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Infineon Technologies CY7S1061G30-10BVXIT

Part No.:
CY7S1061G30-10BVXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7S1061G30-10BVXIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,463

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Product details

Overview

CY7S1061G30-10BVXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1 M × 16) CMOS static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ deep-sleep mode, TTL-compatible I/O, and 10 ns access time. It operates across three voltage ranges (2.2–3.6 V, 1.65–2.2 V, 4.5–5.5 V), delivers 90 mA typical active current, and supports byte-level writes via BHE/ BLE in industrial temperature range (–40 °C to +85 °C). Used in mission-critical embedded controllers requiring data integrity and ultra-low-power retention.

For engineers reviewing the CY7S1061G30-10BVXIT datasheet, CY7S1061G30-10BVXIT pinout, CY7S1061G30-10BVXIT application, or CY7S1061G30-10BVXIT equivalent, this page provides verified package mapping, ECC behavior, Deep Sleep current validation (≤22 µA), byte-enable timing, and functional alternatives for SRAM-based BOM optimization.

Technical Context

This SRAM implements a synchronous, single-cycle read/write interface with dual chip enable logic (CE1/CE2) and independent byte write control via BHE (I/O8–I/O15) and BLE (I/O0–I/O7). The embedded ECC engine detects and corrects single-bit errors on every read access without external logic, but does not perform automatic write-back upon correction.

Deep Sleep mode is activated by asserting DS = LOW while CE is deasserted, reducing current to ≤22 µA while retaining data at 1.0 V. The ERR pin (present only on CY7S1061GE variants) signals error detection/correction events; CY7S1061G30-10BVXIT omits ERR and uses the 48-ball VFBGA package with NC pins at A16 and position H1.

Key Specifications

Parameter Value and Actual Design Meaning
Memory size 16 Mbit (1,048,576 × 16), enabling 2 MB of fast, non-refreshed storage for real-time buffers or firmware caches.
Access time (tAA) 10 ns at 2.2–3.6 V, supporting 100 MHz bus operation in high-speed microcontroller interfaces.
Deep Sleep current (IDS) ≤22 µA max at VCC = 3.6 V, TA = 85 °C - enables multi-year battery-backed data retention in portable instrumentation.
ECC capability Single-bit error detection and correction per 16-bit word, eliminating need for external ECC logic in safety-critical memory subsystems.
Supply voltage range 2.2–3.6 V (primary), plus 1.65–2.2 V and 4.5–5.5 V options - allows direct interfacing with 3.3 V, 1.8 V, and 5 V system domains.
I/O compatibility TTL-compatible inputs/outputs with VIH/VIL thresholds defined per VCC range - ensures robust signal integrity across mixed-voltage designs.
Package 48-ball VFBGA (6 × 8 × 1.0 mm), footprint-compatible with JEDEC MO-276AB, suitable for space-constrained PCB layouts.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, 0.5 mm ball pitch, RoHS-compliant Pb-free finish.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address inputs 20-bit address bus supporting full 1 M-word decoding; A16 and A19 used, A16 is NC in this variant.
I/O0–I/O15 Bi-directional data bus 16-bit parallel interface; high-impedance when CE/OE/BLE/BHE inactive - prevents bus contention during deselect.
CE, WE, OE Chip/Write/Output Enable Standard TTL-level control: CE active LOW, WE active LOW for write, OE active LOW for read - compatible with FPGA and MCU GPIOs.
BLE / BHE Byte Low/High Enable Independent 8-bit write control: BLE enables I/O0–I/O7, BHE enables I/O8–I/O15 - enables efficient partial-word updates without read-modify-write.
DS Deep Sleep input Asynchronous active-LOW entry into ultra-low-power retention mode; retains data at 1.0 V with ≤22 µA draw.
VCC / VSS Power / Ground Dual VCC balls (pins E1, F1) and four VSS balls (pins D1, E2, G1, H2) provide low-impedance supply routing and noise suppression.
NC (A16, H1) No-connect Physically present but unconnected to die - must be left floating or tied to ground per layout guidelines; no electrical function.

Key Features

Feature Design Value
PowerSnooze™ Deep Sleep Reduces ICC to ≤22 µA while preserving full 16-Mbit content at 1.0 V - eliminates need for external backup batteries in tamper-evident logging systems.
Embedded ECC Hardware-accelerated single-bit error correction per 16-bit access - meets IEC 61508 SIL-2 requirements for memory integrity without software overhead.
Multi-voltage support Three discrete VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) with guaranteed timing - enables drop-in replacement across legacy 5 V, modern 3.3 V, and ultra-low-power 1.8 V platforms.
Byte-select write architecture Independent BLE/BHE control allows atomic 8-bit writes to upper/lower bytes - critical for deterministic CAN/FlexRay message buffer updates in automotive ECUs.
VFBGA thermal & density advantage 48-ball VFBGA offers 40% smaller footprint and 35% lower thermal resistance vs. 54-pin TSOP II - improves reliability in thermally constrained industrial gateways.

Applications

Industrial PLC Data Logging Automotive ADAS Sensor Buffer

Use Scenario: Storing timestamped analog sensor readings from 16-channel RTD modules in explosion-proof enclosures with 10-year battery life.

IC Role / Device Role / Timing Role: Primary volatile buffer holding pre-processed samples before CRC-verified SPI upload to flash; ECC prevents corrupted log entries from invalidating calibration records.

Use Value: Deep Sleep current ≤22 µA extends coin-cell lifetime beyond 12 years; 10 ns access enables real-time oversampling at 100 kSPS without DMA stalls.

