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Infineon Technologies CY7C2663KV18-450BZI

Part No.:
CY7C2663KV18-450BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C2663KV18-450BZI.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,738

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Product details

Overview

CY7C2663KV18 from Infineon Technologies (formerly Cypress) is a 144-Mbit QDR® II+ SRAM with 8M × 18 organization, 450 MHz maximum clock frequency, 2.5-cycle read latency, and on-die termination (ODT) supporting D[17:0], BWS[1:0], and K/K inputs. It delivers 1100 MT/s effective data rate via DDR interfaces on independent read/write ports and operates at core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4–1.8 V in high-speed networking line cards requiring deterministic low-latency memory access.

For engineers reviewing the CY7C2663KV18 datasheet, CY7C2663KV18 pinout, CY7C2663KV18 application, or CY7C2663KV18 equivalent, this device supports concurrent read/write transactions, four-word burst transfers, echo-clock–assisted data capture, JTAG 1149.1 boundary scan, and depth expansion via RPS/WPS - all critical for FPGA-based packet buffering and switch fabric control planes.

Technical Context

The CY7C2663KV18 implements a true quad data rate II+ architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its dual DDR interfaces operate synchronously to K and K clocks, enabling full-duplex 1100 MT/s throughput while maintaining strict timing alignment via CQ/CQ echo clocks and QVLD data-valid signaling.

Internally, it uses a 2.5-cycle pipelined read latency mode when DOFF is high and reverts to 1-cycle latency (QDR I–compatible) when DOFF is low. The PLL ensures precise data placement, and ODT is programmable via ZQ resistor and ODT pin selection between 175–350 Ω (low range) or 175–250 Ω (high range).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 144 Mbit (8M × 18 organization), enabling compact high-bandwidth buffer storage without external depth expansion.
Max Clock Frequency 450 MHz - sets maximum system timing budget for synchronous interface design and determines worst-case tCK.
Read Latency 2.5 clock cycles - defines minimum time from address latch to first valid Q[x:0] output, critical for pipeline scheduling in switch ASICs.
Data Rate 1100 MT/s (DDR on both ports) - doubles effective bandwidth versus single-data-rate, reducing required clock frequency for same throughput.
VDD / VDDQ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4–1.8 V - supports mixed-voltage board designs and compatibility with 1.5 V or 1.8 V HSTL I/O standards.
On-Die Termination Configurable ODT for D[17:0], BWS[1:0], K/K - eliminates 12+ external 33–50 Ω resistors, saving PCB area and improving signal integrity.
Package 165-ball FBGA (15 × 17 × 1.4 mm) - fine-pitch package optimized for high-density routing in telecom backplanes and switch modules.

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous data input Latched on rising edges of K/K; enables 18-bit parallel write bursts without bus contention.
Q[17:0] Synchronous data output Drives burst-read data aligned to CQ/CQ; tri-stated automatically on RPS deassertion.
RPS / WPS Port select controls Active-low asynchronous port enables - allows independent read/write port activation for depth expansion.
BWS[1:0] Byte write select Independent 9-bit byte masking per write cycle; preserves unselected bytes during partial writes.
K / K Differential clock inputs Rising-edge–triggered clocks for all synchronous operations; K used for read, K for write in standard configuration.
CQ / CQ Echo clock outputs Free-running, phase-aligned copies of K/K - simplify high-speed data capture in FPGA receivers.
QVLD Data validity indicator Edge-aligned with CQ/CQ; signals exact cycle when Q[17:0] contains stable, valid burst data.
ODT ODT range select Logic-level input that selects termination resistance range (low/high) during power-up initialization.
ZQ Impedance calibration reference Analog input tied to external precision resistor (RQ); calibrates output driver and ODT impedance to 0.2 × RQ.

Key Features

Feature Design Value
Separate read/write ports Enables true full-duplex operation - no bus turnaround delay, essential for real-time packet buffering in Layer 2/3 switches.
Four-word burst architecture Reduces address bus toggling by 75% per transaction - lowers EMI and simplifies address generation logic in controller ASICs.
Programmable ODT with ZQ calibration Eliminates need for 16+ discrete termination resistors and associated layout constraints - improves SI margin and reduces BOM cost.
JTAG 1149.1 boundary scan Enables in-system testability of interconnects and solder joints on dense FBGA layouts - critical for high-reliability telecom hardware.
DOFF-selectable latency mode Allows runtime switching between QDR II+ (2.5-cycle) and QDR I (1-cycle) modes - supports legacy compatibility and performance tuning.

Applications

Network Packet Buffering Switch Fabric Control Memory

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet line cards.

IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM serving as dual-port FIFO buffer between MAC and switch fabric ASIC.

Use Value: Concurrent read/write capability eliminates arbitration delays; 2.5-cycle latency ensures sub-6 ns response for priority queue lookups.

Use Scenario: Holding forwarding table entries and queue state in modular chassis-based L2/L3 switches.

