Infineon Technologies CY8C20110-LDX2IT

Overview

CY8C20110-LDX2IT from Infineon Technologies is a capacitive-sensing PSoC™ 1 programmable system-on-chip featuring an 8-bit M8C core, integrated CapSense® charge-transfer sensing engine, 2 kB flash, 256 B SRAM, and 10 I/O pins in a 16-pin QFN package. It supports up to 10 self-capacitance or mutual-capacitance sensors with <1 pF resolution and operates from 2.4–5.25 V. It is used in touch-button and slider interfaces for industrial HMI panels and consumer appliance control surfaces.

For engineers reviewing the CY8C20110-LDX2IT datasheet, CY8C20110-LDX2IT pinout, CY8C20110-LDX2IT application, or CY8C20110-LDX2IT equivalent, key selection criteria include CapSense® sensor count and resolution, low-voltage operation range, embedded flash reprogrammability, and QFN-16 thermal performance in space-constrained designs.

Technical Context

The CY8C20110-LDX2IT implements a dedicated hardware CapSense® block that performs auto-calibrated charge-transfer measurements without CPU intervention, enabling ultra-low-power wake-on-touch operation with typical current draw of 15 µA in sleep mode. Its M8C core runs at up to 24 MHz and supports interrupt-driven sensor polling and basic firmware logic.

It integrates a 10-bit SAR ADC (shared with CapSense®), internal voltage reference, POR/BOR circuits, and configurable I/O with Schmitt-trigger inputs and programmable drive strength-enabling direct connection to overlay materials without external RC networks.

Key Specifications

Pinout & Package

Package: 16-pin QFN (3 mm × 3 mm, 0.5 mm pitch), thermally optimized with exposed die paddle for PCB heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar capacitive-sensing microcontroller applications.

Compared with CY8C20110-LDX2IT, the CY8C20234 offers expanded CapSense® scalability and memory, while the STM32F070F6P6 trades dedicated sensing hardware for broader MCU flexibility-making the CY8C20110 optimal for cost-sensitive, single-function touch nodes where minimal BOM and fast time-to-market are critical.

Availability

CY8C20110-LDX2IT is available at Aetrix Electronics and suitable for industrial HMI panels, home appliance controls, medical device interfaces, and smart building keypads requiring stable component supply and long-term manufacturability.

Supply support for CY8C20110-LDX2IT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and embedded controllers, with global R&D and manufacturing infrastructure.

The CY8C20110 belongs to the PSoC™ 1 CapSense® family, designed specifically for low-cost, low-power capacitive touch interfaces in industrial and consumer applications where integration, ease of tuning, and robustness against moisture and ESD are essential.

FAQ

What is the maximum overlay thickness supported by CY8C20110-LDX2IT?

The CY8C20110-LDX2IT supports glass overlays up to 4 mm thick and plastic overlays up to 6 mm thick when configured with default CapSense® parameters. Sensitivity can be further extended using higher IDAC ranges and increased scan cycles, validated per AN2295 and CapSense® Design Guide v5.0.

Does CY8C20110-LDX2IT require an external crystal?

No. The CY8C20110-LDX2IT operates from its internal IMO (Internal Main Oscillator) at 24 MHz with ±2% accuracy, sufficient for most CapSense® applications. An external crystal (1–24 MHz) is optional and only required for applications demanding tighter timing accuracy, such as synchronized multi-device touch systems.

Can CY8C20110-LDX2IT drive LEDs directly?

Yes. All 10 I/O pins support up to 25 mA sink/source current with programmable drive strength. The device can directly drive common-anode or common-cathode LEDs without external transistors, provided total package current remains below 100 mA and thermal limits are observed per QFN-16 derating curves.

Is there a recommended layout practice for CapSense® traces?

CapSense® traces must be routed with 50 Ω controlled impedance, shielded by grounded guard traces on adjacent layers, and kept shorter than 10 cm. Avoid routing near noisy signals (clocks, switching regulators); use solid ground planes beneath sensor traces and place decoupling capacitors within 3 mm of VDD/GND pins per Cypress Application Note AN2295.