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Infineon Technologies CY7C4041KV13-667FCXC

Part No.:
CY7C4041KV13-667FCXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
361-BBGA, FCBGA
Datasheet:
AetrixCY7C4041KV13-667FCXC.pdf
Description:
IC SRAM 72MBIT PAR 361FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,430

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Product details

Overview

CY7C4041KV13-667FCXC from Cypress Semiconductor is a 72-Mbit QDR™-IV HP SRAM configured as 2M × 36, operating at 667 MHz with 5.0-cycle read latency and 3.0-cycle write latency, supporting concurrent dual-port DDR transactions for high-throughput packet buffering in network line cards.

For engineers reviewing the CY7C4041KV13-667FCXC datasheet, CY7C4041KV13-667FCXC pinout, CY7C4041KV13-667FCXC application, or CY7C4041KV13-667FCXC equivalent, key selection criteria include its 1334 MT/s random transaction rate, on-die termination programmability, per-bit deskew training, ECC-enabled soft error resilience (<0.01 FITs/Mb), and 361-ball FCBGA package compatibility with high-speed SerDes subsystems.

Technical Context

The device implements two independent bi-directional DDR data ports (A and B) sharing a single DDR address/command bus clocked by differential CK/CK#, enabling fully concurrent read/write operations without arbitration delay. Address sampling is split across CK edges: rising edge for port A, falling edge for port B.

It integrates JESD8-26-compliant JTAG 1149.1 test access, on-chip ECC for single-bit error correction, programmable bus inversion, address parity protection, and ZQ-based output impedance calibration - all optimized for deterministic low-latency memory access in telecom and datacom infrastructure.

Key Specifications

ParameterValue and Actual Design Meaning
Density72 Mbit (2M × 36 configuration)
Max Frequency667 MHz - enables 1334 MT/s random transaction rate
Read Latency5.0 clock cycles - fixed timing for predictable pipeline scheduling
Write Latency3.0 clock cycles - minimal delay for write-back or streaming use cases
I/O VoltageVDDQ = 1.2 V ± 50 mV (HSTL/SSTL) or 1.1 V ± 50 mV (POD)
Core VoltageVDD = 1.3 V ± 40 mV - tightly regulated supply for stable high-speed operation
Soft Error Rate<0.01 FITs/Mb - four-order improvement over prior SRAM generations via on-chip ECC

Pinout & Package

Package: 361-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA), 21 mm × 21 mm, RoHS-compliant, with 0.8 mm ball pitch and thermal pad center.

Pin/TerminalCircuit RoleDesign Meaning
CK, CK#Differential address/command clock inputRising edge latches port A control/address; falling edge latches port B
DKA[1:0], DKA#[1:0], DKB[1:0], DKB#[1:0]Differential data input clocksFour dedicated DDR clock pairs - two per port - for precise DQ capture timing
QKA[1:0], QKA#[1:0], QKB[1:0], QKB#[1:0]Differential data output clocksFour dedicated DDR clock pairs - two per port - for edge-aligned DQ output
DQA[35:0], DQB[35:0]Bidirectional DDR data bus36-bit wide per port; supports two-word burst on every access
LDA#, LDB#Synchronous load enableActive-low command gating per port - decouples command flow from data timing
RWA#, RWB#Synchronous read/write selectPaired with LDx# to define R/W operation per port on each CK edge
ZQOutput impedance calibration referenceEnables dynamic ODT tuning to match system trace impedance (e.g., 40 Ω or 50 Ω)
AP, PE#Address parity input / error flagEven parity coverage over A[20:0]; PE# asserts low on mismatch and holds until cleared

Key Features

FeatureDesign Value
Dual independent DDR data portsEnables simultaneous read from port A and write to port B with zero arbitration overhead
Programmable on-die termination (ODT)Configurable termination for CK, address/command, and DQ lines - eliminates external resistors and improves signal integrity
Per-bit deskew training sequenceAutomated calibration of DQ-to-clock alignment per bit - ensures setup/hold compliance across temperature/voltage corners
On-chip ECCSingle-bit error detection and correction - reduces SER to <0.01 FITs/Mb for cosmic-ray immunity in telecom chassis
JTAG 1149.1 boundary scanFull IEEE-compliant test access - supports production testing, debug, and configuration register programming

Applications

High-Speed Packet BufferingNetwork Processor Interface

Use Scenario: Line-rate buffering of 100G Ethernet frames in switch fabric ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with sub-5ns read latency and concurrent access.

Use Value: Eliminates external arbitration logic and sustains 1334 MT/s random access under real-world traffic patterns.

Use Scenario: Shared memory between multi-core network processors and traffic managers.

IC Role / Device Role / Timing Role: Low-latency, deterministic memory resource accessed by parallel CPU clusters via separate ports.

