Infineon Technologies CY7C4042KV13-933FCXC
- Part No.:
- CY7C4042KV13-933FCXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 361-BBGA, FCBGA
- Datasheet:
-
CY7C4042KV13-933FCXC.pdf
- Description:
- IC SRAM 72MBIT PAR 361FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C4042KV13-933FCXC from Cypress Semiconductor is a 72-Mbit QDR™-IV XP SRAM configured as 2M × 36, operating at up to 933 MHz with 2132 MT/s total random transaction rate, 8.0-cycle read latency, and dual independent DDR data ports (A/B) for concurrent access in high-bandwidth networking and packet buffering applications.
For engineers reviewing the CY7C4042KV13-933FCXC datasheet, CY7C4042KV13-933FCXC pinout, CY7C4042KV13-933FCXC application, or CY7C4042KV13-933FCXC equivalent, key selection criteria include its 933 MHz maximum frequency, 1.3 V core voltage, 1.2 V I/O supply, on-die termination, per-bit deskew training, and JTAG 1149.1 compliance for production testability.
Technical Context
This QDR-IV XP SRAM uses an 8-bank architecture enabling one access per bank per clock cycle, with address latching on rising/falling edges of differential CK/CK# to separate Port A and Port B command timing. It supports two-word burst transfers on all accesses and employs DDR signaling on both data and address/command paths.
Control signaling runs at SDR while data and address paths use DDR; three differential clock domains exist-(CK, CK#) for address/command, (DKA/DKB pairs) for data input, and (QKA/QKB pairs) for data output. Internal ECC corrects single-bit errors, achieving <0.01 FITs/Mb soft error rate, and ZQ-based impedance calibration ensures signal integrity across HSTL/SSTL/POD I/O standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Width | 72 Mbit, organized as 2M × 36 - enables high-throughput 36-bit parallel data path for switch fabric buffers |
| Max Frequency | 933 MHz - defines maximum clock rate for sustained 2132 MT/s random transaction throughput |
| Read Latency | 8.0 clock cycles - fixed delay from address assertion to valid DQA/DQB output, critical for deterministic timing closure |
| Core Voltage | VDD = 1.3 V ± 40 mV - tightly regulated supply required for stable internal logic and ECC operation |
| I/O Voltage | VDDQ = 1.2 V ± 50 mV (HSTL/SSTL) or 1.1 V ± 50 mV (POD) - selects compatible bus signaling standard |
| ECC Capability | On-chip SEC-DED - detects and corrects all single-bit memory errors, reducing SER to <0.01 FITs/Mb |
| Bank Architecture | 8 independent banks - allows interleaved access to sustain full bandwidth without bank conflicts |
Pinout & Package
Available in 361-ball FCBGA package (21 mm × 21 mm, Pb-free), with ball pitch of 1.0 mm and thermal pad exposed on underside for enhanced heat dissipation in high-power memory subsystems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CK, CK# | Differential address/command clock input | Rising edge clocks Port A; falling edge clocks Port B - enables time-multiplexed dual-port control on shared address bus |
| DKA[1:0], DKA#[1:0], DKB[1:0], DKB#[1:0] | Differential data input clocks | Four dedicated DDR clock pairs - provide precise strobing for 36-bit DQA/DQB inputs, supporting per-byte deskew |
| QKA[1:0], QKA#[1:0], QKB[1:0], QKB#[1:0] | Differential data output clocks | Four dedicated DDR output clocks - edge-aligned with DQA/DQB outputs to meet tight setup/hold windows |
| DQA[35:0], DQB[35:0] | Bidirectional DDR data ports | Two independent 36-bit DDR buses - support simultaneous read/write between ports without arbitration delay |
| A[19:0] | Address inputs (×36 config) | 20-bit address bus - selects 2M locations; A[2:0] encode bank ID for 8-bank parallelism |
| AP | Address parity input | Even parity over A[20:0] - detects single-bit address corruption before memory access |
| PE# | Address parity error flag | Active-low open-drain output - signals parity failure and holds until cleared via configuration register |
| ZQ/ZT | Impedance calibration reference | Connects to 240 Ω ± 1% external resistor - calibrates ODT and driver strength to match PCB trace impedance |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent DDR data ports | Enables true concurrent read/write on Port A and Port B - eliminates arbitration overhead in packet buffer architectures |
| On-die termination (ODT) | Programmable per-pin termination for CK, address/command, and DQ - reduces stub reflections without external resistors |
| Per-bit deskew training sequence | Automated calibration using TMS/TCK - compensates for flight-time mismatch across 36-bit DQ bus at 933 MHz |
| Bus inversion (AINV/DINVA/DINVB) | Reduces simultaneous switching noise by inverting data/address when >50% bits are high - lowers peak current and EMI |
| JTAG 1149.1 boundary scan | Full IEEE 1149.1 compliance with TAP controller - enables production ICT, interconnect test, and in-system programming |
Applications
| High-Speed Network Switch Buffers | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches with sub-100 ns latency requirements. IC Role / Device Role / Timing Role: Dual-port QDR SRAM serving as shared buffer between ingress parser and egress scheduler, synchronized via CK/CK# and QKA/QKB clocks. Use Value: 2132 MT/s RTR and 8-cycle read latency enable line-rate forwarding at 100 Gbps+ with zero packet loss under burst traffic. | Use Scenario: Buffering variable-length ATM or IP cells in carrier-grade DSLAMs and OLT line cards requiring deterministic jitter performance. IC Role / Device Role / Timing Role: High-reliability memory node with ECC and address parity - deployed in telecom infrastructure where field failure is unacceptable. Use Value: <0.01 FITs/Mb SER and JTAG testability ensure >20-year operational life in unattended central office environments. |
| PCIe-Based Accelerator Caches | Real-Time Radar Signal Processing |
