Infineon Technologies CY7C4041KV13-667FCXC
- Part No.:
- CY7C4041KV13-667FCXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 361-BBGA, FCBGA
- Datasheet:
-
CY7C4041KV13-667FCXC.pdf
- Description:
- IC SRAM 72MBIT PAR 361FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,430
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Product details
Overview
CY7C4041KV13-667FCXC from Cypress Semiconductor is a 72-Mbit QDR™-IV HP SRAM configured as 2M × 36, operating at 667 MHz with 5.0-cycle read latency and 3.0-cycle write latency, supporting concurrent dual-port DDR transactions for high-throughput packet buffering in network line cards.
For engineers reviewing the CY7C4041KV13-667FCXC datasheet, CY7C4041KV13-667FCXC pinout, CY7C4041KV13-667FCXC application, or CY7C4041KV13-667FCXC equivalent, key selection criteria include its 1334 MT/s random transaction rate, on-die termination programmability, per-bit deskew training, ECC-enabled soft error resilience (<0.01 FITs/Mb), and 361-ball FCBGA package compatibility with high-speed SerDes subsystems.
Technical Context
The device implements two independent bi-directional DDR data ports (A and B) sharing a single DDR address/command bus clocked by differential CK/CK#, enabling fully concurrent read/write operations without arbitration delay. Address sampling is split across CK edges: rising edge for port A, falling edge for port B.
It integrates JESD8-26-compliant JTAG 1149.1 test access, on-chip ECC for single-bit error correction, programmable bus inversion, address parity protection, and ZQ-based output impedance calibration - all optimized for deterministic low-latency memory access in telecom and datacom infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 72 Mbit (2M × 36 configuration) |
| Max Frequency | 667 MHz - enables 1334 MT/s random transaction rate |
| Read Latency | 5.0 clock cycles - fixed timing for predictable pipeline scheduling |
| Write Latency | 3.0 clock cycles - minimal delay for write-back or streaming use cases |
| I/O Voltage | VDDQ = 1.2 V ± 50 mV (HSTL/SSTL) or 1.1 V ± 50 mV (POD) |
| Core Voltage | VDD = 1.3 V ± 40 mV - tightly regulated supply for stable high-speed operation |
| Soft Error Rate | <0.01 FITs/Mb - four-order improvement over prior SRAM generations via on-chip ECC |
Pinout & Package
Package: 361-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA), 21 mm × 21 mm, RoHS-compliant, with 0.8 mm ball pitch and thermal pad center.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK, CK# | Differential address/command clock input | Rising edge latches port A control/address; falling edge latches port B |
| DKA[1:0], DKA#[1:0], DKB[1:0], DKB#[1:0] | Differential data input clocks | Four dedicated DDR clock pairs - two per port - for precise DQ capture timing |
| QKA[1:0], QKA#[1:0], QKB[1:0], QKB#[1:0] | Differential data output clocks | Four dedicated DDR clock pairs - two per port - for edge-aligned DQ output |
| DQA[35:0], DQB[35:0] | Bidirectional DDR data bus | 36-bit wide per port; supports two-word burst on every access |
| LDA#, LDB# | Synchronous load enable | Active-low command gating per port - decouples command flow from data timing |
| RWA#, RWB# | Synchronous read/write select | Paired with LDx# to define R/W operation per port on each CK edge |
| ZQ | Output impedance calibration reference | Enables dynamic ODT tuning to match system trace impedance (e.g., 40 Ω or 50 Ω) |
| AP, PE# | Address parity input / error flag | Even parity coverage over A[20:0]; PE# asserts low on mismatch and holds until cleared |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent DDR data ports | Enables simultaneous read from port A and write to port B with zero arbitration overhead |
| Programmable on-die termination (ODT) | Configurable termination for CK, address/command, and DQ lines - eliminates external resistors and improves signal integrity |
| Per-bit deskew training sequence | Automated calibration of DQ-to-clock alignment per bit - ensures setup/hold compliance across temperature/voltage corners |
| On-chip ECC | Single-bit error detection and correction - reduces SER to <0.01 FITs/Mb for cosmic-ray immunity in telecom chassis |
| JTAG 1149.1 boundary scan | Full IEEE-compliant test access - supports production testing, debug, and configuration register programming |
Applications
| High-Speed Packet Buffering | Network Processor Interface |
|---|---|
Use Scenario: Line-rate buffering of 100G Ethernet frames in switch fabric ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with sub-5ns read latency and concurrent access. Use Value: Eliminates external arbitration logic and sustains 1334 MT/s random access under real-world traffic patterns. | Use Scenario: Shared memory between multi-core network processors and traffic managers. IC Role / Device Role / Timing Role: Low-latency, deterministic memory resource accessed by parallel CPU clusters via separate ports. Use Value: Enables lock-free inter-core communication with guaranteed 3-cycle write commit and 5-cycle read response. |
| Telecom Baseband Processing | Radar Signal Processing |