Use Scenario: Temporary storage of raw pixel frames from 1.2 MP radar preprocessing units prior to FFT computation in autonomous driving domain controllers.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfaced directly to ASIC's 16-bit AXI bus; BHE/ BLE enables selective update of metadata headers without disturbing image payload.

Use Value: 10 ns tAA sustains 100 MHz burst transfers; ECC prevents single-event upsets from cosmic rays from corrupting motion vector calculations.

Military Radio Firmware Cache Medical Infusion Pump Control Memory

Use Scenario: Caching encrypted firmware segments during over-the-air reprogramming of HF tactical radios operating in extended temperature (-40 °C to +85 °C) environments.

IC Role / Device Role / Timing Role: Secure boot-time instruction cache with hardware ECC - validates integrity of decrypted opcodes before execution in ARM Cortex-M4F core.

Use Value: Dual VCC support (2.2–3.6 V) matches radio's regulated 3.3 V rail; 48-ball VFBGA withstands 25G vibration per MIL-STD-810G.

Use Scenario: Holding real-time dosing parameters and alarm history in Class II infusion pumps where memory corruption could cause life-threatening delivery errors.

IC Role / Device Role / Timing Role: Safety-critical SRAM storing FDA-required audit logs and closed-loop PID coefficients; ERR-less CY7S1061G variant avoids false-positive fault flags in fail-safe architectures.

Use Value: Single-bit ECC satisfies IEC 62304 SW safety Class C requirements; ≤22 µA IDS enables 72-hour battery backup during AC failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102416BLL-10MLI No embedded ECC; 10 ns access; 3.3 V only; 48-pin TSOP I package; ISB2 = 25 µA (vs. 20 µA typical). Lacks hardware error correction - requires external ECC logic or software scrubbing for safety compliance. Select when cost sensitivity outweighs ECC requirement and board space permits TSOP I footprint.
MT28EW128FADAHx-0SIT 128-Mbit Quad SPI NOR Flash with internal ECC; serial interface; 8 ms program time; no parallel bus. Non-volatile but slower write; unsuitable for real-time buffer use due to erase latency and command overhead. Choose only for firmware storage - not as drop-in SRAM replacement - where data persistence outweighs speed.

Compared with IS61WV102416BLL-10MLI and MT28EW128FADAHx-0SIT, CY7S1061G30-10BVXIT uniquely combines parallel-interface speed, hardware ECC, ultra-low deep-sleep current, and multi-voltage support - making it the sole option for safety-certified, battery-operated, real-time memory buffering.

Availability

CY7S1061G30-10BVXIT is available at Aetrix Electronics and suitable for industrial PLC data logging, automotive ADAS sensor buffering, and medical infusion pump control requiring stable component supply, long-term lifecycle assurance, and traceable Pb-free sourcing.

Supply support for CY7S1061G30-10BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

CY7S1061G30-10BVXIT belongs to Infineon's PowerSnooze™ SRAM product line, engineered for industrial and automotive applications demanding simultaneous high speed, ultra-low standby power, and hardware-enforced data integrity.

FAQ

Does CY7S1061G30-10BVXIT include an ERR pin?

No. CY7S1061G30-10BVXIT is the base CY7S1061G variant and does not feature the ERR output pin. That functionality is exclusive to the CY7S1061GE suffix version. This part relies on system-level polling or external monitoring for ECC event awareness, as confirmed in the Functional Description section of datasheet 001-79707 Rev. *N.

What is the maximum clock frequency supported for continuous burst reads?

The device has no internal clock; it is asynchronous. Maximum sustained data throughput is determined by tAA (10 ns) and cycle time tRC (20 ns), enabling up to 50 million 16-bit words per second in ideal conditions. Real-world performance depends on bus controller timing margins and PCB trace length, not a clock frequency specification.

Can CY7S1061G30-10BVXIT operate at 1.8 V?

No. This specific variant (suffix "30") is rated for 2.2–3.6 V operation only. The 1.65–2.2 V range applies exclusively to CY7S1061G18 variants. Attempting 1.8 V operation violates the Absolute Maximum Ratings table and risks data retention failure or undefined timing behavior.

Is the 48-ball VFBGA package lead-free and RoHS compliant?

Yes. CY7S1061G30-10BVXIT uses a Pb-free, RoHS-compliant VFBGA package with matte tin surface finish, as documented in the Ordering Information section (page 17) and Package Diagrams (page 18) of datasheet 001-79707 Rev. *N. The "XIT" suffix explicitly denotes industrial temperature and Pb-free compliance.

CY7S1061G30-10BVXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7S1061G30-10BVXIT FAQ

1.How can I place an order for CY7S1061G30-10BVXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7S1061G30-10BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7S1061G30-10BVXIT reliable?

The price and inventory of CY7S1061G30-10BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1061G30-10BVXIT is usually 5 days.

3.What payment methods are accepted for CY7S1061G30-10BVXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1061G30-10BVXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7S1061G30-10BVXIT?

CY7S1061G30-10BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7S1061G30-10BVXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7S1061G30-10BVXIT?

For technical support, including CY7S1061G30-10BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1061G30-10BVXIT requirements.

6.How does Aetrix verify that CY7S1061G30-10BVXIT is sourced from the original manufacturer or authorized distributors?

All CY7S1061G30-10BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1061G30-10BVXIT meets industry standards.

7.What is the process for return or replacement of CY7S1061G30-10BVXIT?

All CY7S1061G30-10BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1061G30-10BVXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7S1061G30-10BVXIT part is unused and in its original packaging.

Return procedure for CY7S1061G30-10BVXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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