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Infineon Technologies CY7C2665KV18-550BZI

Part No.:
CY7C2665KV18-550BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C2665KV18-550BZI.pdf
Description:
IC SRAM 144MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,393

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Product details

Overview

CY7C2665KV18 from Infineon Technologies (formerly Cypress) is a 4M × 36, 144-Mbit QDR® II+ SRAM with quad data rate architecture, 2.5-cycle read latency, and on-die termination (ODT). It operates at 550 MHz with DDR interfaces on both read and write ports (1100 MT/s), supports separate read/write ports for concurrent transactions, and uses 1.8 V core / 1.4–1.8 V I/O supply - deployed in high-bandwidth networking line cards and packet buffer subsystems.

For engineers reviewing the CY7C2665KV18 datasheet, CY7C2665KV18 pinout, CY7C2665KV18 application, or CY7C2665KV18 equivalent, key selection criteria include its 2.5-cycle latency mode, ODT support for D[35:0]/BWS[3:0]/K/K inputs, echo clock (CQ/CQ) timing alignment, and FBGA-165 package compatibility with high-speed PCB routing constraints.

Technical Context

The CY7C2665KV18 implements a synchronous pipelined SRAM architecture with independent read and write ports sharing a multiplexed 20-bit address bus. Read and write operations are latched on alternating rising edges of complementary K/K clocks, enabling true concurrency without bus turnaround.

It integrates a PLL for precise data placement, echo clocks (CQ/CQ) synchronized to K/K for simplified high-speed capture, and programmable ODT with two impedance ranges selected via the ODT pin. The device delivers full data coherency and supports depth expansion using RPS/WPS controls.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 144 Mbit (4M × 36 configuration)
Max Clock Frequency 550 MHz - enables 1100 MT/s DDR throughput per port
Read Latency 2.5 cycles - reduces pipeline stalls in burst-intensive traffic buffering
VDD / VDDQ Core: 1.8 V ± 0.1 V; I/O: 1.4–1.8 V - supports mixed-voltage system integration
ODT Support Configurable termination for D[35:0], BWS[3:0], K/K - eliminates external resistors and saves board area
Package 165-ball FBGA (15 × 17 × 1.4 mm) - optimized for signal integrity at >500 MHz
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - ensures timing margin compliance in backplane designs

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 15 mm × 17 mm × 1.4 mm, RoHS-compliant, with 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Data input bus 36-bit synchronous write data, sampled on rising edges of K/K - supports four-word burst writes
Q[35:0] Data output bus 36-bit synchronous read data, edge-aligned with CQ/CQ - enables deterministic capture in FPGA-based systems
RPS / WPS Port select controls Active-low signals enabling independent read/write port activation - essential for depth expansion and port arbitration
BWS[3:0] Byte write select Four independent active-low byte masks - allows partial-word updates without read-modify-write overhead
K / K Differential clock inputs Complementary clocks driving all synchronous logic - rising edges latch addresses, data, and controls
CQ / CQ Echo clock outputs Free-running clocks phase-aligned to K/K - used by receivers to sample Q[35:0] with minimal skew
QVLD Valid data indicator Asserted synchronously with first valid Q[35:0] word - eliminates need for fixed delay-based data capture logic
ODT On-die termination control Selects ODT range (175–350 Ω or 175–250 Ω) during power-up - sets termination strength for signal integrity tuning
ZQ Impedance calibration reference Connects to external precision resistor (RQ) - calibrates output driver and ODT impedance to match trace Z₀

Key Features

Feature Design Value
Separate read/write ports Enables simultaneous access - eliminates bus contention in full-duplex packet buffering applications
Four-word burst architecture Reduces effective address bus frequency by 4× - lowers routing complexity and timing closure effort
Programmable ODT Eliminates 72 external termination resistors (for D[35:0] + BWS[3:0] + K/K) - cuts BOM cost and PCB area
PLL-assisted data placement Minimizes setup/hold violations at 550 MHz - improves timing margin for FPGA-to-SRAM interfaces
JTAG 1149.1 test access port Enables boundary scan testing and in-system debug - supports production test coverage and field diagnostics

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with zero-latency read-after-write requirements.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking packet buffer - reads ingress traffic while writing egress traffic concurrently.

Use Value: 2.5-cycle read latency and separate ports deliver deterministic 1100 MT/s bandwidth - meets 100 GbE line-rate buffering needs without pipeline bubbles.

Use Scenario: Capturing high-fidelity waveform samples from multi-GHz ADCs in automated test equipment (ATE) front-ends.

IC Role / Device Role / Timing Role: High-throughput memory buffer interfacing directly with FPGA fabric - absorbing bursts at 1.1 Gwords/s with precise timing alignment.

Use Value: Echo clocks (CQ/CQ) and QVLD enable cycle-accurate data capture - eliminates need for complex deskew circuitry in sampling engines.

