Infineon Technologies CY7C4022KV13-933FCXI

Overview

CY7C4022KV13-933FCXI from Cypress Semiconductor is a 72-Mbit QDR™-IV XP SRAM configured as 4M × 18, operating at 933 MHz with 8.0-cycle read latency and 5.0-cycle write latency. It features dual independent DDR data ports (A/B), 8-bank architecture enabling one access per bank per cycle, and on-chip ECC for soft error correction in high-reliability networking buffers.

For engineers reviewing the CY7C4022KV13-933FCXI datasheet, CY7C4022KV13-933FCXI pinout, CY7C4022KV13-933FCXI application, or CY7C4022KV13-933FCXI equivalent, key selection criteria include concurrent port timing, DDR address/command clocking with CK/CK#, HSTL/SSTL/POD I/O compatibility, and JTAG 1149.1 test access for production validation.

Technical Context

This SRAM implements QDR-IV Xtreme Performance architecture with separate differential clocks for address/command (CK/CK#), data input (DKA/DKB pairs), and data output (QKA/QKB pairs). Port A uses rising-edge sampling on CK; Port B uses falling-edge sampling - enabling true concurrent bidirectional transactions without arbitration overhead.

The device integrates programmable on-die termination (ODT) for CK, address/command, and DQ lines; per-bit deskew training via LBK pins; and bus inversion (AINV/DINVA/DINVB) to reduce simultaneous switching noise. Core voltage is fixed at 1.3 V ± 40 mV; I/O voltage supports 1.1 V (POD), 1.2 V (HSTL/SSTL), or 1.25 V (SSTL) options.

Key Specifications

Pinout & Package

Package: 361-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA), 21 mm × 21 mm, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36120L10BG and IS61WV102418BLL-100BLI, CY7C4022KV13-933FCXI delivers 2.9× higher random transaction rate, integrated SER mitigation, and deterministic dual-port timing - making it the sole option for next-generation packet processing where latency, reliability, and bandwidth co-constrain design.

Availability

CY7C4022KV13-933FCXI is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, radar signal processing FIFOs, and avionics data concentrator caches requiring stable component supply across extended product lifecycles.

Supply support for CY7C4022KV13-933FCXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications infrastructure markets.

CY7C4022KV13 belongs to the QDR-IV XP SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory subsystems in packet-switched networks and real-time signal processing systems.

FAQ

What is the difference between CY7C4022KV13-933FCXI and CY7C4022KV13-1066FCXI?

The -933FCXI variant operates at 933 MHz maximum frequency with 8.0-cycle read latency, while the -1066FCXI runs at 1066 MHz with identical latency. The -933 version targets systems where thermal or power constraints prevent full-speed operation, offering lower IDD and relaxed cooling requirements without sacrificing QDR-IV XP architecture features like dual-port concurrency or on-chip ECC.

Does CY7C4022KV13-933FCXI support both HSTL and SSTL signaling on the same VDDQ rail?

Yes - the device supports JESD8-16A-compliant HSTL Class I (1.2 V ± 50 mV) and SSTL_12 (1.25 V ± 50 mV) on the same VDDQ supply. Selection is controlled by configuration register bits; no hardware change is needed. This allows interoperability with both FPGA families using HSTL (e.g., Xilinx Ultrascale+) and ASICs using SSTL (e.g., Broadcom StrataDNX).

How is on-die termination (ODT) configured for address versus data lines?

ODT is independently programmable per signal group via configuration registers: separate settings exist for CK/CK#, address/command inputs (A[x], AP, LDA#, RWB#), and DQ/DK/QK buses. Each group can be enabled/disabled and set to 34 Ω, 40 Ω, 48 Ω, or 60 Ω - allowing precise impedance matching to different trace topologies on the same PCB.

Can the address parity feature be disabled if not used in the system?

No - AP input and PE# output are always active; however, the parity check can be bypassed by tying AP to a fixed logic level (e.g., VDD or VSS) and ignoring PE#. The internal parity generator remains powered but produces predictable outputs, avoiding fault injection while eliminating external parity logic.