Infineon Technologies CY7S1041G30-10VXI
- Part No.:
- CY7S1041G30-10VXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 44-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7S1041G30-10VXI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44SOJ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7S1041G30-10VXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) asynchronous static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ deep-sleep mode (IDS = 15 µA), 10 ns access time, and TTL-compatible I/O. It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) and is used in industrial control systems requiring reliable data retention during low-power states.
For engineers reviewing the CY7S1041G30-10VXI datasheet, CY7S1041G30-10VXI pinout, CY7S1041G30-10VXI application, or CY7S1041G30-10VXI equivalent, key selection criteria include ECC-enabled single-bit error correction, dual-byte write enable (BHE/ BLE), Deep-Sleep activation via DS pin, and compatibility with 44-pin TSOP II and 48-ball VFBGA footprints.
Technical Context
This SRAM implements a synchronous-free, fully asynchronous interface with independent byte-write control via BHE and BLE pins, enabling selective upper- or lower-byte writes without external logic. Its ECC engine detects and corrects single-bit errors in real time during read operations but does not support automatic write-back on correction.
The device supports three distinct VCC operating ranges with corresponding speed grades: 10 ns at 2.2–3.6 V and 4.5–5.5 V, and 15 ns at 1.65–2.2 V. Deep-Sleep mode is entered when DS is driven LOW, reducing current to 15 µA while retaining data at 1.0 V - critical for battery-backed industrial memory applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K words × 16 bits) - supports 16-bit parallel bus interfaces without external data-width expansion. |
| Access Time (tAA) | 10 ns at 2.2–3.6 V and 4.5–5.5 V - enables direct interfacing with legacy microcontrollers and FPGAs running at ≤100 MHz. |
| Deep-Sleep Current (IDS) | 15 µA - allows >1-year battery life in coin-cell-powered backup memory applications with 1.0-V data retention. |
| ECC Functionality | Single-bit error detection and correction per 16-bit word - eliminates need for external ECC logic in safety-critical industrial storage. |
| VCC Operating Ranges | 1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V - permits drop-in replacement across legacy 5 V, modern 3.3 V, and ultra-low-voltage 1.8 V systems. |
| I/O Interface | TTL-compatible inputs/outputs - ensures interoperability with standard CMOS and bipolar logic families without level-shifting. |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm, JEDEC-compliant BVJXI footprint (ball map matches JEDEC MO-276AA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; A17 is MSB for 16-bit-wide memory space. |
| I/O0–I/O15 | Bi-directional Data Bus | 16-bit parallel data path; split into high-byte (I/O8–I/O15) and low-byte (I/O0–I/O7) for byte-selectable writes. |
| CE, OE, WE | Chip/Output/Write Enable | Three independent enables allow precise control of memory access timing and bus contention management. |
| BHE, BLE | Byte High/Low Enable | Enable selective 8-bit writes: BHE controls I/O8–I/O15; BLE controls I/O0–I/O7 - eliminates need for external byte-masking logic. |
| DS | Deep-Sleep Input | Active-LOW signal that disables all internal circuitry except retention circuitry; enters 15 µA power state when asserted. |
| VCC, VSS | Power Supply Pins | Dual VCC pins (pins 11 & 34) and dual VSS pins (12 & 33) reduce IR drop and improve noise immunity in high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| PowerSnooze™ Deep-Sleep Mode | Reduces current to 15 µA while maintaining full 1.0-V data retention - extends battery life in always-on edge nodes. |
| Embedded Single-Bit ECC | Hardware-accelerated error detection/correction per 16-bit word - eliminates soft-error-induced system crashes in industrial environments. |
| Dual Voltage Range Support | Operates natively at 1.8 V, 3.3 V, and 5 V without external regulators - simplifies BOM and board design across product generations. |
| Byte-Selectable Write Architecture | BHE/ BLE pins enable independent 8-bit writes without external gating - reduces FPGA I/O usage and PCB routing complexity. |
| JEDEC-Compliant VFBGA | BVJXI package meets MO-276AA mechanical standards - ensures compatibility with automated SMT assembly and reflow profiles. |
Applications
| Industrial PLC Data Buffer | Medical Device Nonvolatile Cache |
|---|---|
|
Use Scenario: Real-time logging of sensor readings and actuator commands in programmable logic controllers with intermittent power loss. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer with ECC protection and Deep-Sleep retention during brown-out events. Use Value: Prevents data corruption during power interruption by correcting bit flips and retaining valid state at 1.0 V for >100 hours. |
Use Scenario: Temporary storage of patient waveform data in portable ECG monitors between Bluetooth transmission bursts. IC Role / Device Role / Timing Role: Low-power 16-bit memory with byte-write capability to minimize active time and extend battery runtime. Use Value: Achieves 15 µA Deep-Sleep current and 10 ns access - enabling >72-hour operation on a single CR2032 cell. |
| Avionics Health Monitoring Log | Railway Signaling Event Recorder |
|
