Infineon Technologies CY7C25702KV18-500BZXC

Overview

CY7C25702KV18-500BZXC from Cypress Semiconductor is a 72-Mbit synchronous pipelined DDR II+ SRAM with 2M × 36 organization, 500 MHz clock operation (1000 MT/s data rate), 2.5-cycle read latency (DOFF = HIGH), and on-die termination (ODT) for DQ, BWS, and K/K inputs. It delivers high-bandwidth buffering in network packet processors requiring precise DDR timing and echo-clock–synchronized data capture.

For engineers reviewing the CY7C25702KV18-500BZXC datasheet, CY7C25702KV18-500BZXC pinout, CY7C25702KV18-500BZXC application, or CY7C25702KV18-500BZXC equivalent, key selection criteria include burst depth (2-word), ODT support range (RQ/1.66 or RQ/3.33), QVLD timing alignment with CQ/CQ, HSTL I/O compatibility, and PLL-based data placement accuracy at 500 MHz.

Technical Context

This device implements a synchronous pipelined architecture where all address, control, and data signals are registered on rising edges of complementary clocks K and K. Read operations initiate on K's rising edge, output two sequential 36-bit words on alternating K/K edges, and assert QVLD edge-aligned with CQ/CQ to indicate valid data windows.

The integrated PLL ensures accurate data-eye positioning relative to echo clocks, while ODT configuration (via ODT pin and ZQ resistor) supports impedance matching for DQ[35:0], BWS[3:0], and K/K without external resistors-enabling clean signal integrity in dense memory subsystems operating up to 1000 MT/s.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with CY7C25682KV18-500BZXC, this part offers identical performance in a 36-bit-wide configuration ideal for wide-bus controllers, while AS7C3256A-15JCIN fails to meet DDR timing, ODT, or echo-clock requirements - making it unsuitable for any application demanding deterministic 1000 MT/s operation.

Availability

CY7C25702KV18-500BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and test equipment pattern memory requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C25702KV18-500BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

CY7C25702KV18 belongs to the QDR II+ SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where echo-clock synchronization and on-die termination reduce system-level timing closure effort.

FAQ

What is the function of the DOFF pin on CY7C25702KV18-500BZXC?

The DOFF (Double-Off) pin selects between DDR II+ and DDR I operational modes. When asserted HIGH, the device operates with 2.5-cycle read latency and full DDR II+ feature set including enhanced ODT and echo-clock alignment. When LOW, it reverts to 1-cycle latency and simplified DDR I timing - enabling runtime latency tuning without changing hardware.

How does the ZQ pin interact with the ODT feature?

The ZQ pin connects to an external precision resistor (175–350 Ω) that calibrates internal ODT driver strength. During power-up initialization, the device measures ZQ resistance and configures ODT termination values accordingly - selecting either RQ/1.66 (high range) or RQ/3.33 (low range) based on the ODT pin state. This ensures consistent impedance matching across voltage and temperature variations.

Can CY7C25702KV18-500BZXC be used without connecting the CQ/CQ pins?

No - CQ and CQ are mandatory for reliable data capture. These echo clocks are phase-aligned with internal data launch edges and serve as the timing reference for sampling DQ[35:0]. Disabling or leaving them unconnected violates the DDR II+ interface specification and will cause data capture failures, as the receiver has no deterministic strobe to align with QVLD-qualified data windows.

Is the 165-ball FBGA package of CY7C25702KV18-500BZXC compatible with CY7C25682KV18-500BZXC?

No - although both use 165-ball FBGA packages, their pinouts differ significantly. CY7C25702KV18 dedicates additional balls to DQ[35:18] and BWS[3:2], while CY7C25682KV18 routes those signals to NC/144M and NC/288M locations. Mechanical compatibility does not imply electrical or functional interchangeability; PCB layout and firmware must be redesigned for each part.