Use Scenario: Real-time symbol-level buffering in 5G massive MIMO baseband units. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory for FFT/IFFT pipelines with burst-aligned data flow. Use Value: Two-word burst mode matches 5G NR slot structure; ECC prevents bit flips in radiation-prone outdoor cabinets. | Use Scenario: Pulse-Doppler processing buffer in airborne AESA radar systems. IC Role / Device Role / Timing Role: Deterministic latency memory for time-critical range-Doppler map generation. Use Value: Fixed 5-cycle read latency enables cycle-accurate scheduling; ZQ calibration maintains signal fidelity at extended temperature ranges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150L10BG | Lower max frequency (500 MHz); no on-chip ECC; uses SSTL-15 I/O | Lacks SER hardening and per-bit deskew - unsuitable for radiation-sensitive telecom deployments | Select only for cost-sensitive, non-ECC-requiring legacy designs with ≤500 MHz clocking |
| AS7C36256PFS-100BIN | Asynchronous interface; 100 MHz max; no DDR ports or training capability | Designed for simple microcontroller co-processor memory - not for concurrent high-speed packet buffering | Use only in low-bandwidth embedded control applications where deterministic latency is not required |
Compared with IDT72T36150L10BG and AS7C36256PFS-100BIN, CY7C4041KV13-667FCXC delivers 33% higher transaction throughput, hardware ECC for field reliability, and automated deskew - making it uniquely suited for carrier-grade infrastructure where latency predictability and soft-error immunity are mandatory.
Availability
CY7C4041KV13-667FCXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network processor interfacing, telecom baseband processing, and radar signal processing requiring stable component supply across long-lifecycle deployments.
Supply support for CY7C4041KV13-667FCXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding infrastructure and industrial applications.
This device belongs to the QDR™-IV HP SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking, telecom, and defense electronics.
FAQ
What is the function of the ZQ pin?
The ZQ pin provides a reference for internal output driver impedance calibration. When connected to a precision 240 Ω resistor to VSS, the device dynamically adjusts its DQ and clock driver strengths to match system trace impedance - ensuring consistent signal integrity across voltage and temperature variations without external termination components.
Does CY7C4041KV13-667FCXC support asynchronous reset?
Yes - the RST# pin provides an active-low asynchronous reset that clears internal state, resets configuration registers, and places all outputs in high-impedance mode. It features an internal pull-down resistor and operates independently of clock domains, enabling safe power-up initialization and fault recovery in mission-critical systems.
How does address parity protection work on this SRAM?
Address parity is implemented via the AP input pin, which carries even parity over A[20:0] for the 2M × 36 configuration. The PE# output asserts low when a parity mismatch is detected during address latching. This flag remains asserted until cleared by writing to the Configuration Register - enabling system-level error logging and fail-safe response before memory corruption occurs.
Can both ports operate at full bandwidth simultaneously?
Yes - port A and port B are fully independent with separate data clocks (DKA/DKB, QKA/QKB) and command enable signals (LDA#/LDB#, RWA#/RWB#). The architecture guarantees concurrent read/write transactions at full 667 MHz DDR rates on both ports without contention, delivering the rated 1334 MT/s total random transaction rate under real-world mixed-access conditions.
CY7C4041KV13-667FCXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 361-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR IV
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 667 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.1V ~ 1.3V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-FCBGA (21x21)
CY7C4041KV13-667FCXC FAQ
1.How can I place an order for CY7C4041KV13-667FCXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C4041KV13-667FCXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C4041KV13-667FCXC reliable?
The price and inventory of CY7C4041KV13-667FCXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C4041KV13-667FCXC is usually 5 days.
3.What payment methods are accepted for CY7C4041KV13-667FCXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C4041KV13-667FCXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C4041KV13-667FCXC?
CY7C4041KV13-667FCXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C4041KV13-667FCXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C4041KV13-667FCXC?
For technical support, including CY7C4041KV13-667FCXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C4041KV13-667FCXC requirements.
6.How does Aetrix verify that CY7C4041KV13-667FCXC is sourced from the original manufacturer or authorized distributors?
All CY7C4041KV13-667FCXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C4041KV13-667FCXC meets industry standards.
7.What is the process for return or replacement of CY7C4041KV13-667FCXC?
All CY7C4041KV13-667FCXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C4041KV13-667FCXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C4041KV13-667FCXC part is unused and in its original packaging.
Return procedure for CY7C4041KV13-667FCXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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