IC Role / Device Role / Timing Role: Synchronous pipelined memory providing deterministic access to TCAM-assisted lookup results.

Use Value: Four-word burst reduces address bus activity by 75%, lowering power and routing congestion in multi-chip control plane modules.

FPGA-Based Protocol Acceleration Optical Transport Network (OTN) Framing

Use Scenario: Offloading TCP segmentation/reassembly and TLS record processing in SmartNICs.

IC Role / Device Role / Timing Role: External memory resource tightly coupled to FPGA soft-core processor via AXI4-Stream interface.

Use Value: Echo clocks (CQ/CQ) and QVLD enable reliable source-synchronous capture at 1100 MT/s - avoiding complex deskew logic.

Use Scenario: Storing OTU frame overhead, FEC parity bytes, and payload pointers in DWDM line systems.

IC Role / Device Role / Timing Role: Burst-access SRAM synchronized to OTN frame clock for deterministic jitter-tolerant buffering.

Use Value: On-die termination matched to 50 Ω backplane traces ensures clean 450 MHz clock eye diagrams across 30 cm FR4 runs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C2665KV18 Same QDR II+ architecture, 4M × 36 organization, identical 450 MHz/2.5-cycle spec, but wider data bus and different pinout. Used where 36-bit data path matches bus width (e.g., 32-bit + ECC), reducing chip count vs. ×18 stacking. Select when system data bus width is ≥32 bits and board layout favors fewer devices over narrower footprint.
AS7C33256PFS-15BIN 32-Mbit ×16 async SRAM, no DDR/QDR, 15 ns access, no ODT, no echo clocks, no JTAG. Applicable only in non-real-time, lower-bandwidth control-plane storage where latency >10 ns is acceptable. Choose only for cost-sensitive, low-frequency applications where QDR features are unnecessary and timing margins are generous.

Compared with CY7C2665KV18, the CY7C2663KV18 offers higher density per bit width but requires two devices for 32-bit+ buses; compared with AS7C33256PFS-15BIN, it delivers 73× higher effective bandwidth and deterministic sub-6 ns latency at the cost of tighter layout and power delivery requirements.

Availability

CY7C2663KV18 is available at Aetrix Electronics and suitable for network packet buffering, switch fabric control memory, FPGA-based protocol acceleration, and optical transport network framing requiring stable component supply across extended product lifecycles.

Supply support for CY7C2663KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and support for the former Cypress QDR SRAM portfolio.

This device belongs to Infineon's high-performance QDR II+ SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in carrier-grade networking and telecom infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C2663KV18?

The DOFF (Data-Off) pin configures the device's read latency mode: when asserted high, it enables QDR II+ operation with 2.5-cycle read latency; when low, it reverts to QDR I–compatible 1-cycle latency. This pin is sampled at power-up and remains latched until reset, allowing system-level optimization between bandwidth and latency.

How does on-die termination (ODT) work on CY7C2663KV18?

ODT is enabled via the ODT pin and calibrated using an external resistor on the ZQ pin. A low ODT level selects RQ/3.33 termination (175–350 Ω range); high selects RQ/1.66 (175–250 Ω). This tunes output driver and input termination impedance to match PCB trace impedance, eliminating discrete resistors and improving signal integrity at 450 MHz.

Can CY7C2663KV18 be used with a 1.5 V VDDQ supply?

Yes - the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V. At 1.5 V, it meets all AC/DC specifications per the datasheet, and HSTL-compatible I/O buffers operate correctly. System designers must ensure stable 1.5 V regulation and verify timing margins under worst-case voltage/temperature conditions.

What is the role of CQ and CQ echo clocks?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They provide source-synchronous timing references for capturing Q[17:0] output data in receiving logic (e.g., FPGA IOBs), eliminating setup/hold uncertainty caused by clock skew and PCB trace mismatch in high-speed designs.

CY7C2663KV18-450BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
144Mbit
Memory Organization:
8M x 18
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C2663KV18-450BZI FAQ

1.How can I place an order for CY7C2663KV18-450BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C2663KV18-450BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C2663KV18-450BZI reliable?

The price and inventory of CY7C2663KV18-450BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2663KV18-450BZI is usually 5 days.

3.What payment methods are accepted for CY7C2663KV18-450BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C2663KV18-450BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C2663KV18-450BZI?

CY7C2663KV18-450BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C2663KV18-450BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C2663KV18-450BZI?

For technical support, including CY7C2663KV18-450BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2663KV18-450BZI requirements.

6.How does Aetrix verify that CY7C2663KV18-450BZI is sourced from the original manufacturer or authorized distributors?

All CY7C2663KV18-450BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2663KV18-450BZI meets industry standards.

7.What is the process for return or replacement of CY7C2663KV18-450BZI?

All CY7C2663KV18-450BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2663KV18-450BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C2663KV18-450BZI part is unused and in its original packaging.

Return procedure for CY7C2663KV18-450BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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