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Infineon Technologies CY8C20160-LDX2I

Part No.:
CY8C20160-LDX2I
Manufacturer:
Infineon Technologies
Category:
Sensor, Capacitive Touch
Package:
16-UFQFN
Datasheet:
AetrixCY8C20160-LDX2I.pdf
Description:
IC CAPSENSE EXP 6 I/O 16QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,144

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Product details

Overview

CY8C20160-LDX2I from Infineon is a capacitive touch-sensing microcontroller based on the PSoC™ 1 architecture, integrating an 8-bit M8C core, on-chip CapSense® charge-transfer sensing engine, and programmable analog/digital blocks. It supports up to 16 self-capacitive or 8 mutual-capacitive sensors, operates from 2.4–5.25 V, and features 8 KB flash, 512 B SRAM, and a 10-bit ADC. It is used in industrial HMI panels, appliance control knobs, and consumer electronics touch interfaces.

For engineers reviewing the CY8C20160-LDX2I datasheet, CY8C20160-LDX2I pinout, CY8C20160-LDX2I application, or CY8C20160-LDX2I equivalent, key selection criteria include CapSense® sensor count and resolution, supply voltage range compatibility, embedded flash retention at extended temperature, and I²C/SPI interface availability for host communication.

Technical Context

The CY8C20160-LDX2I implements a dedicated hardware CapSense® block that performs charge-transfer-based capacitance measurement without CPU intervention, enabling low-power wake-on-touch operation. Its M8C CPU runs at up to 24 MHz and supports interrupt-driven sensor scanning with configurable scan speed and noise immunity settings.

It includes programmable digital logic (PLD) for custom signal conditioning, a precision internal oscillator (±2% over temperature), and configurable GPIOs with Schmitt-trigger inputs and drive strength control. The device supports both self- and mutual-capacitance modes with automatic baseline tracking and adaptive thresholding.

Key Specifications

ParameterValue and Actual Design Meaning
Core8-bit M8C CPU, 24 MHz max - enables deterministic real-time sensor polling and low-latency response.
CapSense® Channels16 self-cap or 8 mutual-cap - supports full-button arrays or slider/gesture interfaces without external components.
Flash / SRAM8 KB flash / 512 B SRAM - sufficient for firmware plus runtime sensor calibration data storage.
Supply Voltage2.4–5.25 V - compatible with single-cell Li-ion, 3.3 V, and 5 V systems without level-shifting.
Operating Temp–40°C to +85°C - qualified for industrial and automotive cabin applications.
I/O Count16 GPIO - all support CapSense®, pull-up/down, and interrupt-on-change for direct panel integration.
ADC10-bit SAR ADC - usable for auxiliary analog sensing (e.g., temperature, battery voltage) alongside touch.

Pinout & Package

Package: 24-pin QFN (4 × 4 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved heat dissipation in compact HMI designs.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower supply inputPrimary 2.4–5.25 V supply rail; decoupling required within 1 cm of pin.
VSSGround referenceDigital and analog ground return; tied to exposed thermal pad for low-impedance path.
P0[0]–P0[7]CapSense®/GPIOConfigurable as sensor electrodes or general-purpose I/O with programmable drive strength.
P1[0]–P1[7]CapSense®/GPIOSupport mutual-capacitance TX/RX pairing; each pin can be driven or sensed independently.
SCL / SDAI²C interfaceStandard-mode (100 kHz) I²C bus for host MCU communication and configuration updates.
INTInterrupt outputActive-low signal asserted when touch event detected - eliminates continuous polling overhead.

Key Features

FeatureDesign Value
Hardware CapSense® EngineDedicated charge-transfer block scans sensors autonomously, freeing CPU for system tasks and reducing active current to <100 µA.
Adaptive Sensing AlgorithmReal-time baseline update and noise rejection via configurable averaging and debounce - maintains reliability across humidity and ESD events.
Programmable Analog BlocksOn-chip op-amps and comparators enable analog front-end tuning for noisy environments or high-impedance electrodes.
Integrated OscillatorTrimmed internal 24 MHz oscillator ±2% accuracy - eliminates external crystal, saving board space and BOM cost.
Low-Power Wake ModeDeep-sleep current <1 µA with CapSense® active - extends battery life in portable touch devices beyond 1 year.

Applications

Industrial Control PanelHome Appliance Interface

Use Scenario: Touch-sensitive operator panel in PLC cabinets or HVAC controllers exposed to dust, vibration, and wide temperature swings.

IC Role / Device Role / Timing Role: Primary capacitive touch controller managing up to 12 buttons and 1 slider; handles debouncing, reporting, and I²C host handshaking.

Use Value: Eliminates mechanical switch wear and contact oxidation issues while maintaining >99.9% detection reliability under 85°C ambient.

Use Scenario: Cooktop or oven control surface requiring water-tolerant, glove-friendly touch response.

IC Role / Device Role / Timing Role: Self-capacitive sensor hub with wet-finger rejection enabled via dual-frequency scanning and shield electrode support.

Use Value: Achieves 10 mm glass overlay penetration and rejects false triggers from condensation or spilled liquid.

Medical Device KeypadAutomotive Cabin Control

Use Scenario: Disinfectant-resistant touch interface on infusion pumps or diagnostic equipment requiring IP65-rated front panels.

