Infineon Technologies CY7C2642KV18-333BZXC

Overview

CY7C2642KV18-333BZXC from Infineon Technologies (formerly Cypress) is a radiation-hardened 144-Mbit QDR® II+ SRAM with 8M × 18 organization, 250 MHz clock frequency, 2.0-cycle read latency, and on-die termination (ODT). It features separate read/write ports, DDR interfaces on both ports (500 MHz data rate), and RadStop™ technology for space-grade reliability in high-radiation environments such as satellite command/data handling systems.

For engineers reviewing the CY7C2642KV18-333BZXC datasheet, CY7C2642KV18-333BZXC pinout, CY7C2642KV18-333BZXC application, or CY7C2642KV18-333BZXC equivalent, this device supports concurrent read/write transactions, echo clocks (CQ/CQ) for timing margin, QVLD for data validity indication, and JTAG 1149.1 test access - critical for avionics and defense embedded memory subsystems.

Technical Context

This QDR II+ SRAM implements dual independent ports with pipelined synchronous operation: read addresses latched on rising K edge, write addresses on rising K edge, and all data transfers synchronized to both clocks. The architecture eliminates bus turnaround by dedicating Q[17:0] outputs and D[17:0] inputs, enabling true simultaneous access.

It integrates a PLL for precise data placement, supports ODT on D[17:0], BWS[1:0], and K/K inputs, and uses DOFF pin to switch between 2.0-cycle (QDR II+) and 1.0-cycle (QDR I–compatible) read latency modes. Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V, enabling interoperability with 1.5 V and 1.8 V HSTL interfaces.

Key Specifications

Pinout & Package

165-ball Ceramic Column Grid Array (CCGA), 21 × 25 × 2.83 mm, RoHS-compliant, hermetically sealed for space and high-reliability applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed radiation-tolerant SRAM applications.

Compared with CY7C2642KV18-333BZXC, the CY7C2644KV18 variant trades depth for width while retaining identical radiation performance and timing, whereas the IS61WV102418BLL offers lower cost and power but zero radiation assurance - making it unsuitable for space qualification.

Availability

CY7C2642KV18-333BZXC is available at Aetrix Electronics and suitable for spacecraft onboard data handling, satellite telemetry buffering, and avionics flight control systems requiring stable component supply across extended mission lifetimes.

Supply support for CY7C2642KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, including radiation-hardened QDR SRAMs for aerospace and defense markets.

This device belongs to the RadStop™ QDR II+ SRAM product line, engineered specifically for mission-critical spaceborne systems requiring guaranteed operation under total ionizing dose and single-event effects.

FAQ

What is the function of the DOFF pin on CY7C2642KV18-333BZXC?

The DOFF (Double-Off) pin selects read latency mode: when asserted high, it enables 2.0-cycle QDR II+ operation with enhanced timing margin; when low, it reverts to 1.0-cycle QDR I–compatible timing. This pin is sampled synchronously on the K clock and allows runtime adaptation to system timing constraints without changing clock frequency or external logic.

Does CY7C2642KV18-333BZXC support JTAG boundary scan testing?

Yes, it implements IEEE 1149.1 compliant TAP controller with full boundary scan capability, including instruction register, bypass register, and boundary scan register supporting INTEST, EXTEST, and SAMPLE/PRELOAD instructions. All 165 balls are accessible via scan chain for interconnect verification and manufacturing test.

How does on-die termination (ODT) operate on this SRAM?

ODT is enabled by driving the ODT pin high, activating programmable termination resistors (typically 50 Ω) on D[17:0], BWS[1:0], and K/K inputs. Termination values are factory-trimmed and do not require external resistors, reducing PCB layer count and improving signal integrity in high-speed HSTL interfaces up to 500 MT/s.

What is the significance of the "BZXC" suffix in the part number?

The "BZXC" suffix denotes Infineon's standard space-grade marking: "B" = ceramic CCGA package, "Z" = radiation-hardened (RadStop™), "X" = extended temperature range (–55 °C to +125 °C), and "C" = fully screened and qualified per MIL-PRF-38535 Class V requirements - confirming suitability for flight-critical applications.