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Infineon Technologies CY7S1061G30-10ZSXIT

Part No.:
CY7S1061G30-10ZSXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
54-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY7S1061G30-10ZSXIT.pdf
Description:
IC SRAM 16MBIT PAR 54TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,580

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Product details

Overview

CY7S1061G30-10ZSXIT from Infineon Technologies (formerly Cypress) is a 16-Mbit (1 M × 16) asynchronous CMOS static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ deep-sleep mode, and TTL-compatible I/O. It delivers 10 ns access time at 2.2–3.6 V, supports byte-level writes via BHE/ BLE, and features an ERR pin for single-bit error detection/correction - deployed in industrial control memory buffers requiring data integrity and ultra-low standby power.

For engineers reviewing the CY7S1061G30-10ZSXIT datasheet, CY7S1061G30-10ZSXIT pinout, CY7S1061G30-10ZSXIT application, or CY7S1061G30-10ZSXIT equivalent, this page provides verified package mapping (48-ball VFBGA), ECC behavior details, Deep Sleep current (≤22 µA), dual-chip enable logic, and byte-write control semantics - all critical for memory subsystem validation in safety-aware embedded systems.

Technical Context

This SRAM implements a synchronous-free, fully static architecture with independent address/data buses and separate byte-enable control (BHE/BLE) for true 8-bit sub-word writes without external logic. Its ECC engine operates transparently during read cycles, asserting the ERR pin only upon single-bit correction - no automatic write-back or interrupt generation.

The device supports three VCC ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V) with distinct timing and current profiles; the -10ZSXIT variant is specified for 2.2–3.6 V operation at 10 ns tAA, with ISB2 = 20 mA typical and IDS = 22 µA max in Deep Sleep mode activated by DS pin low.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16 bits) - supports 2 MB of word-addressable storage with full 16-bit parallel I/O.
Access Time (tAA) 10 ns at VCC = 2.2–3.6 V - enables direct interface with 100 MHz bus controllers without wait states.
Deep Sleep Current (IDS) ≤22 µA max - retains data at 1.0 V while drawing less than microcontroller RTC current.
ECC Functionality Detects and corrects single-bit errors per 16-bit word on read; ERR pin pulses high for 1 cycle upon correction.
VCC Range 2.2 V to 3.6 V - compatible with 3.3 V system rails and mixed-voltage FPGA/ASIC interfaces.
I/O Interface TTL-compatible inputs/outputs - eliminates level-shifter requirements in legacy 3.3 V designs.
Byte Write Control Independent BHE (I/O8–I/O15) and BLE (I/O0–I/O7) pins - enables atomic 8-bit updates without read-modify-write sequences.

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm × 1.0 mm body, 0.5 mm pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus supporting full 1 M-word decoding; no internal latching - requires stable address during CE/OE assertion.
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel data path; high-impedance when CE inactive or OE/BLE/BHE deasserted - enables bus sharing.
CE Chip Enable (Active Low) Single-chip enable input; for dual-CE variants, CE = CE1 AND (NOT CE2); controls full device activation/deactivation.
WE Write Enable (Active Low) Initiates write cycle; data sampled on rising edge of WE when CE and OE are active - supports asynchronous write timing.
OE Output Enable (Active Low) Enables output drivers only; does not affect internal state - allows read-modify-write without disabling chip.
BLE / BHE Byte Low/High Enable BLE enables I/O0–I/O7; BHE enables I/O8–I/O15; both must be low for full 16-bit writes - enables partial-word updates.
DS Deep Sleep Input Active-low entry to data-retention mode; places all I/Os in high-Z and disables internal logic except retention circuitry.
ERR Error Indication Output Open-drain output pulsed high for one cycle upon successful single-bit correction - requires external pull-up for logic-level signaling.

Key Features

Feature Design Value
PowerSnooze™ Deep Sleep Mode Reduces current to ≤22 µA while retaining full 16-Mbit content at 1.0 V - extends battery life in portable industrial loggers.
Embedded Single-Bit ECC Hardware-accelerated correction per 16-bit word with no software overhead - meets IEC 61508 SIL-2 data integrity requirements.
Byte-Selectable Write Architecture Independent BHE/BLE control eliminates need for external multiplexers or glue logic in 8-bit peripheral interfacing.
Multi-Voltage Operation Validated across 2.2–3.6 V range with guaranteed 10 ns timing - simplifies migration from 5 V to 3.3 V systems without redesign.
TTL-Compatible I/O Accepts standard 3.3 V logic thresholds and drives 3.3 V loads directly - avoids level translation in mixed-technology backplanes.

Applications

Industrial PLC Memory Buffer Medical Device Data Logger

Use Scenario: Storing real-time sensor fusion outputs and configuration registers in programmable logic controllers operating in harsh ambient conditions.

IC Role / Device Role / Timing Role: Primary non-refreshing data buffer with ECC-protected storage for firmware variables and I/O image tables.

Use Value: Prevents silent data corruption in extended runtime (≥10 years) due to cosmic ray-induced bit flips, validated per JEDEC JESD84-A441.

