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Infineon Technologies CY7S1041G30-10ZSXI

Part No.:
CY7S1041G30-10ZSXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7S1041G30-10ZSXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,539

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Product details

Overview

CY7S1041G30-10ZSXI from Infineon Technologies (formerly Cypress) is a 4-Mbit (256K × 16) asynchronous static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ deep-sleep mode, and TTL-compatible I/O. It delivers 10 ns access time at 2.2–3.6 V, supports 15 µA deep-sleep current, and operates across industrial temperature (–40°C to +85°C) in a 44-pin TSOP II package - used in mission-critical data buffers for industrial controllers and medical imaging subsystems.

For engineers reviewing the CY7S1041G30-10ZSXI datasheet, CY7S1041G30-10ZSXI pinout, CY7S1041G30-10ZSXI application, or CY7S1041G30-10ZSXI equivalent, this page provides verified functional identity, validated pin roles, confirmed ECC behavior, real-world standby/deep-sleep current values, and package-specific timing constraints - all directly traceable to Infineon's official documentation.

Technical Context

The CY7S1041G30-10ZSXI implements a synchronous-free, fully asynchronous SRAM architecture with dedicated ECC encoder/decoder logic that detects and corrects single-bit errors on read access without automatic write-back. Its PowerSnooze™ mode activates via the DS pin and reduces current to 15 µA while retaining data at 1.0 V.

It features dual byte-enable control (BHE/BLE) for independent upper/lower 8-bit writes, TTL-compatible input thresholds (VIH = 2.0 V min at 2.2–2.7 V VCC), and three selectable VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); this part is specified for the 2.2–3.6 V range with 10 ns tAA and 38 mA typical ICC.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K words × 16 bits = 4 Mbit total; enables 16-bit parallel data bus interface without external multiplexing.
Access Time (tAA) 10 ns at VCC = 2.2–3.6 V; guarantees sub-100 MHz random read/write cycle performance in high-speed buffering.
Deep-Sleep Current (IDS) 15 µA max at VCC = 3.6 V; allows >1-year battery-backed retention in portable diagnostic equipment.
ECC Function Detects and corrects single-bit errors per 16-bit word on read; no automatic write-back - requires host software awareness.
Supply Voltage Range 2.2 V to 3.6 V; compatible with 3.3 V system rails and tolerant of ±10% regulation drift.
Operating Temperature –40°C to +85°C industrial grade; qualified for use in PLC backplanes and motor drive control modules.
Package 44-pin TSOP II (10.16 mm × 18.42 mm, 0.8 mm pitch); surface-mount compatible with standard reflow profiles.

Pinout & Package

Package: 44-pin Thin Small Outline Package Type II (TSOP II), JEDEC MO-141AC compliant, body size 10.16 mm × 18.42 mm, 0.8 mm lead pitch, plastic body with gull-wing leads.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word addressing; A0 least significant, A17 most significant.
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; supports byte-wide access via BHE/BLE; TTL-compatible voltage levels.
/CE Chip Enable Active-low enable; device enters standby (ISB2 = 6 mA typ) when high; required low for read/write cycles.
/OE Output Enable Active-low control for output drivers; enables read data on I/O pins only when /CE and /OE both low.
/WE Write Enable Active-low signal initiating write operation; latches address and data on falling edge when /CE low.
/BHE Byte High Enable Controls I/O8–I/O15; enables upper-byte write/read when low; used for 8-bit peripheral interfacing.
/BLE Byte Low Enable Controls I/O0–I/O7; enables lower-byte write/read when low; supports legacy 8-bit microcontroller buses.
/DS Deep-Sleep Input Active-low entry into 15 µA retention mode; disables all internal logic except memory array and ECC retention circuitry.

Key Features

Feature Design Value
PowerSnooze™ Deep-Sleep Mode Reduces current to 15 µA while retaining full 4-Mbit content at 1.0 V - extends battery life in always-on edge nodes.
Embedded Single-Bit ECC Hardware-level error detection/correction per 16-bit word eliminates need for external ECC logic or software overhead.
TTL-Compatible I/O Accepts standard 3.3 V logic inputs and drives 3.3 V outputs with VIH = 2.0 V min, eliminating level-shifter requirements.
Dual Byte-Enable Architecture Independent /BHE and /BLE allow simultaneous or selective 8-bit access - critical for mixed-width bus systems.
Triple VCC Range Support Single footprint supports 1.8 V, 3.3 V, and 5 V systems via voltage-range variants - simplifies BOM consolidation.

Applications

Industrial PLC Data Buffer Medical Imaging Frame Store

Use Scenario: Real-time acquisition of sensor data streams in programmable logic controllers with deterministic latency requirements.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between FPGA-based I/O engine and ARM Cortex-M7 application processor.

Use Value: 10 ns access time ensures sub-microsecond response to interrupt-driven analog input capture; ECC prevents silent corruption in long-duration logging.

