Infineon Technologies CY7C4042KV13-106FCXC

Overview

CY7C4042KV13-106FCXC from Cypress Semiconductor is a 72-Mbit QDR™-IV XP SRAM configured as 2M × 36, operating at 1066 MHz with 8.0-cycle read latency and 5.0-cycle write latency. It features dual independent DDR data ports (A/B), 8-bank architecture enabling one access per bank per cycle, and on-chip ECC for soft error correction in high-reliability networking and test equipment memory buffers.

For engineers reviewing the CY7C4042KV13-106FCXC datasheet, CY7C4042KV13-106FCXC pinout, CY7C4042KV13-106FCXC application, or CY7C4042KV13-106FCXC equivalent, key selection criteria include concurrent port transaction capability, DDR address/command timing alignment, HSTL/SSTL/POD I/O compatibility, and ZQ-calibrated output impedance matching for signal integrity at 1066 MHz.

Technical Context

This QDR-IV XP SRAM uses differential clocking: CK/CK# for address/command sampling (rising edge for Port A, falling edge for Port B), plus dedicated DKA/DKB and QKA/QKB differential pairs for data input and output clocking respectively. Its 8-bank architecture supports full concurrency-each bank can be accessed once per clock cycle without conflict.

The device implements DDR signaling on all data and address buses, SDR control signaling, and supports programmable bus inversion (address and data), on-die termination (ODT) for CK/CK#, address/command, and DQ lines, and per-bit deskew training via dedicated loopback pins (LBK0#, LBK1#) to maintain timing margins at 1066 MHz operation.

Key Specifications

Pinout & Package

Package: 361-ball Fine-Pitch Chip Scale Ball Grid Array (FCBGA), 21 mm × 21 mm, Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with IDT72T36120L10BG and IS61WV102436B, CY7C4042KV13-106FCXC delivers double the density, 6.6% higher frequency, deterministic dual-port latency, and hardware ECC - making it the sole option for new 100G+ infrastructure designs requiring both bandwidth and reliability.

Availability

CY7C4042KV13-106FCXC is available at Aetrix Electronics and suitable for high-speed network packet buffering, telecom baseband processing, and aerospace data logging requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C4042KV13-106FCXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and infrastructure applications.

CY7C4042KV13 belongs to the QDR™-IV XP SRAM product line, engineered specifically for ultra-low-latency, high-throughput memory subsystems in networking, test equipment, and defense electronics.

FAQ

What is the minimum supported VDDQ voltage for POD signaling?

The CY7C4042KV13-106FCXC supports POD signaling at VDDQ = 1.1 V ± 50 mV. This voltage must be stable within tolerance during operation; deviation beyond ±50 mV invalidates POD compliance and may cause signal integrity failures at 1066 MHz. The device does not support POD at 1.2 V - that voltage is reserved for HSTL/SSTL modes.

How does the address parity protection work, and what happens when an error is detected?

AP input provides even parity across address bits (A[20:0] for ×36 mode). When mismatch occurs, PE# asserts LOW and remains latched until cleared via Configuration Register command 0x03. During PE# assertion, the device halts new commands but continues ongoing internal operations - allowing system-level error handling before resuming.

Can the ZQ calibration pin be left unconnected if external termination is used?

No. ZQ must be connected to a 240 Ω ± 1% resistor to ground for on-die output impedance calibration. Leaving ZQ floating disables ODT tuning and causes unpredictable drive strength, leading to signal reflections and timing violations at 1066 MHz. External termination cannot replace ZQ-based calibration.

Is the JTAG interface functional during normal memory operation?

Yes. The IEEE 1149.1 TAP remains fully accessible during active memory operation. Boundary scan, configuration register reads/writes, and instruction execution do not interrupt data transactions on Port A or Port B - enabling in-system debug and field firmware updates without service interruption.