Infineon Technologies CY7C25702KV18-550BZXI

Overview

CY7C25702KV18 from Cypress Semiconductor is a 72-Mbit synchronous pipelined DDR II+ SRAM with 2M × 36 organization, 550 MHz clock operation, 2.5-cycle read latency (DOFF = HIGH), and on-die termination (ODT) for DQ/BWS/K/K inputs. It delivers 1100 MT/s data throughput via double-data-rate interface and supports HSTL I/O with VDDQ = 1.4 V to 1.8 V - deployed in high-bandwidth networking packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C25702KV18 datasheet, CY7C25702KV18 pinout, CY7C25702KV18 application, or CY7C25702KV18 equivalent, key selection criteria include burst depth (2-word), echo clock (CQ/CQ) timing alignment, QVLD validity signaling, ODT configuration via ZQ/ODT pins, and FBGA-165 package compatibility with high-speed PCB routing constraints.

Technical Context

This device implements a synchronous pipelined architecture where all address, control, and data transfers are edge-aligned to K (positive) and K (negative) clocks. Read and write operations initiate on K rising edges, while data is registered on both K and K edges - enabling true DDR behavior without external strobes.

The internal 2M × 36 array is split into two 1M × 36 banks, supporting concurrent address latching and burst output. The PLL ensures precise data placement relative to echo clocks CQ/CQ, and QVLD provides cycle-accurate validity indication synchronized to CQ/CQ edges - critical for deterministic capture in multi-SRAM systems.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with AS7C362000B-55BIN and IS61WV204836BLL-15BLI, CY7C25702KV18 uniquely integrates ODT, QVLD, and echo clocks to reduce FPGA resource usage and PCB layer count - delivering measurable BOM and layout cost savings in volume production.

Availability

CY7C25702KV18 is available at Aetrix Electronics and suitable for high-speed network packet buffers, FPGA-based video frame stores, PCIe Gen4 endpoint caches, and radar signal processing buffers requiring stable component supply across extended industrial temperature ranges.

Supply support for CY7C25702KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems, with global R&D centers and ISO 9001-certified manufacturing.

CY7C25702KV18 belongs to the QDR II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory interfacing in networking, telecom infrastructure, and real-time signal processing applications.

FAQ

What is the function of the DOFF pin on CY7C25702KV18?

The DOFF (Double-Off) pin configures read latency mode: when asserted HIGH, the device operates in DDR II+ mode with 2.5-cycle read latency; when LOW or tied to VSS, it reverts to DDR I mode with 1-cycle latency. This pin is sampled at power-up and remains latched until reset - enabling runtime latency tuning without changing clocking or control logic.

How does On-Die Termination (ODT) work with the ZQ pin?

ZQ connects to an external 240 Ω resistor to ground, providing a reference for internal ODT driver calibration. During power-up initialization, the device measures ZQ resistance and configures ODT strength accordingly. ODT is enabled on DQ[35:0], BWS[3:0], and K/K inputs - eliminating need for 32 discrete termination resistors and reducing signal integrity risk on high-speed traces.

Can CY7C25702KV18 be used with a 1.5 V I/O supply?

Yes - VDDQ supports 1.4 V to 1.8 V, explicitly including 1.5 V operation. The HSTL-compatible I/O buffers maintain full timing compliance and drive strength across this range. When using 1.5 V VDDQ, ensure the ZQ resistor remains 240 Ω and that ODT configuration (via ODT pin) matches the target termination impedance for the PCB trace environment.

What is the timing relationship between QVLD and CQ/CQ?

QVLD is edge-aligned to both CQ and CQ outputs - it asserts high one clock cycle before the first valid data word appears on DQ[35:0]. This precise alignment allows FPGA logic to use CQ as the sampling clock and QVLD as a ready flag, removing setup/hold uncertainty and enabling single-register capture without IDELAY tuning.