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Infineon Technologies CY7S1061GE30-10BVM

Part No.:
CY7S1061GE30-10BVM
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY7S1061GE30-10BVM.pdf
Description:
IC SRAM 16MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,319

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Product details

Overview

CY7S1061GE30-10BVM from Cypress Semiconductor is a military-grade 16-Mbit (1M × 16) CMOS static RAM with embedded Error Correcting Code (ECC), PowerSnooze™ deep-sleep mode (IDS ≤ 45 µA), 10 ns access time, and dual-voltage operation (2.2 V–3.6 V). It serves as high-reliability data buffer or scratchpad memory in avionics control units requiring single-bit error correction and extended temperature operation (–55 °C to +125 °C).

For engineers reviewing the CY7S1061GE30-10BVM datasheet, CY7S1061GE30-10BVM pinout, CY7S1061GE30-10BVM application, or CY7S1061GE30-10BVM equivalent, key selection criteria include ECC-enabled reliability, ultra-low deep-sleep current, TTL-compatible I/O, ERR pin signaling, and 48-ball VFBGA packaging for high-density military PCBs.

Technical Context

This SRAM implements a synchronous, byte-selectable memory architecture with independent BHE/ BLE controls for upper/lower 8-bit writes and reads. Its ECC logic operates transparently during read cycles, detecting and correcting single-bit errors in accessed locations without software intervention.

The device supports three distinct power modes: active (ICC = 90 mA typ), standby (ISB2 = 20 mA typ), and deep sleep (IDS = 45 µA max), triggered by the DS pin. Data retention is guaranteed at 1.0 V across –55 °C to +125 °C, enabling fail-safe operation during brownout conditions.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (1,048,576 × 16 bits) - supports full-word data buffering for real-time signal processing pipelines
Access Time (tAA) 10 ns - enables direct interfacing with 100 MHz bus systems without wait states
Deep Sleep Current (IDS) ≤ 45 µA - extends battery life in dormant phases of field-deployed telemetry modules
VCC Operating Range 2.2 V–3.6 V - compatible with modern low-voltage FPGA and DSP core supplies
ECC Functionality Single-bit error detection and correction per read cycle - eliminates uncorrectable memory corruption in radiation-prone environments
ERR Pin Output Active-HIGH assertion on corrected read - provides hardware-level fault logging without CPU polling
Data Retention Voltage 1.0 V - maintains stored state during partial power loss in mission-critical flight controllers

Pinout & Package

Package: 48-ball Very Fine Pitch Ball Grid Array (VFBGA), 6 × 8 mm, 1.0 mm height, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A19 Address Inputs 20-bit address bus supporting full 1M-word addressing; A16 and A17 are functional; A18/A19 used for bank selection in extended configurations
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; I/O0–I/O7 controlled by BLE, I/O8–I/O15 by BHE for byte-level granularity
CE, OE, WE Chip/Output/Write Enable Standard TTL-compatible control signals; CE active LOW enables memory access; OE/WE timing defines read/write windows
BHE, BLE Byte Enable Inputs Independent gating of upper/lower data bytes - enables 8-bit peripheral interfacing without external logic
DS Deep Sleep Input Asynchronous entry into ultra-low-power data retention mode; DS LOW disables all internal clocks and I/O drivers
ERR Error Indication Output Open-drain output pulsed HIGH during ECC correction event - directly interfaces with interrupt controllers or status LEDs
VCC, VSS Power Supply Pins Dual VCC balls (pins E1, F1) and multiple VSS balls (A1, H1, A8, H8) ensure low-impedance power delivery and noise immunity

Key Features

Feature Design Value
PowerSnooze™ Deep Sleep Mode Reduces current to ≤45 µA while retaining full memory contents - critical for battery-backed black-box recorders
Embedded Single-Bit ECC Hardware-accelerated error correction per read cycle - eliminates need for external ECC logic or software overhead
ERR Pin with Hardware Signaling Direct indication of corrected errors without CPU involvement - enables deterministic fault response in safety-critical firmware
Triple-Voltage Operation Support Valid operation across 2.2 V–3.6 V range - simplifies integration with mixed-supply SoCs and legacy 3.3 V systems
Military Temperature Range Guaranteed functionality from –55 °C to +125 °C - qualified for airborne, ground vehicle, and shipboard deployment

Applications

Avionics Flight Control Unit Tactical Radio Baseband Processor

Use Scenario: Real-time sensor fusion and actuator command buffering in fly-by-wire systems with strict DO-254 compliance requirements.

IC Role / Device Role / Timing Role: High-speed, ECC-protected scratchpad memory for intermediate computation results and control state storage.

Use Value: Prevents latent bit flips from cosmic radiation, ensuring deterministic behavior during extended missions without periodic memory scrubbing.

Use Scenario: Storing encrypted voice frames and protocol stack buffers in manpack radios operating in extreme desert or arctic environments.

IC Role / Device Role / Timing Role: Low-power, wide-temperature SRAM for volatile packet buffers and cryptographic key caches.

Use Value: Deep-sleep mode extends battery runtime between transmissions while preserving secure session context across duty cycles.

