Infineon Technologies CY7C2665KV18-450BZXI
- Part No.:
- CY7C2665KV18-450BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C2665KV18-450BZXI.pdf
- Description:
- IC SRAM 144MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,691
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C2665KV18-450BZXI from Infineon Technologies (formerly Cypress) is a 4M × 36, 144-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and on-die termination (ODT). It operates at 450 MHz (1100 MT/s DDR), supports 1.8 V core and 1.4–1.8 V I/O supply, and delivers concurrent read/write throughput for high-speed packet buffering in network switches.
For engineers reviewing the CY7C2665KV18-450BZXI datasheet, CY7C2665KV18-450BZXI pinout, CY7C2665KV18-450BZXI application, or CY7C2665KV18-450BZXI equivalent, key selection criteria include its 165-ball FBGA package, HSTL I/O compatibility, echo clock (CQ/CQ) timing support, and DOFF-configurable latency mode between QDR II+ (2.5-cycle) and QDR I (1-cycle) operation.
Technical Context
This device implements true quad data rate architecture with physically separate read and write ports, enabling fully independent, concurrent transactions without bus turnaround. Its dual DDR interfaces-driven by complementary K/K clocks-achieve 1100 MT/s effective data rate while maintaining synchronous, pipelined access to a 4M × 36 memory array organized as four 1M × 36 sub-arrays.
The integrated PLL ensures precise data placement relative to echo clocks (CQ/CQ), and ODT is supported on D[35:0], BWS[3:0], and K/K inputs with programmable impedance range via the ZQ pin and ODT pin. The QVLD signal provides edge-aligned valid-data indication synchronized to CQ/CQ, critical for reliable high-speed capture in FPGA-based systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 144 Mbit (4M × 36 configuration) |
| Max Clock Frequency | 450 MHz - sets maximum DDR data transfer rate at 1100 MT/s |
| Read Latency | 2.5 cycles (DOFF = high) - enables QDR II+ burst timing; configurable to 1 cycle (DOFF = low) |
| Core Supply | 1.8 V ± 0.1 V - defines minimum power rail stability requirement for internal logic |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with both 1.5 V and 1.8 V HSTL systems |
| On-Die Termination | Supported on D[35:0], BWS[3:0], K/K - eliminates need for external 50 Ω resistors on data/control lines |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-density routing in telecom PCBs |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant Pb-free construction (BZXI suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous data input | 36-bit wide write data bus sampled on rising edges of K/K; supports byte-selectable writes via BWS[3:0] |
| Q[35:0] | Synchronous data output | 36-bit wide read data bus driven on rising edges of K/K; tri-stated when RPS is deasserted |
| RPS / WPS | Port select control | Active-low signals enabling independent read/write port activation; enables depth expansion with multiple devices |
| BWS[3:0] | Byte write select | Four independent active-low signals controlling 9-bit byte lanes (D[8:0] through D[35:27]) during write bursts |
| K / K | Differential clock inputs | Complementary clocks driving all synchronous operations; rising edges latch address/data and trigger outputs |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of K/K used for source-synchronous data capture in receiving logic |
| QVLD | Valid data indicator | Output pulse edge-aligned with CQ/CQ, signaling when Q[35:0] contains stable, valid read data |
| ODT | ODT range select | Configures on-die termination resistance: low range (RQ/3.33) or high range (RQ/1.66); floating defaults to high range |
| ZQ | Impedance calibration reference | Connects to external precision resistor (175–350 Ω) to calibrate output driver and ODT impedance to system bus |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables full concurrency-no bus turnaround required, eliminating timing bottlenecks in bidirectional traffic flows |
| Four-word burst architecture | Reduces address bus frequency by 4× versus single-word access, lowering routing complexity and skew sensitivity |
| Programmable latency mode (DOFF) | Allows runtime selection between QDR II+ (2.5-cycle, higher bandwidth) and QDR I (1-cycle, lower latency) behavior |
| HSTL-compatible I/O | Meets JEDEC HSTL Class I specifications for inputs and variable-drive outputs, ensuring signal integrity at 450 MHz |
| JTAG 1149.1 test access port | Supports boundary scan testing and in-system programming without requiring additional debug hardware |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Dedicated QDR II+ SRAM serving as ingress/egress packet buffer with simultaneous read (forwarding engine) and write (ingress parser) access. Use Value: 450 MHz clock + 2.5-cycle latency delivers 1100 MT/s throughput and deterministic 2.5 ns read response, meeting IEEE 802.3ae jitter requirements. |
Use Scenario: Capturing multi-gigasample waveforms in automated test equipment (ATE) with real-time pattern generation and analysis. IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to FPGA-based pattern generators and comparators. Use Value: Echo clocks (CQ/CQ) and QVLD enable reliable source-synchronous sampling at 1100 MT/s, reducing setup/hold margin overhead by >150 ps. |
| Telecom Baseband Processing | FPGA-Based Protocol Acceleration |
|
Use Scenario: Supporting LTE/5G baseband processing in remote radio units (RRUs), where uplink/downlink data paths require parallel access to shared channel buffers. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared memory between digital front-end (DFE) and physical layer (PHY) processing blocks. Use Value: Independent RPS/WPS controls allow time-multiplexed access scheduling across two clock domains, preserving coherency without arbitration logic. |
