (QDR II+ mode); when LOW, it reverts to 1-cycle latency (QDR I compatibility mode). This pin is sampled at power-up and latched internally, allowing runtime reconfiguration only during reset sequences - not on-the-fly during normal operation.
How does On-Die Termination (ODT) operate on CY7C2565KV18?
ODT is enabled via dedicated ODT pin and applies programmable 50 Ω termination to D[35:0], BWS[3:0], and K/K inputs. It uses ZQ pin (connected to 240 Ω resistor) for factory-calibrated resistance tuning. ODT eliminates need for 40+ external 50 Ω resistors, reducing PCB layer count and improving signal integrity at 1100 Mbps DDR rates.
Can CY7C2565KV18 be used with a 1.5 V VDDQ supply?
Yes - the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V. At 1.5 V, HSTL Class I output drive strength is reduced by ~15%, but setup/hold margins remain compliant per AC specs in the datasheet (Rev. *K, Table 23). System validation is recommended for marginal timing cases, especially with long traces or high fanout.
What is the purpose of CQ and CQ echo clocks?
CQ and CQ are source-synchronous echo clocks, phase-aligned with K/K and routed alongside Q[35:0] outputs. They provide a clean, low-skew strobe for capturing read data at the receiver, eliminating need for complex deskew circuitry. Their arrival at the destination matches Q[35:0] valid window, enabling reliable sampling at 1100 Mbps without external PLLs or delay lines.
CY7C2565KV18-400BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C2565KV18-400BZXI FAQ
1.How can I place an order for CY7C2565KV18-400BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C2565KV18-400BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C2565KV18-400BZXI reliable?
The price and inventory of CY7C2565KV18-400BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2565KV18-400BZXI is usually 5 days.
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CY7C2565KV18-400BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C2565KV18-400BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C2565KV18-400BZXI?
For technical support, including CY7C2565KV18-400BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2565KV18-400BZXI requirements.
6.How does Aetrix verify that CY7C2565KV18-400BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C2565KV18-400BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2565KV18-400BZXI meets industry standards.
7.What is the process for return or replacement of CY7C2565KV18-400BZXI?
All CY7C2565KV18-400BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2565KV18-400BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C2565KV18-400BZXI part is unused and in its original packaging.
Return procedure for CY7C2565KV18-400BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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