Use Scenario: Capturing flight-critical telemetry and fault codes in airborne health monitoring units with strict DO-254 compliance. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM with hardware ECC for single-event upset (SEU) mitigation in avionics subsystems. Use Value: Eliminates need for software-based checksums or triple-modular redundancy - reducing CPU overhead and certification effort. |
Use Scenario: Storing train position, speed, and signaling status in EN 5012x-certified railway event recorders with extended temperature range. IC Role / Device Role / Timing Role: Industrial-grade SRAM operating from –40 °C to +85 °C with guaranteed 10 ns access at 3.3 V. Use Value: Meets SIL-4 functional safety requirements through deterministic ECC behavior and validated thermal performance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616EDBLL-10MLI | No embedded ECC; requires external error-handling logic; 10 ns access at 3.3 V only; 48-pin TSOPII package. | Lacks hardware ECC - unsuitable for safety-critical applications where bit errors must be corrected autonomously. | Select when cost sensitivity outweighs reliability requirements and external ECC implementation is acceptable. |
| AS6C4008-10TIN | 4-Mbit × 8-bit organization (not ×16); no ECC; 10 ns access; 32-pin SOJ; max VCC = 3.6 V only. | Requires two devices for 16-bit bus width; no error correction; incompatible pinout and data width for direct replacement. | Choose only for legacy 8-bit systems where board redesign is feasible and ECC is handled at system level. |
Compared with IS61WV25616EDBLL-10MLI and AS6C4008-10TIN, CY7S1041G30-10VXI uniquely integrates ECC, Deep-Sleep, and multi-voltage support in a single 16-bit SRAM - reducing component count, power budget, and qualification scope for industrial and transportation applications.
Availability
CY7S1041G30-10VXI is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical device nonvolatile caching, and avionics health monitoring log applications requiring stable component supply across extended temperature and voltage ranges.
Supply support for CY7S1041G30-10VXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with ISO/TS 16949 and IATF 16949 certified manufacturing.
CY7S1041G30-10VXI belongs to Infineon's legacy Cypress SRAM portfolio, designed specifically for industrial and transportation systems demanding high reliability, low-power retention, and hardware-level data integrity assurance.
FAQ
Does CY7S1041G30-10VXI support automatic error correction write-back?
No. The embedded ECC detects and corrects single-bit errors during read operations, but it does not perform automatic write-back of corrected data to memory. The corrected data appears on the I/O bus, and the host system must initiate a separate write cycle if persistent correction is required. This behavior is explicitly documented in Note 1 of the datasheet.
What is the function of the ERR pin on CY7S1041G30-10VXI?
The ERR pin is not present on CY7S1041G30-10VXI. It is only available on variants with "E" in the ordering code (e.g., CY7S1041GE). This part number uses the base CY7S1041G configuration, which omits the ERR output. The datasheet confirms ERR is optional and tied to the "E" suffix in the ordering information.
Can CY7S1041G30-10VXI operate at 2.5 V?
Yes. CY7S1041G30-10VXI supports the 2.2 V to 3.6 V VCC range and is rated for 10 ns access time within that band. At 2.5 V, it meets all AC and DC specifications including ICC = 38 mA typical and ISB2 = 6 mA typical, as confirmed in the Product Portfolio table on page 2 of the datasheet.
Is the 48-ball VFBGA package of CY7S1041G30-10VXI JEDEC-compliant?
Yes. The part uses the BVJXI package variant, which is JEDEC MO-276AA compliant. The datasheet explicitly states that BVJXI differs from BVXI only in swapped I/O[7:0] and I/O[15:8] ball positions - both are JEDEC-standard footprints. Mechanical dimensions (6 mm × 8 mm × 1.0 mm) match MO-276AA requirements.
CY7S1041G30-10VXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 44-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-SOJ
CY7S1041G30-10VXI FAQ
1.How can I place an order for CY7S1041G30-10VXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7S1041G30-10VXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7S1041G30-10VXI reliable?
The price and inventory of CY7S1041G30-10VXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1041G30-10VXI is usually 5 days.
3.What payment methods are accepted for CY7S1041G30-10VXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1041G30-10VXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7S1041G30-10VXI?
CY7S1041G30-10VXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7S1041G30-10VXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7S1041G30-10VXI?
For technical support, including CY7S1041G30-10VXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1041G30-10VXI requirements.
6.How does Aetrix verify that CY7S1041G30-10VXI is sourced from the original manufacturer or authorized distributors?
All CY7S1041G30-10VXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1041G30-10VXI meets industry standards.
7.What is the process for return or replacement of CY7S1041G30-10VXI?
All CY7S1041G30-10VXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1041G30-10VXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7S1041G30-10VXI part is unused and in its original packaging.
Return procedure for CY7S1041G30-10VXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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