Use Scenario: Offloading TCP/IP, TLS, or video encoding tasks from host CPU using FPGA-accelerated engines with local high-speed memory. IC Role / Device Role / Timing Role: Local scratchpad memory tightly coupled to FPGA fabric, accessed via AXI-QDR bridge IP. Use Value: On-die termination (ODT) on all data and control pins eliminates 72 external 50 Ω resistors, saving >12 mm² PCB area and simplifying layout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-15JCIN | Asynchronous 32K × 8 SRAM; no DDR, no ODT, no echo clocks; 15 ns access time | Limited to low-frequency control-plane buffering; cannot support 1100 MT/s packet flow | Select only for cost-sensitive, non-concurrent, sub-100 MHz applications where timing predictability outweighs bandwidth |
| IS61WV102416BLL-10TLI | Synchronous 1M × 16, 10 ns cycle time, LVCMOS I/O, no burst or ODT | Single-port, half-width interface; requires external logic for concurrent access emulation | Use only in legacy designs constrained by pin count or where QDR architecture is not required |
Compared with AS7C3256A-15JCIN and IS61WV102416BLL-10TLI, CY7C2665KV18-450BZXI uniquely delivers true concurrent read/write at 1100 MT/s with built-in timing aids (CQ/QVLD) and signal integrity features (ODT, HSTL), making it irreplaceable in modern high-speed packet infrastructure.
Availability
CY7C2665KV18-450BZXI is available at Aetrix Electronics and suitable for network switching, telecom baseband processing, and high-speed test equipment requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.
Supply support for CY7C2665KV18-450BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for automotive, industrial, and communications markets.
CY7C2665KV18-450BZXI belongs to Infineon's QDR® II+ SRAM product line, engineered specifically for deterministic, high-throughput memory access in networking and telecom infrastructure where concurrent read/write bandwidth and timing precision are mission-critical.
FAQ
What is the function of the DOFF pin on CY7C2665KV18-450BZXI?
The DOFF (Data-Off) pin configures the device's read latency mode. When asserted high, it enables QDR II+ operation with 2.5-cycle read latency and four-word burst transfers. When low, it reverts to QDR I behavior with 1-cycle latency. This pin is sampled at power-up and remains latched during operation, allowing system-level optimization between bandwidth and latency.
How does the ZQ pin interact with the ODT feature?
The ZQ pin connects to an external precision resistor (typically 240 Ω) that calibrates the device's output driver strength and on-die termination impedance. During power-up initialization, the device measures this resistor and scales internal termination values to 0.2 × RQ for Q[35:0], CQ/CQ, and selected inputs. ODT pin state then selects whether calibrated impedance is applied at RQ/3.33 (low range) or RQ/1.66 (high range).
Can CY7C2665KV18-450BZXI operate with only one clock input (K) instead of K/K differential pair?
No. The device requires both K and K inputs for proper DDR timing and internal clock domain synchronization. K drives the write port and read port address latching, while K controls write data capture and read data output timing. Using only K violates AC timing specifications and disables echo clock generation, rendering CQ/CQ and QVLD unusable for source-synchronous capture.
What is the role of the RPS and WPS pins in depth expansion configurations?
RPS (Read Port Select) and WPS (Write Port Select) are active-low signals that independently enable or disable each port. In depth expansion, multiple CY7C2665KV18-450BZXI devices share the same address and data buses; RPS/WPS are decoded externally to select which device responds to a given read or write transaction, allowing seamless memory size scaling without address demultiplexing logic.
CY7C2665KV18-450BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 144Mbit
- Memory Organization:
- 4M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C2665KV18-450BZXI FAQ
1.How can I place an order for CY7C2665KV18-450BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C2665KV18-450BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C2665KV18-450BZXI reliable?
The price and inventory of CY7C2665KV18-450BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2665KV18-450BZXI is usually 5 days.
3.What payment methods are accepted for CY7C2665KV18-450BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C2665KV18-450BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C2665KV18-450BZXI?
CY7C2665KV18-450BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C2665KV18-450BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C2665KV18-450BZXI?
For technical support, including CY7C2665KV18-450BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2665KV18-450BZXI requirements.
6.How does Aetrix verify that CY7C2665KV18-450BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C2665KV18-450BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2665KV18-450BZXI meets industry standards.
7.What is the process for return or replacement of CY7C2665KV18-450BZXI?
All CY7C2665KV18-450BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2665KV18-450BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C2665KV18-450BZXI part is unused and in its original packaging.
Return procedure for CY7C2665KV18-450BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C2665KV18-450BZXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