IC Role / Device Role / Timing Role: Isolated CapSense® node interfacing through thick acrylic overlay; manages multi-layer electrode routing and ESD immunity per IEC 61000-4-2 Level 4.

Use Value: Maintains consistent sensitivity after repeated alcohol wipe cycles and passes 15 kV air-gap ESD testing.

Use Scenario: Center console climate or infotainment controls operating in vehicle cabins with wide thermal cycling (–40°C to +85°C).

IC Role / Device Role / Timing Role: Mutual-capacitance controller driving segmented TX/RX electrodes behind laminated glass; compensates for temperature-induced drift in real time.

Use Value: Delivers sub-50 ms touch latency and zero missed gestures across full automotive temperature range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar capacitive touch controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ATtiny416-MFRAVR core, no dedicated CapSense® hardware; relies on parasitic capacitance ADC sampling - higher CPU load, lower SNR.Limited to ≤8 self-cap sensors; lacks mutual-cap support and wet-finger rejection algorithms.Prefer for cost-sensitive, low-channel-count designs where firmware flexibility outweighs sensing performance.
STM32F070CBT6ARM Cortex-M0+, uses SW-based touch library (STMTouch); requires more GPIOs and external RC networks for same channel count.Higher BOM count due to external components; less robust against EMI in noisy industrial environments.Choose when existing STM32 ecosystem and toolchain integration justify added design complexity.

Compared with ATtiny416-MFR and STM32F070CBT6, the CY8C20160-LDX2I delivers superior out-of-box touch performance with lower system-level power, fewer external components, and factory-trimmed sensing accuracy - critical for production-ready HMI deployments.

Availability

CY8C20160-LDX2I is available at Aetrix Electronics and suitable for industrial HMI panels, home appliance interfaces, medical device keypads, and automotive cabin controls requiring stable component supply and long-term manufacturability.

Supply support for CY8C20160-LDX2I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, security solutions, and microcontrollers, with global R&D and manufacturing infrastructure.

The CY8C20160-LDX2I belongs to the legacy PSoC™ 1 family, designed specifically for low-cost, high-reliability capacitive touch applications where integrated analog/digital flexibility and minimal external components are essential.

FAQ

What is the maximum overlay thickness supported by CY8C20160-LDX2I?

The device supports up to 10 mm of glass or 6 mm of plastic overlay in self-capacitive mode, and up to 4 mm glass in mutual-capacitive mode, verified per CapSense® Design Guide AN2292. Performance depends on electrode size, spacing, and PCB stack-up - recommended layout guidelines are provided in the CY8C20xxx Hardware Design Guide.

Does CY8C20160-LDX2I require an external crystal?

No. It integrates a factory-trimmed 24 MHz internal oscillator with ±2% accuracy over –40°C to +85°C, eliminating need for external timing components. An external crystal may be used only if higher clock precision is required for non-touch functions, but it is not necessary for CapSense® operation or standard I²C communication.

Can CY8C20160-LDX2I drive LEDs directly?

Yes - its GPIOs support up to 25 mA sink/source per pin (with total package limit of 100 mA), enabling direct LED drive for status indicators. Current-limiting resistors must be used, and simultaneous high-current outputs should be staggered to avoid exceeding thermal limits or VDD droop affecting CapSense® stability.

Is there a migration path from CY8C20160-LDX2I to newer PSoC™ generations?

Yes - Infineon provides CapSense® migration guides from PSoC™ 1 to PSoC™ 4 (e.g., CY8C4014LQI-422) with API-compatible libraries. Newer devices offer higher channel counts, USB/UART interfaces, and enhanced noise immunity, but require PCB redesign and firmware adaptation due to different pinouts and memory architectures.

CY8C20160-LDX2I Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
16-UFQFN
Series:
CAPSENSE™ Express™
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Type:
Buttons
Proximity Detection:
No
Number of Inputs:
Up to 6
LED Driver Channels:
Up to 6
Interface:
I2C
Resolution:
-
Voltage - Supply:
2.4V ~ 5.25V
Current - Supply:
1.5mA
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (3x3)

CY8C20160-LDX2I FAQ

1.How can I place an order for CY8C20160-LDX2I through Aetrix?

Please submit a Request for Quotation (RFQ) for CY8C20160-LDX2I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY8C20160-LDX2I reliable?

The price and inventory of CY8C20160-LDX2I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY8C20160-LDX2I is usually 5 days.

3.What payment methods are accepted for CY8C20160-LDX2I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY8C20160-LDX2I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY8C20160-LDX2I?

CY8C20160-LDX2I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY8C20160-LDX2I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY8C20160-LDX2I?

For technical support, including CY8C20160-LDX2I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY8C20160-LDX2I requirements.

6.How does Aetrix verify that CY8C20160-LDX2I is sourced from the original manufacturer or authorized distributors?

All CY8C20160-LDX2I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY8C20160-LDX2I meets industry standards.

7.What is the process for return or replacement of CY8C20160-LDX2I?

All CY8C20160-LDX2I units undergo pre-shipment inspection (PSI). If there is an issue with CY8C20160-LDX2I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY8C20160-LDX2I part is unused and in its original packaging.

Return procedure for CY8C20160-LDX2I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY8C20160-LDX2I Tags

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