Telecom Baseband Processing Real-Time Video Frame Buffering

Use Scenario: Temporary storage of OFDM symbol data between FFT/IFFT stages in 5G NR baseband units.

IC Role / Device Role / Timing Role: Low-latency, coherent memory for symbol-level pipeline handoff - maintaining strict phase alignment across parallel processing paths.

Use Value: Full data coherency and synchronous self-timed writes ensure symbol integrity - prevents inter-symbol interference in real-time PHY layers.

Use Scenario: Frame buffering in broadcast-grade video encoders handling 4K60 YUV422 streams with sub-frame latency constraints.

IC Role / Device Role / Timing Role: Dual-port memory supporting simultaneous read (encoder fetch) and write (sensor ingest) at 1.1 Gwords/s.

Use Value: 1.4–1.8 V I/O flexibility allows direct interface to 1.5 V or 1.8 V video processor I/O banks - avoids level-shifter components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 100 MHz max frequency, 3.3 V core/I/O, no ODT, PLCC-168 package Limited to legacy telecom systems requiring lower bandwidth and higher voltage tolerance Choose only when backward compatibility with 3.3 V designs and long-lifecycle availability outweigh bandwidth needs.
AS7C33256PFS-15BIN Single-port, 15 ns async access, 3.3 V, 256 Mbit density, TSOP-II package Suitable for non-concurrent, latency-tolerant control-plane memory - not viable for real-time data-path buffering Select only for cost-sensitive, low-speed management subsystems where dual-port concurrency is unnecessary.

Compared with IDT72T36120L10BG and AS7C33256PFS-15BIN, CY7C2665KV18 uniquely delivers 550 MHz DDR performance with ODT and echo clocks - making it irreplaceable in new 100 GbE and 5G infrastructure designs requiring deterministic sub-2-cycle latency and signal integrity at scale.

Availability

CY7C2665KV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom baseband processing, and real-time video frame buffering requiring stable component supply across multi-year production programs.

Supply support for CY7C2665KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full QDR® II+ SRAM portfolio, including reliability validation, long-term supply commitment, and technical documentation continuity.

CY7C2665KV18 belongs to Infineon's high-performance memory product line, engineered specifically for deterministic, low-latency data-path buffering in carrier-grade networking and wireless infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C2665KV18?

The DOFF (Data Output Format) pin selects the read latency mode: when asserted high, the device operates in QDR II+ mode with 2.5-cycle read latency; when low, it reverts to QDR I mode with 1-cycle latency. This pin is sampled at power-up and determines internal pipeline configuration - no runtime switching is supported.

How does the ZQ pin calibrate output impedance?

The ZQ pin connects to an external precision resistor (RQ) tied to ground. During power-up initialization, the device measures RQ and scales internal driver and ODT impedances to 0.2 × RQ. Supported RQ range is 175–350 Ω for low-range ODT or 175–250 Ω for high-range ODT, depending on the ODT pin state.

Can CY7C2665KV18 operate with only one clock (K) instead of K/K differential pair?

No. The device requires both K and K clocks for proper DDR operation: K captures write data and addresses, while K captures read data and controls. Both clocks must be present and properly phased - single-ended clocking violates AC timing specifications and causes functional failure per datasheet Section 7.1.

Is JTAG boundary scan supported during normal memory operation?

Yes. The IEEE 1149.1 TAP controller operates independently of memory functions. Boundary scan tests can be executed while the SRAM performs active read/write operations, provided TMS/TCK/TDI/TDO pins are not otherwise driven by system logic - verified in Cypress Application Note AN91174.

CY7C2665KV18-550BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
144Mbit
Memory Organization:
4M x 36
Memory Interface:
Parallel
Clock Frequency:
550 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C2665KV18-550BZI FAQ

1.How can I place an order for CY7C2665KV18-550BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C2665KV18-550BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C2665KV18-550BZI reliable?

The price and inventory of CY7C2665KV18-550BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C2665KV18-550BZI is usually 5 days.

3.What payment methods are accepted for CY7C2665KV18-550BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C2665KV18-550BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C2665KV18-550BZI?

CY7C2665KV18-550BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C2665KV18-550BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C2665KV18-550BZI?

For technical support, including CY7C2665KV18-550BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C2665KV18-550BZI requirements.

6.How does Aetrix verify that CY7C2665KV18-550BZI is sourced from the original manufacturer or authorized distributors?

All CY7C2665KV18-550BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C2665KV18-550BZI meets industry standards.

7.What is the process for return or replacement of CY7C2665KV18-550BZI?

All CY7C2665KV18-550BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C2665KV18-550BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C2665KV18-550BZI part is unused and in its original packaging.

Return procedure for CY7C2665KV18-550BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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