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Infineon Technologies CY7C4042KV13-933FCXC

Part No.:
CY7C4042KV13-933FCXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
361-BBGA, FCBGA
Datasheet:
AetrixCY7C4042KV13-933FCXC.pdf
Description:
IC SRAM 72MBIT PAR 361FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,677

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Product details

Overview

CY7C4042KV13-933FCXC from Cypress Semiconductor is a 72-Mbit QDR™-IV XP SRAM configured as 2M × 36, operating at up to 933 MHz with 2132 MT/s total random transaction rate, 8.0-cycle read latency, and dual independent DDR data ports (A/B) for concurrent access in high-bandwidth networking and packet buffering applications.

For engineers reviewing the CY7C4042KV13-933FCXC datasheet, CY7C4042KV13-933FCXC pinout, CY7C4042KV13-933FCXC application, or CY7C4042KV13-933FCXC equivalent, key selection criteria include its 933 MHz maximum frequency, 1.3 V core voltage, 1.2 V I/O supply, on-die termination, per-bit deskew training, and JTAG 1149.1 compliance for production testability.

Technical Context

This QDR-IV XP SRAM uses an 8-bank architecture enabling one access per bank per clock cycle, with address latching on rising/falling edges of differential CK/CK# to separate Port A and Port B command timing. It supports two-word burst transfers on all accesses and employs DDR signaling on both data and address/command paths.

Control signaling runs at SDR while data and address paths use DDR; three differential clock domains exist-(CK, CK#) for address/command, (DKA/DKB pairs) for data input, and (QKA/QKB pairs) for data output. Internal ECC corrects single-bit errors, achieving <0.01 FITs/Mb soft error rate, and ZQ-based impedance calibration ensures signal integrity across HSTL/SSTL/POD I/O standards.

Key Specifications

ParameterValue and Actual Design Meaning
Density & Width72 Mbit, organized as 2M × 36 - enables high-throughput 36-bit parallel data path for switch fabric buffers
Max Frequency933 MHz - defines maximum clock rate for sustained 2132 MT/s random transaction throughput
Read Latency8.0 clock cycles - fixed delay from address assertion to valid DQA/DQB output, critical for deterministic timing closure
Core VoltageVDD = 1.3 V ± 40 mV - tightly regulated supply required for stable internal logic and ECC operation
I/O VoltageVDDQ = 1.2 V ± 50 mV (HSTL/SSTL) or 1.1 V ± 50 mV (POD) - selects compatible bus signaling standard
ECC CapabilityOn-chip SEC-DED - detects and corrects all single-bit memory errors, reducing SER to <0.01 FITs/Mb
Bank Architecture8 independent banks - allows interleaved access to sustain full bandwidth without bank conflicts

Pinout & Package

Available in 361-ball FCBGA package (21 mm × 21 mm, Pb-free), with ball pitch of 1.0 mm and thermal pad exposed on underside for enhanced heat dissipation in high-power memory subsystems.

Pin/TerminalCircuit RoleDesign Meaning
CK, CK#Differential address/command clock inputRising edge clocks Port A; falling edge clocks Port B - enables time-multiplexed dual-port control on shared address bus
DKA[1:0], DKA#[1:0], DKB[1:0], DKB#[1:0]Differential data input clocksFour dedicated DDR clock pairs - provide precise strobing for 36-bit DQA/DQB inputs, supporting per-byte deskew
QKA[1:0], QKA#[1:0], QKB[1:0], QKB#[1:0]Differential data output clocksFour dedicated DDR output clocks - edge-aligned with DQA/DQB outputs to meet tight setup/hold windows
DQA[35:0], DQB[35:0]Bidirectional DDR data portsTwo independent 36-bit DDR buses - support simultaneous read/write between ports without arbitration delay
A[19:0]Address inputs (×36 config)20-bit address bus - selects 2M locations; A[2:0] encode bank ID for 8-bank parallelism
APAddress parity inputEven parity over A[20:0] - detects single-bit address corruption before memory access
PE#Address parity error flagActive-low open-drain output - signals parity failure and holds until cleared via configuration register
ZQ/ZTImpedance calibration referenceConnects to 240 Ω ± 1% external resistor - calibrates ODT and driver strength to match PCB trace impedance

Key Features

FeatureDesign Value
Dual independent DDR data portsEnables true concurrent read/write on Port A and Port B - eliminates arbitration overhead in packet buffer architectures
On-die termination (ODT)Programmable per-pin termination for CK, address/command, and DQ - reduces stub reflections without external resistors
Per-bit deskew training sequenceAutomated calibration using TMS/TCK - compensates for flight-time mismatch across 36-bit DQ bus at 933 MHz
Bus inversion (AINV/DINVA/DINVB)Reduces simultaneous switching noise by inverting data/address when >50% bits are high - lowers peak current and EMI
JTAG 1149.1 boundary scanFull IEEE 1149.1 compliance with TAP controller - enables production ICT, interconnect test, and in-system programming

Applications

High-Speed Network Switch BuffersTelecom Line Card Packet Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches with sub-100 ns latency requirements.

IC Role / Device Role / Timing Role: Dual-port QDR SRAM serving as shared buffer between ingress parser and egress scheduler, synchronized via CK/CK# and QKA/QKB clocks.

Use Value: 2132 MT/s RTR and 8-cycle read latency enable line-rate forwarding at 100 Gbps+ with zero packet loss under burst traffic.

Use Scenario: Buffering variable-length ATM or IP cells in carrier-grade DSLAMs and OLT line cards requiring deterministic jitter performance.

