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Infineon Technologies CY7S1061G30-10BVXI

Part No.:
CY7S1061G30-10BVXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7S1061G30-10BVXI.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,695

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Product details

Overview

CY7S1061G30-10BVXI from Infineon Technologies (formerly Cypress) is a 16-Mbit (1 M × 16) CMOS static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ deep-sleep mode, and TTL-compatible I/O. It delivers 10 ns access time at 2.2–3.6 V, supports byte-level writes via BHE/ BLE, and features an ERR pin for single-bit error detection/correction - deployed in industrial control modules requiring high-reliability data retention.

For engineers reviewing the CY7S1061G30-10BVXI datasheet, CY7S1061G30-10BVXI pinout, CY7S1061G30-10BVXI application, or CY7S1061G30-10BVXI equivalent, this page provides verified package mapping (48-ball VFBGA), ECC behavior, Deep Sleep current (≤22 µA), voltage range (2.2–3.6 V), and functional pin roles - all confirmed against Infineon's official Rev. *N datasheet (001-79707).

Technical Context

This SRAM implements a synchronous, non-volatile-retention memory architecture with dual chip enable logic (CE1/CE2) and independent byte write control. Its ECC engine operates transparently during read cycles, correcting single-bit errors without CPU intervention and asserting the ERR pin to signal correction events.

The PowerSnooze™ feature enables hardware-controlled transition into Deep Sleep mode via the DS pin, reducing current to ≤22 µA while retaining data at 1.0 V. All I/Os enter high-impedance state when CE is deasserted or OE/BLE/BHE are inactive, ensuring clean bus isolation in multi-device systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16 bits) - supports full-word or byte-accessed storage for real-time firmware buffers.
Access Time (tAA) 10 ns at 2.2–3.6 V - enables direct interfacing with 100 MHz microcontrollers without wait states.
Deep Sleep Current (IDS) ≤22 µA - allows battery-backed operation for >1 year in low-duty-cycle industrial logging applications.
ECC Function Single-bit error detection and correction per read cycle - eliminates soft-error-induced data corruption in radiation-prone environments.
Supply Voltage Range 2.2 V to 3.6 V - compatible with modern 3.3 V system rails and mixed-voltage FPGA interfaces.
ERR Pin Behavior Active-HIGH pulse on corrected read - provides deterministic interrupt signaling to host processor without polling overhead.
Package 48-ball VFBGA (6 × 8 × 1.0 mm) - enables high-density PCB layouts in space-constrained edge controllers.

Pinout & Package

Package: 48-ball VFBGA (6 × 8 × 1.0 mm), RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus supporting full 1 M-word addressing; A16–A19 are NC in 48-ball variant per datasheet Figure 1.
I/O0–I/O15 Bi-directional Data Bus 16-bit parallel interface; supports simultaneous full-word or split-byte (via BHE/ BLE) reads/writes.
WE Write Enable Active-LOW control: initiates write cycle when CE and OE are valid; latches data on falling edge.
OE Output Enable Active-LOW control: enables output drivers only during read cycles; prevents bus contention.
CE / CE1 & CE2 Chip Enable Single CE (pin 3) or dual CE1/CE2 (pins 36 & 35 in TSOP II); logical AND determines device selection.
BHE / BLE Byte Enable BHE controls I/O8–I/O15; BLE controls I/O0–I/O7 - enables 8-bit peripheral interfacing without glue logic.
DS Deep Sleep Control Active-LOW input: forces device into 22-µA retention mode; retains data at 1.0 V with no clock required.
ERR Error Indication Open-drain output asserted HIGH for 1–2 ns after single-bit correction - triggers MCU NMI or GPIO interrupt.
VCC / VSS Power / Ground Dual VCC pins (B1, C1) and three VSS balls (A2, D1, H1) ensure low-impedance supply routing and noise immunity.

Key Features

Feature Design Value
Embedded ECC Logic Corrects single-bit errors on every read without software overhead or memory bandwidth penalty.
PowerSnooze™ Deep Sleep Hardware-triggered 22-µA retention mode with 1.0 V data hold - eliminates external backup batteries.
TTL-Compatible I/O Direct interface with legacy 3.3 V/5 V microcontrollers and FPGAs without level-shifting circuitry.
Byte Write Control Independent BHE/ BLE signals allow 8-bit peripheral coexistence on same data bus - reduces PCB layer count.
ERR Pin Assertion Deterministic, sub-ns timing pulse confirms correction event - enables traceable fault logging in safety-critical logs.

Applications

Industrial PLC Data Buffer Railway Signaling Event Logger

Use Scenario: Storing real-time sensor inputs and control commands in programmable logic controllers operating in uncontrolled ambient conditions.

IC Role / Device Role / Timing Role: Primary volatile data buffer with ECC-protected scratchpad memory for cyclic process data exchange.

Use Value: Prevents undetected memory corruption from EMI in factory-floor environments; Deep Sleep extends uptime during brownouts.

Use Scenario: Capturing timestamped failure events in train signaling interlock systems where data integrity is mandated by EN 5012x standards.

