Infineon Technologies CY7C2565KV18-450BZC

Overview

CY7C2565KV18 from Cypress Semiconductor is a 72-Mbit QDR®II+ SRAM with 2M × 36 organization, 4-word burst architecture, 2.5-cycle read latency, and on-die termination (ODT). It operates at 450 MHz with DDR interfaces on both read and write ports (900 Mbps effective data rate), supports separate independent read/write ports for concurrent transactions, and uses HSTL I/O with VDDQ = 1.4–1.8 V. It is deployed in high-bandwidth network packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C2565KV18 datasheet, CY7C2565KV18 pinout, CY7C2565KV18 application, or CY7C2565KV18 equivalent, key selection criteria include burst depth compatibility, ODT support on D[35:0]/BWS[3:0]/K/K inputs, 165-ball FBGA (13 × 15 × 1.4 mm) mechanical fit, 2.5-cycle vs. 1-cycle latency mode via DOFF control, and JTAG 1149.1 test access capability.

Technical Context

This device implements a synchronous pipelined SRAM architecture with physically separated read and write data paths, eliminating bus turnaround overhead. Its dual DDR interfaces operate on rising edges of complementary K/K clocks, while echo clocks CQ/CQ align output timing to simplify high-speed capture.

The internal 512K × 36 memory array is accessed via a multiplexed 19-bit address bus latched on alternating K-clock edges. Latency mode is selected dynamically: DOFF = HIGH enables 2.5-cycle read latency; DOFF = LOW reverts to 1-cycle latency compatible with legacy QDR I systems.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Compared with CY7C2565KV18-550BZC, this -450BZC variant trades 22% bandwidth for 15% lower operating current and relaxed PCB layout constraints; versus AS7C3256A-15JCIN, it delivers 4.5× higher effective throughput and deterministic latency but requires DDR-aware PHY design.

Availability

CY7C2565KV18 is available at Aetrix Electronics and suitable for network switching infrastructure, FPGA-accelerated computing, telecom baseband processing, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for CY7C2565KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

The QDR®II+ SRAM product line was designed specifically for bandwidth-constrained, low-latency applications in networking and telecommunications infrastructure - emphasizing concurrent access, DDR efficiency, and signal integrity at multi-GHz data rates.

FAQ

What is the function of the DOFF pin on CY7C2565KV18?

The DOFF (Double-Off) pin selects read latency mode: when asserted HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency for maximum bandwidth; when LOW, it reverts to QDR I-compatible 1-cycle latency. This pin is sampled synchronously on the rising edge of the K clock during initialization and remains latched until reset or power cycle.

Can CY7C2565KV18 interface directly with Xilinx Ultrascale+ FPGA memory controllers?

Yes - its HSTL Class I inputs and variable-drive HSTL outputs match Xilinx Ultrascale+ HP I/O bank requirements. The CQ/CQ echo clocks align with IDELAYE3 input delay calibration, and QVLD provides a reliable data-valid signal for capture without manual timing closure. Full support is documented in Xilinx PG159 and UG571.

How does On-Die Termination (ODT) reduce system-level design effort?

ODT eliminates the need for 42 discrete 50 Ω termination resistors (36 D-lines + 4 BWS + 2 clocks), reducing PCB layer count, saving >12 mm² area, and removing stub-induced impedance discontinuities. It is enabled via the ODT pin and applies only during active cycles - minimizing standby power impact.

Is the 165-ball FBGA package of CY7C2565KV18 compatible with standard reflow profiles?

Yes - the Pb-free 165-ball FBGA (package code BZC) is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C, 60-second duration above 217°C). Thermal pad (ball ZQ) must be soldered to a dedicated thermal plane for reliable operation at 450 MHz.