Use Scenario: Temporary storage of uncompressed ultrasound or X-ray frame data before compression and transmission.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency frame buffer interfaced to image sensor controller via 16-bit parallel bus.

Use Value: 38 mA active current and 6 mA standby enable thermal-constrained enclosure design; 15 µA deep-sleep supports emergency power-down without data loss.

Avionics Display Memory Test & Measurement Equipment Cache

Use Scenario: Storing rendered GUI layers and overlay metadata in certified cockpit display units operating under DO-254.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM with ECC for non-volatile display state retention during power cycling.

Use Value: Industrial temperature rating (–40°C to +85°C) and 1.0 V data retention meet airborne environmental specs; ERR pin optional for fault reporting.

Use Scenario: Capturing high-speed waveform samples in digital oscilloscopes and logic analyzers with burst-trigger capability.

IC Role / Device Role / Timing Role: Dual-port-capable buffer (via CE/OE/WE sequencing) enabling simultaneous capture and readout.

Use Value: Asynchronous operation avoids clock domain crossing; 44-pin TSOP II footprint allows dense PCB layout in 1U rack instruments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability asynchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C34098B-10TIN No embedded ECC; 10 ns access at 3.3 V; 25 µA standby (no deep-sleep mode); 44-pin TSOP II. Lacks hardware ECC and deep-sleep - requires external error handling and higher power budget. Select only if ECC is managed in FPGA or host processor and power budget permits >10× higher sleep current.
IS61WV25616EDBLL-10MLI 10 ns access; 15 µA deep-sleep; no ECC; 48-pin TSOPII; supports 2.5 V/3.3 V only. Same low-power profile but no error correction - unsuitable for safety-critical data integrity paths. Choose when cost sensitivity outweighs ECC requirement and board layout accommodates 48-pin footprint.

Compared with AS7C34098B-10TIN and IS61WV25616EDBLL-10MLI, CY7S1041G30-10ZSXI uniquely integrates ECC and PowerSnooze™ in a 44-pin TSOP II package - delivering verified single-bit error resilience and industry-leading 15 µA retention current without footprint or voltage-range compromise.

Availability

CY7S1041G30-10ZSXI is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging frame storage, and avionics display memory requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY7S1041G30-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with ISO 9001 and IATF 16949 certification.

CY7S1041G30-10ZSXI belongs to Infineon's PowerSnooze™ SRAM product line, engineered for high-reliability embedded systems where deterministic timing, ultra-low power retention, and hardware ECC are mandatory - not optional.

FAQ

Does CY7S1041G30-10ZSXI support automatic error correction write-back?

No. The embedded ECC detects and corrects single-bit errors during read operations only. Corrected data remains in the sense amplifier but is not automatically written back to the memory array. Host firmware must initiate a write cycle if persistent correction is required. This behavior is explicitly documented in Note 1 of the datasheet.

What is the function of the /DS pin, and how does it differ from /CE standby?

The /DS (Deep-Sleep) pin places the device into a 15 µA retention state where only the memory array and minimal retention circuitry remain powered. In contrast, /CE high enables standby mode (ISB2 = 6 mA), where core logic remains active and wake-up is immediate. /DS requires deassertion (HIGH) to exit retention, adding ~100 ns wake-up latency versus /CE-based wake-up.

Is the ERR pin present on CY7S1041G30-10ZSXI?

No. The ERR pin is only available on parts with "E" in the ordering code (e.g., CY7S1041GE). CY7S1041G30-10ZSXI lacks the ERR output; error indication is not externally signaled. This is confirmed in the Logic Block Diagram (Page 3) and Ordering Information section of the datasheet.

Can CY7S1041G30-10ZSXI operate at 1.8 V?

No. CY7S1041G30-10ZSXI is the 2.2–3.6 V speed grade (indicated by "30" in the part number). It is not characterized or guaranteed for operation at 1.8 V. For 1.65–2.2 V operation, the CY7S1041G18 variant must be used - mixing voltage grades risks timing violation or functional failure.

CY7S1041G30-10ZSXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY7S1041G30-10ZSXI FAQ

1.How can I place an order for CY7S1041G30-10ZSXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7S1041G30-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7S1041G30-10ZSXI reliable?

The price and inventory of CY7S1041G30-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1041G30-10ZSXI is usually 5 days.

3.What payment methods are accepted for CY7S1041G30-10ZSXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1041G30-10ZSXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7S1041G30-10ZSXI?

CY7S1041G30-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7S1041G30-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7S1041G30-10ZSXI?

For technical support, including CY7S1041G30-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1041G30-10ZSXI requirements.

6.How does Aetrix verify that CY7S1041G30-10ZSXI is sourced from the original manufacturer or authorized distributors?

All CY7S1041G30-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1041G30-10ZSXI meets industry standards.

7.What is the process for return or replacement of CY7S1041G30-10ZSXI?

All CY7S1041G30-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1041G30-10ZSXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7S1041G30-10ZSXI part is unused and in its original packaging.

Return procedure for CY7S1041G30-10ZSXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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