Use Value: Enables lock-free inter-core communication with guaranteed 3-cycle write commit and 5-cycle read response.

Telecom Baseband ProcessingRadar Signal Processing

Use Scenario: Real-time symbol-level buffering in 5G massive MIMO baseband units.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory for FFT/IFFT pipelines with burst-aligned data flow.

Use Value: Two-word burst mode matches 5G NR slot structure; ECC prevents bit flips in radiation-prone outdoor cabinets.

Use Scenario: Pulse-Doppler processing buffer in airborne AESA radar systems.

IC Role / Device Role / Timing Role: Deterministic latency memory for time-critical range-Doppler map generation.

Use Value: Fixed 5-cycle read latency enables cycle-accurate scheduling; ZQ calibration maintains signal fidelity at extended temperature ranges.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T36150L10BGLower max frequency (500 MHz); no on-chip ECC; uses SSTL-15 I/OLacks SER hardening and per-bit deskew - unsuitable for radiation-sensitive telecom deploymentsSelect only for cost-sensitive, non-ECC-requiring legacy designs with ≤500 MHz clocking
AS7C36256PFS-100BINAsynchronous interface; 100 MHz max; no DDR ports or training capabilityDesigned for simple microcontroller co-processor memory - not for concurrent high-speed packet bufferingUse only in low-bandwidth embedded control applications where deterministic latency is not required

Compared with IDT72T36150L10BG and AS7C36256PFS-100BIN, CY7C4041KV13-667FCXC delivers 33% higher transaction throughput, hardware ECC for field reliability, and automated deskew - making it uniquely suited for carrier-grade infrastructure where latency predictability and soft-error immunity are mandatory.

Availability

CY7C4041KV13-667FCXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, telecom baseband processing, and radar signal processing requiring stable component supply across long-lifecycle deployments.

Supply support for CY7C4041KV13-667FCXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding infrastructure and industrial applications.

This device belongs to the QDR™-IV HP SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking, telecom, and defense electronics.

FAQ

What is the function of the ZQ pin?

The ZQ pin provides a reference for internal output driver impedance calibration. When connected to a precision 240 Ω resistor to VSS, the device dynamically adjusts its DQ and clock driver strengths to match system trace impedance - ensuring consistent signal integrity across voltage and temperature variations without external termination components.

Does CY7C4041KV13-667FCXC support asynchronous reset?

Yes - the RST# pin provides an active-low asynchronous reset that clears internal state, resets configuration registers, and places all outputs in high-impedance mode. It features an internal pull-down resistor and operates independently of clock domains, enabling safe power-up initialization and fault recovery in mission-critical systems.

How does address parity protection work on this SRAM?

Address parity is implemented via the AP input pin, which carries even parity over A[20:0] for the 2M × 36 configuration. The PE# output asserts low when a parity mismatch is detected during address latching. This flag remains asserted until cleared by writing to the Configuration Register - enabling system-level error logging and fail-safe response before memory corruption occurs.

Can both ports operate at full bandwidth simultaneously?

Yes - port A and port B are fully independent with separate data clocks (DKA/DKB, QKA/QKB) and command enable signals (LDA#/LDB#, RWA#/RWB#). The architecture guarantees concurrent read/write transactions at full 667 MHz DDR rates on both ports without contention, delivering the rated 1334 MT/s total random transaction rate under real-world mixed-access conditions.

CY7C4041KV13-667FCXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
361-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR IV
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
667 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.1V ~ 1.3V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
361-FCBGA (21x21)

CY7C4041KV13-667FCXC FAQ

1.How can I place an order for CY7C4041KV13-667FCXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C4041KV13-667FCXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C4041KV13-667FCXC reliable?

The price and inventory of CY7C4041KV13-667FCXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C4041KV13-667FCXC is usually 5 days.

3.What payment methods are accepted for CY7C4041KV13-667FCXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C4041KV13-667FCXC transactions.

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4.How is shipping managed for CY7C4041KV13-667FCXC?

CY7C4041KV13-667FCXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C4041KV13-667FCXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C4041KV13-667FCXC?

For technical support, including CY7C4041KV13-667FCXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C4041KV13-667FCXC requirements.

6.How does Aetrix verify that CY7C4041KV13-667FCXC is sourced from the original manufacturer or authorized distributors?

All CY7C4041KV13-667FCXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C4041KV13-667FCXC meets industry standards.

7.What is the process for return or replacement of CY7C4041KV13-667FCXC?

All CY7C4041KV13-667FCXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C4041KV13-667FCXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C4041KV13-667FCXC part is unused and in its original packaging.

Return procedure for CY7C4041KV13-667FCXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C4041KV13-667FCXC Tags

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