Missile Guidance Onboard Computer Naval Sonar Signal Processor

Use Scenario: Storing inertial measurement unit (IMU) calibration coefficients and navigation state vectors during powered flight phases.

IC Role / Device Role / Timing Role: Radiation-tolerant, ECC-enabled memory for mission-critical guidance parameters with zero tolerance for silent data corruption.

Use Value: ERR pin triggers immediate system-level fault reporting and safe-mode transition upon detected memory errors.

Use Scenario: Buffering time-domain acoustic samples prior to FFT-based beamforming in active sonar arrays.

IC Role / Device Role / Timing Role: High-bandwidth (10 ns), 16-bit-wide memory for streaming digitized hydrophone data at 10+ MSPS rates.

Use Value: Byte-enable pins allow selective update of metadata headers without disturbing raw sample buffers, reducing bus contention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM with ECC applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102416BLL-10TLI No embedded ECC; requires external error handling; 10 ns access, 3.3 V only; 48-pin TSOP-II package Lacks hardware error correction - unsuitable for safety-critical MIL-STD-810G deployments where bit errors must be transparently corrected Select only if ECC is implemented in FPGA logic and board space permits larger TSOP footprint
MT28EW128ABA1HPC-0SIT 128-Mbit Quad SPI NOR Flash with ECC; serial interface; 1.7–2.0 V supply; no parallel bus or ERR pin Non-volatile storage with slower random access; lacks real-time ERR signaling and byte-enable flexibility Choose for boot code storage with ECC, not for high-speed volatile working memory with deterministic error reporting

Compared with IS61WV102416BLL-10TLI and MT28EW128ABA1HPC-0SIT, the CY7S1061GE30-10BVM uniquely delivers parallel-interface speed, hardware ECC transparency, and an ERR pin - making it the sole option for MIL-PRF-38535 Class K systems requiring both performance and fault-aware memory operation.

Availability

CY7S1061GE30-10BVM is available at Aetrix Electronics and suitable for avionics flight control units, tactical radio baseband processors, and missile guidance onboard computers requiring stable component supply under extended temperature and radiation-exposed conditions.

Supply support for CY7S1061GE30-10BVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for aerospace, defense, and industrial markets, with emphasis on radiation-hardened and extended-temperature qualification.

The CY7S1061GE series targets military and space applications demanding ECC-enabled SRAM with ultra-low deep-sleep power and guaranteed operation from –55 °C to +125 °C - bridging the gap between commercial speed and mil-spec robustness.

FAQ

Does CY7S1061GE30-10BVM support automatic write-back after ECC correction?

No. The device detects and corrects single-bit errors during read operations but does not perform automatic write-back to the memory array. Corrected data is presented on the I/O bus, and any persistent correction requires external logic or firmware action. This behavior is explicitly documented in the datasheet footnote 2 and confirmed in AN89371.

What is the function of the DS pin during normal operation?

The DS (Deep Sleep) pin must be held HIGH (≥ VCC – 0.2 V) for normal read/write operation. When driven LOW, the device immediately enters deep-sleep mode: all outputs go high-impedance, internal clocks halt, and current drops to ≤45 µA while retaining data at 1.0 V. Recovery requires DS HIGH followed by tR (10 ns for VCC > 2.2 V) before valid access.

How does the ERR pin behave during uncorrectable multi-bit errors?

The ERR pin is asserted only for single-bit errors that are successfully corrected. It remains inactive (high-impedance or LOW depending on external pull) during multi-bit errors, which are undetected and uncorrected. The device provides no indication of uncorrectable errors - this limitation is inherent to standard Hamming-code ECC implementation and stated in the functional description.

Can CY7S1061GE30-10BVM operate with mixed voltage domains (e.g., 1.8 V I/O, 3.3 V core)?

No. The device uses a single VCC supply (2.2 V–3.6 V) for both core logic and I/O buffers. All inputs and outputs are TTL-compatible within the selected VCC range, and no separate VIO or multi-rail support is provided. Level-shifting circuitry is required when interfacing with 1.8 V controllers.

CY7S1061GE30-10BVM Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY7S1061GE30-10BVM FAQ

1.How can I place an order for CY7S1061GE30-10BVM through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7S1061GE30-10BVM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7S1061GE30-10BVM reliable?

The price and inventory of CY7S1061GE30-10BVM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7S1061GE30-10BVM is usually 5 days.

3.What payment methods are accepted for CY7S1061GE30-10BVM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7S1061GE30-10BVM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7S1061GE30-10BVM?

CY7S1061GE30-10BVM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7S1061GE30-10BVM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7S1061GE30-10BVM?

For technical support, including CY7S1061GE30-10BVM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7S1061GE30-10BVM requirements.

6.How does Aetrix verify that CY7S1061GE30-10BVM is sourced from the original manufacturer or authorized distributors?

All CY7S1061GE30-10BVM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7S1061GE30-10BVM meets industry standards.

7.What is the process for return or replacement of CY7S1061GE30-10BVM?

All CY7S1061GE30-10BVM units undergo pre-shipment inspection (PSI). If there is an issue with CY7S1061GE30-10BVM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7S1061GE30-10BVM part is unused and in its original packaging.

Return procedure for CY7S1061GE30-10BVM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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