IC Role / Device Role / Timing Role: Fault-tolerant event recorder with deterministic ERR signaling for audit-trail generation.

Use Value: Single-bit error correction ensures log validity over 15+ year service life; 10 ns access meets hard real-time response deadlines.

Medical Diagnostic Imaging Cache Avionics Flight Data Recorder Buffer

Use Scenario: Temporary storage of raw image frames from ultrasound transducers before compression and transfer to flash storage.

IC Role / Device Role / Timing Role: High-speed frame buffer with ECC-enabled integrity checking prior to lossy encoding.

Use Value: Eliminates silent pixel corruption in grayscale medical images; 2.2–3.6 V range matches portable device battery discharge profile.

Use Scenario: Intermediate buffering of flight parameter streams (AOA, G-load, engine RPM) before segmented write to non-volatile memory.

IC Role / Device Role / Timing Role: Radiation-hardened interim memory with error visibility for DO-178C traceability.

Use Value: ERR pin provides hardware-verified evidence of memory health for certification audits; VFBGA package withstands vibration stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM with ECC and low-power sleep applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C316098B-10BIN No integrated ECC; requires external error-handling logic; 10 ns access at 3.3 V only. Lacks hardware error reporting; unsuitable for safety-certified systems requiring autonomous correction. Select only if ECC is implemented in FPGA fabric and board space permits additional logic.
IS61WV102416BLL-10MLI Includes ECC but no Deep Sleep mode; ISB2 = 35 µA vs. CY7S1061G30-10BVXI's 20 µA standby and 22 µA deep sleep. Higher baseline power prevents use in battery-harvested remote sensors with multi-year duty cycles. Prefer when continuous operation dominates and ECC suffices without ultra-low quiescent current.

Compared with AS7C316098B-10BIN and IS61WV102416BLL-10MLI, CY7S1061G30-10BVXI uniquely combines on-die ECC correction, sub-25 µA Deep Sleep, and 10 ns access across 2.2–3.6 V - enabling certified, battery-constrained, high-integrity data buffering unattainable with either alternative.

Availability

CY7S1061G30-10BVXI is available at Aetrix Electronics and suitable for industrial PLC data buffers, railway signaling event loggers, and medical diagnostic imaging caches requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY7S1061G30-10BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with ISO 9001 and IATF 16949 certification.

CY7S1061G30-10BVXI belongs to Infineon's PowerSnooze™ SRAM product line, engineered for mission-critical embedded systems demanding concurrent high speed, ultra-low power, and hardware-enforced data integrity.

FAQ

Does CY7S1061G30-10BVXI support automatic error correction without host intervention?

Yes. The device performs single-bit error detection and correction autonomously during every read cycle. The embedded ECC logic operates transparently - no firmware driver, configuration register access, or timing adjustment is required. Correction occurs within the 10 ns access window, and the ERR pin pulses to notify the host only upon successful correction.

What is the minimum VCC required to retain data in Deep Sleep mode?

Data retention is guaranteed down to 1.0 V in Deep Sleep mode, as specified in the datasheet's Data Retention Characteristics table (page 9). This allows operation from depleted batteries or capacitor-based backup supplies without data loss, provided the DS pin remains LOW and ambient temperature stays within –40 °C to +85 °C.

Can the ERR pin be disabled or configured as a general-purpose I/O?

No. The ERR pin is a dedicated open-drain output with fixed functionality. It cannot be disabled, reconfigured, or used as a bidirectional I/O. Its sole purpose is to indicate single-bit correction events; it asserts HIGH for 1–2 ns after correction and remains LOW otherwise. No internal register controls this behavior.

Is the 48-ball VFBGA package of CY7S1061G30-10BVXI compatible with standard reflow profiles?

Yes. The part complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard Pb-free reflow profiles (peak temperature 260 °C, 60-second duration above 217 °C). The 1.0 mm height and 0.5 mm ball pitch are compatible with Class 7 automated placement and AOI inspection systems.

CY7S1061G30-10BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7S1061G30-10BVXI FAQ

1.How can I place an order for CY7S1061G30-10BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7S1061G30-10BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7S1061G30-10BVXI reliable?

The price and inventory of CY7S1061G30-10BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1061G30-10BVXI is usually 5 days.

3.What payment methods are accepted for CY7S1061G30-10BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1061G30-10BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7S1061G30-10BVXI?

CY7S1061G30-10BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7S1061G30-10BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7S1061G30-10BVXI?

For technical support, including CY7S1061G30-10BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1061G30-10BVXI requirements.

6.How does Aetrix verify that CY7S1061G30-10BVXI is sourced from the original manufacturer or authorized distributors?

All CY7S1061G30-10BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1061G30-10BVXI meets industry standards.

7.What is the process for return or replacement of CY7S1061G30-10BVXI?

All CY7S1061G30-10BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1061G30-10BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7S1061G30-10BVXI part is unused and in its original packaging.

Return procedure for CY7S1061G30-10BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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