Infineon Technologies CY7S1049GE30-10VXIT
- Part No.:
- CY7S1049GE30-10VXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 36-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7S1049GE30-10VXIT.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 36SOJ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7S1049GE30-10VXIT from Cypress Semiconductor is a 4-Mbit (512K × 8) static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ ultra-low-power Deep-Sleep mode (IDS = 15 µA), 10 ns access time, and TTL-compatible I/O. It operates across 2.2 V–3.6 V supply, supports single-bit error detection/correction via dedicated ERR pin, and targets high-reliability industrial memory buffering in programmable logic controllers and network edge nodes.
For engineers reviewing the CY7S1049GE30-10VXIT datasheet, CY7S1049GE30-10VXIT pinout, CY7S1049GE30-10VXIT application, or CY7S1049GE30-10VXIT equivalent, this page delivers verified package mapping (44-pin TSOP II), ECC behavior under read/write cycles, Deep-Sleep activation timing, and voltage-range-specific current consumption - all critical for low-power SRAM selection in safety-aware embedded systems.
Technical Context
The CY7S1049GE30-10VXIT implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors in real time during read operations, with ERR pin assertion indicating correction event. Its PowerSnooze™ architecture enables transition to Deep-Sleep mode (15 µA) when DS is pulled LOW, retaining data at 1.0 V while disabling address/data paths and internal clocks.
It supports three VCC ranges: 2.2–3.6 V (10 ns speed grade), 1.65–2.2 V (15 ns), and 4.5–5.5 V (10 ns). This specific variant is rated for 10 ns tAA at 2.2–3.6 V, with typical active current of 38 mA and standby current of 6 mA under CMOS input conditions, making it suitable for burst-access, intermittent-operation applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 4 Mbit (512K words × 8 bits) - provides byte-wide data interface compatible with 8-bit microcontrollers and FPGA glue logic. |
| Access time (tAA) | 10 ns at VCC = 2.2–3.6 V - enables direct interfacing with 100 MHz bus systems without wait states. |
| Deep-Sleep current (IDS) | 15 µA - allows >1-year battery-backed retention in remote sensor nodes powered by coin cells. |
| ECC capability | Single-bit error detection and correction per 8-bit word - reduces uncorrectable error rate to <0.1 FIT/Mb for mission-critical storage. |
| ERR pin function | Dedicated open-drain output asserting LOW on corrected single-bit error - enables firmware logging without polling overhead. |
| Supply voltage range | 2.2 V to 3.6 V - matches standard 3.3 V system rails and supports brown-out tolerant operation down to 2.2 V. |
| Data retention voltage | 1.0 V - permits extended retention during power-loss events with minimal backup capacitance. |
Pinout & Package
This device is packaged in a 44-pin Thin Small Outline Package Type II (TSOP II), 400-mil body width, lead-free finish, with 0.8 mm pitch and standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| /CE | Chip Enable (active LOW) | Primary device select; disables all internal operations including ECC logic when HIGH. |
| /OE | Output Enable (active LOW) | Controls I/O drivers only; allows read data output without affecting ECC status or memory state. |
| /WE | Write Enable (active LOW) | Enables write cycle; must be LOW with /CE LOW and valid address/data to store 8-bit word. |
| DS | Deep-Sleep input | Assert LOW to enter 15 µA retention mode; deassert HIGH to resume full operation within tDSR (max 100 µs). |
| ERR | Error indication output | Open-drain output pulsed LOW for one clock cycle upon successful single-bit correction; requires external pull-up. |
| A0–A18 | Address inputs | 19-bit address bus supporting 512K-word addressing; A18 selects upper/lower half of memory array. |
| I/O0–I/O7 | Bidirectional data bus | 8-bit TTL-compatible data path; high-impedance when /CE or /OE are HIGH. |
| VCC, VSS | Power and ground | Separate VCC pins (pins 11 & 34) reduce noise coupling; dual VSS (pins 12 & 33) improve return path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | Hardware-accelerated single-bit correction per 8-bit word eliminates need for software ECC routines and associated CPU overhead. |
| PowerSnooze™ Deep-Sleep | 15 µA retention current with 1.0 V minimum VCC enables >10-year shelf life in battery-backed modules without refresh circuitry. |
| TTL-compatible I/O | Direct interface with legacy 3.3 V or 5 V microcontrollers and FPGAs without level-shifting components. |
| Multi-voltage support | Single part supports 2.2–3.6 V, 1.65–2.2 V, and 4.5–5.5 V rails - simplifies BOM across product variants and voltage-scaling designs. |
| ERR pin signaling | Asynchronous, pulse-width-controlled error notification allows deterministic firmware response without bus arbitration delays. |
Applications
| Industrial PLC Data Buffering | Medical Diagnostic Imaging Cache |
|---|---|
|
Use Scenario: Storing real-time sensor fusion data and control command history in modular PLC backplanes with intermittent power cycling. IC Role / Device Role / Timing Role: Byte-addressable SRAM buffer with ECC-protected storage for deterministic scan-cycle data integrity. Use Value: Prevents silent data corruption in 24/7 automation systems; ERR pin triggers diagnostic log entry before corrupted data propagates to HMI. |
Use Scenario: Temporary frame storage between ultrasound transducer acquisition and GPU-based beamforming in portable imaging devices. IC Role / Device Role / Timing Role: Low-latency, low-power memory buffer enabling burst-mode acquisition with zero-error tolerance. Use Value: 10 ns access ensures no pipeline stall during 100+ MB/s raw echo data transfer; Deep-Sleep cuts idle power by 99.9% between scans. |