IC Role / Device Role / Timing Role: High-reliability memory node with ECC and address parity - deployed in telecom infrastructure where field failure is unacceptable.

Use Value: <0.01 FITs/Mb SER and JTAG testability ensure >20-year operational life in unattended central office environments.

PCIe-Based Accelerator CachesReal-Time Radar Signal Processing

Use Scenario: Acting as low-latency scratchpad memory between FPGA-based PCIe endpoint and host CPU in AI inference accelerators.

IC Role / Device Role / Timing Role: ×36 interface matches AXI4-Stream or CHI data widths; dual-port mode decouples DMA write and compute read streams.

Use Value: Concurrent port access eliminates memory contention, improving kernel execution efficiency by ≥35% vs. single-port SRAM.

Use Scenario: Capturing and buffering high-resolution pulse-Doppler radar samples in airborne SAR systems with strict timing determinism.

IC Role / Device Role / Timing Role: Time-critical acquisition buffer synchronized to system master clock via CK/CK#, with QVLDA/QVLDB indicating valid sample windows.

Use Value: Fixed 8-cycle read latency and per-bit deskew guarantee ±50 ps timing skew across 36-bit ADC output bus at 933 MHz sampling rate.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T36120L10BG100 MHz max frequency, ×36 QDR-II+, no on-chip ECC or ZQ calibrationLimited to ≤10 Gbps systems; requires external termination and parity logicSelect when cost sensitivity outweighs bandwidth/ECC needs and legacy QDR-II+ ecosystem exists
MT47H128M16RT-25EDDR2 SDRAM, 250 MHz, ×16, no dual-port capability, higher latencyRequires external arbitration logic for pseudo-dual-port behavior; no deterministic timingChoose only if system already uses DDR2 controllers and bandwidth demand is ≤4.8 GB/s

Compared with IDT72T36120L10BG and MT47H128M16RT-25E, CY7C4042KV13-933FCXC delivers 8.5× higher random transaction rate, integrated ECC for radiation-hardened operation, and autonomous impedance tuning - making it uniquely suited for next-gen 100G+ infrastructure where latency, reliability, and signal integrity are non-negotiable.

Availability

CY7C4042KV13-933FCXC is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, PCIe-based accelerator caches, and real-time radar signal processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C4042KV13-933FCXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with headquarters in San Jose, CA.

CY7C4042KV13 belongs to the QDR™-IV XP SRAM product line, engineered specifically for ultra-low-latency, high-throughput packet buffering and real-time signal processing in carrier-grade infrastructure equipment.

FAQ

What is the difference between CY7C4042KV13-933FCXC and CY7C4042KV13-1066FCXC?

The -933FCXC variant is rated for 933 MHz maximum operating frequency and 2132 MT/s random transaction rate, while the -1066FCXC operates up to 1066 MHz with identical pinout and functionality. The -933 version targets systems where thermal or power constraints limit clock speed, offering lower dynamic power consumption (4000 mA vs. 4500 mA at ×36) without sacrificing dual-port concurrency or ECC features.

Does CY7C4042KV13-933FCXC support automatic impedance calibration during operation?

Yes - the device performs on-die termination (ODT) calibration using the ZQ pin connected to a 240 Ω ±1% external resistor. Calibration occurs at power-up and can be re-triggered via configuration register command. It adjusts driver output impedance and ODT values for CK, address/command, and DQ signals independently to maintain signal integrity across voltage and temperature variations.

Can the address parity feature be disabled?

No - address parity (AP input and PE# output) is always active and cannot be disabled via configuration registers. AP must be driven with even parity over A[20:0], and any mismatch asserts PE# low until cleared by writing to the Configuration Register's PARITY_CLEAR bit. This hardwired protection ensures fault detection in safety-critical telecom and aerospace applications.

Is JTAG boundary scan supported at the full 933 MHz data rate?

No - JTAG 1149.1 operation is limited to ≤25 MHz TCK frequency per JESD8-26 compliance. The TAP controller functions independently of the main memory interface and remains fully operational for test and debug even when the SRAM is running at 933 MHz. TRST#, TMS, TDI, and TDO pins retain 1.3-V LVCMOS signaling regardless of VDDQ setting.

CY7C4042KV13-933FCXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
361-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR IV
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
933 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.26V ~ 1.34V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
361-FCBGA (21x21)

CY7C4042KV13-933FCXC FAQ

1.How can I place an order for CY7C4042KV13-933FCXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C4042KV13-933FCXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C4042KV13-933FCXC reliable?

The price and inventory of CY7C4042KV13-933FCXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C4042KV13-933FCXC is usually 5 days.

3.What payment methods are accepted for CY7C4042KV13-933FCXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C4042KV13-933FCXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C4042KV13-933FCXC?

CY7C4042KV13-933FCXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C4042KV13-933FCXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C4042KV13-933FCXC?

For technical support, including CY7C4042KV13-933FCXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C4042KV13-933FCXC requirements.

6.How does Aetrix verify that CY7C4042KV13-933FCXC is sourced from the original manufacturer or authorized distributors?

All CY7C4042KV13-933FCXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C4042KV13-933FCXC meets industry standards.

7.What is the process for return or replacement of CY7C4042KV13-933FCXC?

All CY7C4042KV13-933FCXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C4042KV13-933FCXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C4042KV13-933FCXC part is unused and in its original packaging.

Return procedure for CY7C4042KV13-933FCXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C4042KV13-933FCXC Tags

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