Infineon Technologies CY7C4022KV13-106FCXC

Overview

CY7C4022KV13-106FCXC from Cypress Semiconductor is a 72-Mbit QDR™-IV XP SRAM configured as 4M × 18, operating at 1066 MHz with 8.0-cycle read latency and 5.0-cycle write latency. It features dual independent DDR data ports (A/B), 8-bank architecture enabling one access per bank per cycle, and on-chip ECC for soft error correction in high-reliability networking and packet buffering applications.

For engineers reviewing the CY7C4022KV13-106FCXC datasheet, CY7C4022KV13-106FCXC pinout, CY7C4022KV13-106FCXC application, or CY7C4022KV13-106FCXC equivalent, key selection criteria include concurrent read/write throughput (2132 MT/s), HSTL/SSTL/POD I/O compatibility, JTAG 1149.1 test access, and 361-ball FCBGA package integration with per-bit deskew training and address parity protection.

Technical Context

This QDR-IV XP SRAM uses differential clocking (CK/CK#) to latch port A addresses on the rising edge and port B addresses on the falling edge, enabling time-multiplexed dual-port control via a single address bus. Its 8-bank architecture supports full concurrency-each bank can be accessed once per clock cycle-maximizing random transaction rate under burst-heavy workloads.

The device implements three independent differential clock domains: CK/CK# for address/command, DKA/DKB pairs for data input timing, and QKA/QKB pairs for data output timing. It supports programmable on-die termination (ODT) on clock, address/command, and data lines, and includes ZQ-based impedance calibration for signal integrity across HSTL (1.2 V/1.25 V), SSTL (1.2 V/1.25 V), and POD (1.1 V/1.2 V) signaling standards.

Key Specifications

Pinout & Package

Package: 361-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA), 21 mm × 21 mm, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance QDR SRAM applications.

Compared with IDT72T36120L10BG and AS7C34098B-106JCIN, CY7C4022KV13-106FCXC delivers superior system-level reliability through integrated ECC, ZQ calibration, and JTAG testability-reducing board-level component count and validation effort in mission-critical infrastructure.

Availability

CY7C4022KV13-106FCXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and telecom baseband processing requiring stable component supply and long-term lifecycle support.

Supply support for CY7C4022KV13-106FCXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding communications and industrial applications.

CY7C4022KV13 belongs to the QDR™-IV XP SRAM product line, engineered specifically for ultra-low-latency, high-throughput memory subsystems in networking ASICs, 5G infrastructure, and real-time signal processing systems.

FAQ

What is the purpose of the ZQ/ZT pin?

The ZQ/ZT pin connects to a 240 Ω ±1% external precision resistor and enables internal calibration of output driver impedance. This ensures consistent signal integrity across process, voltage, and temperature variations by dynamically adjusting ODT and output drive strength to match the system's data bus characteristic impedance.

How does address parity protection operate in CY7C4022KV13-106FCXC?

Address parity (AP) provides even parity over A[21:0]. When a parity mismatch occurs during address sampling, the PE# pin asserts low and remains latched until cleared by writing the Configuration Register's PARITY_CLEAR bit. This allows system firmware to detect and log address corruption events before memory access proceeds.

Can CY7C4022KV13-106FCXC operate with both HSTL and POD signaling simultaneously?

No. VDDQ must be set to a single voltage: 1.1 V ±50 mV for POD, or 1.2 V/1.25 V ±50 mV for HSTL/SSTL. The I/O standard is selected at power-up based on VDDQ level and corresponding ODT configuration-mixed-mode operation is not supported.

What is the function of the QVLDA[1:0] and QVLDB[1:0] pins?

QVLDA[1:0] and QVLDB[1:0] are per-sub-bus output valid indicators aligned to QKA/QKB edges. Each bit signals valid data for its associated 9-bit or 18-bit DQA/DQB segment, enabling source-synchronous capture in FPGA receivers without global strobes-critical for skew-tolerant high-speed interface design.