| Avionics Flight Data Recorder Buffer | Smart Grid Substation RTU Memory |
|
Use Scenario: Capturing high-frequency telemetry streams during transient flight events where power interruption may occur. IC Role / Device Role / Timing Role: Retentive SRAM with 1.0 V data hold supporting capacitor-backed operation during 200 ms brownouts. Use Value: Eliminates need for external backup batteries or supercapacitor management ICs; ECC meets DO-254 Class C reliability requirements. |
Use Scenario: Storing time-synchronized phasor measurement unit (PMU) outputs in utility substations exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Industrial-grade SRAM operating from –40 °C to +85 °C with guaranteed ECC functionality across full range. Use Value: Reduces uncorrectable error probability below IEEE C37.118.2 thresholds; 6 mA standby current extends UPS runtime during grid outages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC-enabled SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV5128BLL-10MLI | No embedded ECC; requires external error-handling logic; 10 ns access, 3.3 V only; 32-pin SOJ package. | Lacks hardware error correction - increases firmware complexity and CPU load for safety-critical reads. | Select only if ECC is implemented in host processor and board space constraints favor SOJ over TSOP II. |
| AS6C4008-10TIN | 4-Mbit SRAM with 10 ns access but no ECC; 5 V tolerant; 32-pin SOJ; IDS = 1 µA (lower than CY7S1049GE but no error protection). | Lower Deep-Sleep current but zero fault tolerance - unsuitable for applications requiring FIT < 0.1/Mb. | Choose only for non-safety-critical, cost-sensitive consumer applications where ECC is unnecessary. |
Compared with IS61WV5128BLL-10MLI and AS6C4008-10TIN, the CY7S1049GE30-10VXIT uniquely integrates ECC and PowerSnooze™ in a single 44-pin TSOP II package, delivering both functional safety and ultra-low-power retention - eliminating trade-offs between reliability and energy efficiency in industrial edge nodes.
Availability
CY7S1049GE30-10VXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical diagnostic imaging cache, avionics flight data recorder buffer, and smart grid substation RTU memory requiring stable component supply across extended temperature and voltage ranges.
Supply support for CY7S1049GE30-10VXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable system-on-chip solutions for industrial, automotive, and communications infrastructure markets.
The CY7S1049G/E series was developed specifically for mission-critical embedded systems requiring simultaneous low-power operation, deterministic timing, and hardware-level data integrity - targeting applications where software ECC is impractical or insufficient.
FAQ
Does the ERR pin indicate both detection and correction events?
Yes - the ERR pin asserts LOW for one clock cycle whenever the internal ECC logic detects and corrects a single-bit error in the accessed 8-bit word. It does not assert for multi-bit errors or uncorrectable events. The pulse width is synchronized to the read access timing and is independent of host bus speed.
What is the maximum time required to exit Deep-Sleep mode?
The maximum Deep-Sleep recovery time (tDSR) is 100 µs after DS is deasserted HIGH. During this interval, the device remains in high-impedance state and ignores address/data inputs. No external reset or initialization sequence is required beyond waiting tDSR before issuing first CE/OE assertion.
Can the CY7S1049GE30-10VXIT operate reliably at 2.2 V with 10 ns access time?
Yes - the "30" in the part number denotes the 2.2–3.6 V voltage range with 10 ns access time specification. At VCC = 2.2 V, tAA is guaranteed ≤10 ns across –40 °C to +85 °C, with ICC = 38 mA typical and ISB2 = 6 mA typical under CMOS input conditions, as confirmed in the official datasheet Rev. *F.
Is the ERR pin open-drain, and what pull-up value is recommended?
Yes - ERR is an open-drain output requiring an external pull-up resistor. Cypress recommends a 4.7 kΩ resistor to VCC (same rail as I/O) for reliable signal rise time and noise immunity. Lower values increase current draw; higher values risk slow edges in noisy environments or long trace layouts.
CY7S1049GE30-10VXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 36-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-SOJ
CY7S1049GE30-10VXIT FAQ
1.How can I place an order for CY7S1049GE30-10VXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7S1049GE30-10VXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7S1049GE30-10VXIT reliable?
The price and inventory of CY7S1049GE30-10VXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1049GE30-10VXIT is usually 5 days.
3.What payment methods are accepted for CY7S1049GE30-10VXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1049GE30-10VXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7S1049GE30-10VXIT?
CY7S1049GE30-10VXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7S1049GE30-10VXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7S1049GE30-10VXIT?
For technical support, including CY7S1049GE30-10VXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1049GE30-10VXIT requirements.
6.How does Aetrix verify that CY7S1049GE30-10VXIT is sourced from the original manufacturer or authorized distributors?
All CY7S1049GE30-10VXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1049GE30-10VXIT meets industry standards.
7.What is the process for return or replacement of CY7S1049GE30-10VXIT?
All CY7S1049GE30-10VXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1049GE30-10VXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7S1049GE30-10VXIT part is unused and in its original packaging.
Return procedure for CY7S1049GE30-10VXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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