Use Scenario: Acting as low-latency scratchpad memory between FPGA-based PCIe endpoint and host CPU in AI inference accelerators. IC Role / Device Role / Timing Role: ×36 interface matches AXI4-Stream or CHI data widths; dual-port mode decouples DMA write and compute read streams. Use Value: Concurrent port access eliminates memory contention, improving kernel execution efficiency by ≥35% vs. single-port SRAM. | Use Scenario: Capturing and buffering high-resolution pulse-Doppler radar samples in airborne SAR systems with strict timing determinism. IC Role / Device Role / Timing Role: Time-critical acquisition buffer synchronized to system master clock via CK/CK#, with QVLDA/QVLDB indicating valid sample windows. Use Value: Fixed 8-cycle read latency and per-bit deskew guarantee ±50 ps timing skew across 36-bit ADC output bus at 933 MHz sampling rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120L10BG | 100 MHz max frequency, ×36 QDR-II+, no on-chip ECC or ZQ calibration | Limited to ≤10 Gbps systems; requires external termination and parity logic | Select when cost sensitivity outweighs bandwidth/ECC needs and legacy QDR-II+ ecosystem exists |
| MT47H128M16RT-25E | DDR2 SDRAM, 250 MHz, ×16, no dual-port capability, higher latency | Requires external arbitration logic for pseudo-dual-port behavior; no deterministic timing | Choose only if system already uses DDR2 controllers and bandwidth demand is ≤4.8 GB/s |
Compared with IDT72T36120L10BG and MT47H128M16RT-25E, CY7C4042KV13-933FCXC delivers 8.5× higher random transaction rate, integrated ECC for radiation-hardened operation, and autonomous impedance tuning - making it uniquely suited for next-gen 100G+ infrastructure where latency, reliability, and signal integrity are non-negotiable.
Availability
CY7C4042KV13-933FCXC is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, PCIe-based accelerator caches, and real-time radar signal processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C4042KV13-933FCXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with headquarters in San Jose, CA.
CY7C4042KV13 belongs to the QDR™-IV XP SRAM product line, engineered specifically for ultra-low-latency, high-throughput packet buffering and real-time signal processing in carrier-grade infrastructure equipment.
FAQ
What is the difference between CY7C4042KV13-933FCXC and CY7C4042KV13-1066FCXC?
The -933FCXC variant is rated for 933 MHz maximum operating frequency and 2132 MT/s random transaction rate, while the -1066FCXC operates up to 1066 MHz with identical pinout and functionality. The -933 version targets systems where thermal or power constraints limit clock speed, offering lower dynamic power consumption (4000 mA vs. 4500 mA at ×36) without sacrificing dual-port concurrency or ECC features.
Does CY7C4042KV13-933FCXC support automatic impedance calibration during operation?
Yes - the device performs on-die termination (ODT) calibration using the ZQ pin connected to a 240 Ω ±1% external resistor. Calibration occurs at power-up and can be re-triggered via configuration register command. It adjusts driver output impedance and ODT values for CK, address/command, and DQ signals independently to maintain signal integrity across voltage and temperature variations.
Can the address parity feature be disabled?
No - address parity (AP input and PE# output) is always active and cannot be disabled via configuration registers. AP must be driven with even parity over A[20:0], and any mismatch asserts PE# low until cleared by writing to the Configuration Register's PARITY_CLEAR bit. This hardwired protection ensures fault detection in safety-critical telecom and aerospace applications.
Is JTAG boundary scan supported at the full 933 MHz data rate?
No - JTAG 1149.1 operation is limited to ≤25 MHz TCK frequency per JESD8-26 compliance. The TAP controller functions independently of the main memory interface and remains fully operational for test and debug even when the SRAM is running at 933 MHz. TRST#, TMS, TDI, and TDO pins retain 1.3-V LVCMOS signaling regardless of VDDQ setting.
CY7C4042KV13-933FCXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 361-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR IV
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 933 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.26V ~ 1.34V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-FCBGA (21x21)
CY7C4042KV13-933FCXC FAQ
1.How can I place an order for CY7C4042KV13-933FCXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C4042KV13-933FCXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C4042KV13-933FCXC reliable?
The price and inventory of CY7C4042KV13-933FCXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C4042KV13-933FCXC is usually 5 days.
3.What payment methods are accepted for CY7C4042KV13-933FCXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C4042KV13-933FCXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C4042KV13-933FCXC?
CY7C4042KV13-933FCXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C4042KV13-933FCXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C4042KV13-933FCXC?
For technical support, including CY7C4042KV13-933FCXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C4042KV13-933FCXC requirements.
6.How does Aetrix verify that CY7C4042KV13-933FCXC is sourced from the original manufacturer or authorized distributors?
All CY7C4042KV13-933FCXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C4042KV13-933FCXC meets industry standards.
7.What is the process for return or replacement of CY7C4042KV13-933FCXC?
All CY7C4042KV13-933FCXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C4042KV13-933FCXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C4042KV13-933FCXC part is unused and in its original packaging.
Return procedure for CY7C4042KV13-933FCXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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