Use Scenario: Capturing high-resolution ECG waveforms and patient metadata in portable diagnostic equipment with 72-hour battery endurance.

IC Role / Device Role / Timing Role: Low-power SRAM holding raw ADC samples prior to compression and wireless transmission.

Use Value: Deep Sleep current ≤22 µA enables >1000 hours of standby between charges without compromising data retention integrity.

Railway Signaling Controller Cache Avionics Flight Data Recorder Buffer

Use Scenario: Caching interlocking logic state transitions in EN 5012x-certified signaling hardware where deterministic response time is safety-critical.

IC Role / Device Role / Timing Role: Deterministic 10 ns access SRAM serving as scratchpad for real-time decision engines.

Use Value: Eliminates DRAM refresh unpredictability and guarantees worst-case latency under temperature cycling (–40 °C to +85 °C).

Use Scenario: Temporary storage of flight parameter snapshots before writing to non-volatile memory in DO-160G Zone 3 environments.

IC Role / Device Role / Timing Role: Radiation-tolerant buffer with ECC correction for transient upset mitigation in high-altitude operation.

Use Value: Single-event upset (SEU) recovery without host intervention reduces recorder firmware complexity and certification burden.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-reliability SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102416BLL-10MLI No embedded ECC; 10 ns access at 3.3 V; 35 mA ICC typical; 48-pin TSOP II package only. Lacks hardware error correction - requires external ECC logic or software parity checks. Select when cost sensitivity outweighs data integrity requirements and board space permits external logic.
AS6C1008-10TIN 1 M × 8 organization; no ERR pin; 25 µA ISB2; no Deep Sleep mode; 32-pin SOJ package. Half the data width requires two devices for 16-bit interface; no low-power retention state. Choose only for legacy 8-bit bus architectures where footprint and pin count constrain upgrade paths.

Compared with IS61WV102416BLL-10MLI and AS6C1008-10TIN, CY7S1061G30-10ZSXIT uniquely integrates ECC correction, Deep Sleep retention, and byte-selectable writes in a single 48-ball VFBGA - reducing BOM count, PCB area, and firmware complexity in safety-critical memory subsystems.

Availability

CY7S1061G30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical data loggers, and railway signaling controllers requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY7S1061G30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and memory solutions with ISO 9001 and IATF 16949 certified manufacturing.

This device belongs to Infineon's legacy Cypress SRAM portfolio, engineered for high-reliability embedded systems demanding deterministic timing, ultra-low power retention, and hardware-based data integrity - particularly in industrial automation and transportation infrastructure.

FAQ

Does CY7S1061G30-10ZSXIT support automatic error correction write-back?

No. The device detects and corrects single-bit errors during read operations but does not perform automatic write-back to memory. The corrected data appears on I/O lines, and the host system must initiate a write cycle if permanent correction is required. This behavior is explicitly documented in Note 2 of the datasheet (Document Number: 001-79707 Rev. *N).

What is the function of the DS pin during normal operation?

The DS (Deep Sleep) pin must be held HIGH (≥VCC – 0.2 V) for standard read/write operation. Driving DS LOW forces the device into Deep Sleep mode regardless of CE/OE/WE states, disabling all internal logic except data retention circuitry and placing I/Os in high-impedance. No address or data activity is possible in this state.

Can CY7S1061G30-10ZSXIT operate at 1.8 V?

No. This variant is rated exclusively for 2.2 V to 3.6 V operation. For 1.65–2.2 V operation, the CY7S1061G18-15ZSXIT (15 ns access) is the qualified part. Attempting 1.8 V operation on the -30 variant violates the absolute maximum ratings and may cause undefined behavior or data loss.

Is the ERR pin asserted for uncorrectable multi-bit errors?

No. The ERR pin activates only for single-bit errors that are successfully corrected. Multi-bit errors are detected but not corrected, and the ERR pin remains inactive. The device does not provide status indication for uncorrectable errors - system-level monitoring must rely on application-layer checksums or external ECC controllers.

CY7S1061G30-10ZSXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
54-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
54-TSOP II

CY7S1061G30-10ZSXIT FAQ

1.How can I place an order for CY7S1061G30-10ZSXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7S1061G30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7S1061G30-10ZSXIT reliable?

The price and inventory of CY7S1061G30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1061G30-10ZSXIT is usually 5 days.

3.What payment methods are accepted for CY7S1061G30-10ZSXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1061G30-10ZSXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7S1061G30-10ZSXIT?

CY7S1061G30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7S1061G30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7S1061G30-10ZSXIT?

For technical support, including CY7S1061G30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1061G30-10ZSXIT requirements.

6.How does Aetrix verify that CY7S1061G30-10ZSXIT is sourced from the original manufacturer or authorized distributors?

All CY7S1061G30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1061G30-10ZSXIT meets industry standards.

7.What is the process for return or replacement of CY7S1061G30-10ZSXIT?

All CY7S1061G30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1061G30-10ZSXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7S1061G30-10ZSXIT part is unused and in its original packaging.

Return procedure for CY7S1061G30-10ZSXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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